Download G30 Hardware User Guide

G30 Hardware User Guide
1VV0300919 Rev.0 – 2011-05-04
•
•
5.7.
Keep the RF PAD area cleared from GND (internal layers also), at least 0.45mm
below the G30.
Cover all Pads area with inner GND Layer below the 0.45mm routing clearance.
Soldering ReRe- flow
45B
G30 LGA recommended soldering re-flow process is given in thefollowing table and picture.
Classification of regular Pb-Free Assembly Re-flow Profile
Preheat and Soak
Temperature minimum (Tsmin)
150°C
Temperature maximum (Tsmax)
200°C
Time (Tsmin to Tsmax) (ts)
60-120 seconds
Average ramp-up rate
(Tsmax to Tp)
3°C/second maximum
Liquidous temperature (TL)
217°C
Time at liquidous (t)
60-150 seconds
Peak package body temperature (Tp)
245 + 0°C
Time (tp) within 5°C of the specified classification
temperature (TC)
30 seconds
Average ramp-down rate (Tp to Tsmax)
6°C/second maximum
Time 25°C to peak temperature
8 minutes maximum
Number of re-flows
1
Table 5-3: Soldering Re-flow Process
Figure 5-9: Soldering Re-flow Process
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 102 of 105