Download Blackfin TCM-BF537 Hardware User Manual

Hardware User Manual
TCM-BF537 V1.1
Including BGA and Border Pad Versions
PRELIMINARY
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Contact
Bluetechnix Mechatronische Systeme GmbH
Waidhausenstr. 3/19
A-1140 Vienna
AUSTRIA/EUROPE
[email protected]
http://www.bluetechnix.com
Document No.: 100-1225-1.1
Version 5
Date: 2007-04-17
Blackfin TCM-BF537 Hardware User Manual
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Table of Contents
1
2
Introduction ......................................................................................................................... 1
1.1
Overview....................................................................................................................... 1
1.2
Versions ........................................................................................................................ 2
1.3
Benefits ......................................................................................................................... 2
1.4
Typical Applications..................................................................................................... 2
Specification ........................................................................................................................ 3
2.1
Functional Specification ............................................................................................... 3
2.2
Boot Mode .................................................................................................................... 3
2.3
Memory MAP ............................................................................................................... 4
2.4
Electrical Specification ................................................................................................. 4
2.4.1
Supply Voltage....................................................................................................... 4
2.4.2
Supply Voltage Ripple ........................................................................................... 4
2.4.3
Processor Oscillator Frequency.............................................................................. 4
2.4.4
Real Time Clock Crystal ........................................................................................ 5
2.4.5
Supply Current ....................................................................................................... 5
2.5
3
4
5
Environmental Specification......................................................................................... 5
2.5.1
Temperature ........................................................................................................... 5
2.5.2
Humidity................................................................................................................. 5
TCM-BF537 (Connector Version) ...................................................................................... 6
3.1
Mechanical Outline....................................................................................................... 6
3.2
Connector Footprint of Baseboard................................................................................ 8
3.3
Schematic Symbol of Connector Version..................................................................... 9
3.4
Connectors PIN Assignment....................................................................................... 10
3.4.1
Connector P1 – (1-60) .......................................................................................... 10
3.4.2
Connector P2 – (61-120) ...................................................................................... 11
TCM-BF537BP (Boarder Pad Version) ............................................................................ 12
4.1
Mechanical Outline..................................................................................................... 12
4.2
Footprint of Boarder Pad Baseboard........................................................................... 13
4.3
Schematic Symbol of Boarder Pad Version................................................................ 14
4.4
Boarder Pad Pin Assignment ...................................................................................... 15
TCM-BF537BGA (Ball Grid Array version) .................................................................... 16
5.1
Mechanical Outline..................................................................................................... 16
5.2
BGA PAD Numbering................................................................................................ 17
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5.3
Footprint of BGA Baseboard ...................................................................................... 18
5.4
Schematic Symbol of BGA Version ........................................................................... 19
5.5
BGA Pin Assignment.................................................................................................. 20
5.6
Flash Memory Extension PINS .................................................................................. 21
6
5.6.1
PINS FA20 and FA21 .......................................................................................... 21
5.6.2
PINS PF4 and PF5................................................................................................ 21
5.6.3
WP_FLASH ......................................................................................................... 22
Application Example Schematics...................................................................................... 23
6.1
Schematic Example for Connecting a Physical Ethernet Chip................................... 23
6.2
Schematic Example for Connecting a USB 2.0 Chip ................................................. 24
7
Software Support ............................................................................................................... 26
7.1
BLACKSheep ............................................................................................................. 26
7.2
uClinux........................................................................................................................ 26
8
Known Bugs ...................................................................................................................... 27
9
Product Changes ................................................................................................................ 28
10
Document Revision History ........................................................................................... 29
A List of Figures and Tables ................................................................................................. 30
Blackfin TCM-BF537 Hardware User Manual
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Edition 2007-02
© Bluetechnix Mechatronische Systeme GmbH 2007
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as
a guarantee of characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of noninfringement, regarding circuits, descriptions and charts stated herein.
Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or
in any communication with you. Bluetechnix specifically disclaims any implied warranty of
merchantability or fitness for a particular purpose.
Bluetechnix takes no liability for any damages and errors causing of the usage of this board.
The user of this board is responsible by himself for the functionality of his application. He is
allowed to use the board only if he has the qualification. More information is found in the
General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please
contact Bluetechnix (http://www.bluetechnix.com).
Warnings
Due to technical requirements components may contain dangerous substances.
The Core Boards and Development
systems contain ESD (electrostatic
discharge) sensitive devices. Electrostatic charges readily accumulate on
the human body and equipment and
can discharge without detection.
Permanent damage may occur on
devices subjected to high-energy
discharges. Proper ESD precautions
are
recommended
to
avoid
performance degradation or loss of
functionality. Unused core boards
and development boards should be
stored in the protective shipping
package.
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BLACKFIN Products
Core Modules:
CM-BF533:
Blackfin Processor Module powered by Analog Devices single core
ADSP-BF533 processor; up to 600MHz, 32MB RAM, 2MB Flash,
120 pin expansion connector and a size of 36.5x31.5mm
CM-BF537E:
Blackfin Processor Module powered by Analog Devices single core
ADSP-BF537 processor; up to 600MHz, 32MB RAM, 4MB Flash,
integrated TP10/100 Ethernet physical transceiver, 120 pin expansion
connector and a size of 36.5x31.5mm
CM-BF537U:
Blackfin Processor Module powered by Analog Devices single core
ADSP-BF537 processor; up to 600MHz, 32MB RAM, 4MB Flash,
integrated USB 2.0 Device, 120 pin expansion connector and a size
of 36.5x31.5mm
TCM-BF537:
Blackfin Processor Module powered by Analog Devices single core
ADSP-BF537 processor; up to 500MHz, 32MB RAM, 8MB Flash,
28x28mm, 120 pin expansion connector, Ball Grid Array or Border
Pads for reflow soldering, industrial temperature range -40°C to
+85°C.
CM-BF561:
Blackfin Processor Module powered by Analog Devices dual core
ADSP-BF561 processor; up to 2x 600MHz, 64MB RAM, 8MB
Flash, 120 pin expansion connector and a size of 36.5x31.5mm
CM-BF527:
From Q3 '07 a new Blackfin Processor Module powered by Analog
Devices single core ADSP-BF527 processor will be available; key
features are USB OTG 2.0 and Ethernet. 2x120pin expansion
connectors are backwards compatible to other Core Modules.
CM-BF548:
From Q3 '07 a new Blackfin Processor Module powered by Analog
Devices single core ADSP-BF548 processor will be available; key
features are 64MB DDR SD-RAM 2x100pin expansion connectors.
Development Boards:
EVAL-BF5xx:
Low cost Blackfin processor Evaluation Board with one socket for
any Bluetechnix Blackfin Core Module. Additional periphery is
available, such as a SD-Card.
DEV-BF5xxDA-Lite: Get ready to program and debug Bluetechnix Core Modules with this
tiny development platform including a USB Based Debug Agent. The
DEV-BF5xxDA-Lite is a low cost starter development system
including VDSP++ Evaluation Software License.
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DEV-BF5xx-FPGA:
Backfin Development Board with two sockets for any combination of
Blackfin Core Modules. Additional periphery is available, such as
SD-Card, Ethernet, USB host, multi-port JTAG including a USB
based Debug Agent, connector for a LCD-TFT Display and
connector for a digital camera system. A large on-board SPARTAN-3
FPGA and Soft IPs make this board the most flexible Blackfin
development platforms ever developed.
Available Q2 2007
EXT-Boards:
The following Extender Boards are available: EXT-BF5xx-Audio,
EXT-BF5xx-Video, EXT-BF5xx-Camera, EXT-BF5xx-Exp, *EXTBF5xx-LVDS, *EXT-BF5xx-ETH-USB, *EXT-BF5xx-AD/DA.
Additional boards based on customer request
*Available Q2 2007
Software Support:
BLACKSheep:
The BLACKSheep VDK is a multithreaded framework for the
Analog Devices Blackfin processor family that includes driver
support for a variety of hardware extensions. It is based on the realtime VDK kernel included within the VDSP++ development
environment.
LabVIEW:
LabVIEW embedded support for the CM-BF537E, CM-BF537U and
TCM-BF537 Core Modules based on the BLACKSheep VDK driver
Framework.
uClinux:
All the Core Modules are supported by uClinux. The required boot
loader and uClinux can be downloaded at http://blackfin.uClinux.org.
BLACKFIN Design Service
Based on over three years Blackfin experience Bluetechnix offers development assistance as
well as custom design services and software development.
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1 Introduction
The TCM-BF537 is a chip size Core Module designed for industrial temperature range and
volume production. It combines power supply, RAM and FLASH into a module as small as a
chip package. Different connector options (BGA, Boarder Pads (BP) and Connectors) offers
solution for all possible requirements.
1.1 Overview
The Core Module TCM-BF537 consists of the following components shown in Figure 1-1.
Figure 1-1: Main Components of the Core Module
ƒ
Analog Devices Blackfin Processor BF537
o ADSP-BF537BBCZ-5A, 500MHz (-40°-85°C)
ƒ
32 MB SDRAM
o SDRAM Clock up to 133MHz
o MT48LC16M16A2BG-7 (16Mx16, 256Mbit at 3.3 V)
ƒ
8 MB of Addressable Flash
o PF48F2000P0ZBQ0S (32Mx16, at 3.3V; all 8MByte addressable, bottom
boot)
o Additional flash memory upon request: It can be connected through the
expansion board as parallel flash using asynchronous chip select lines or as a
SPI flash.
ƒ
Low Voltage Reset Circuit
o Resets module if power supply goes below 2.93V.
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ƒ
Dynamic Core Voltage Control
o Allows to adjust core voltage by setting software registers at the Blackfin
processor
o Core voltage range: 0.8 – 1.32V
ƒ
Peripherals available on all Core Module versions
o
o
o
o
o
o
o
o
o
o
ƒ
Power Supply
SPORT 0
JTAG
UART0/Uart1
CAN
TWI (I2C compatible)
SPI (Serial Port Interface)
PPI (Parallel Port Interface)
Boot Mode Pins
GPIO’s
Peripherals available on the Connector and BGA version only.
o
o
o
o
Data Bus
Address Bus
Further GPIO’s
Memory Control Signals
1.2 Versions
TCM-BF537: Connector Version 2x60 connector pins
TCM-BF537BGA: 169 BGAs 1.5 mm pitch for volume production
TCM-BF537Boarder: 76 Boarder Pads, no Data- and Address bus on boarder pads
1.3 Benefits
ƒ
ƒ
ƒ
ƒ
The TCM-BF537 is very compact and measures only 28x28mm (27.4x27.4 mm in
Rev. 1.0)
Reduces development costs, faster time to market.
Allows integration on a two layer baseboard.
Very cost effective for small and medium volumes
1.4 Typical Applications
ƒ
ƒ
ƒ
Generic high performance signal processor module
Industrial Automation
Robotics
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2 Specification
2.1 Functional Specification
Mem. Control, Boot Mode, JTAG, Ethernet
16 Bit Data Bus
Dynamic
Core Voltage
Control
BF537
@
500MHz
32 Mbyte
SDRam
256Mx16
8 Mbyte
Flash
Low Voltage
Reset
Clock
Clock-out
20 Bit Address Bus
PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO
Figure 2-1: Detailed Block Diagram
Figure 2-1 shows a detailed block diagram of the TCM-BF537 module. Beside the SDRAM
and a few other control pins, the TCM-BF537 has most pins of the Blackfin processor at its
two 60 pin connectors, or its BGA, or its Boarder Pads.
Dynamic voltage control allows reducing power consumption to a minimum adjusting the
core voltage and the clock frequency dynamically in accordance to the required processing
power.
A low voltage reset circuit guarantees a power on reset and resets the system when the input
voltage drops below 2.93V for at least 140ms.
2.2 Boot Mode
By default the boot mode = 000 (BMODE2 = Low, BMODE1 = Low, BMODE0=Low). All
BMODE pins have on board pull down resistors.
Boot-settings for CM-BF534 and CM-BF537
Switch Settings
Bootmode
BMODE2,BMODE1,BMODE0
000
0
Blackfin TCM-BF537 Hardware User Manual
Description
Execute from16Bit ext. mem. Bypass ROM
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001
010
011
100
101
110
111
1
2
3
4
5
6
7
Boot from 8Bit or 16Bit EEPROM/Flash
Reserved
Boot from serial SPI Memory
Boot from SPI Host (slave mode)
Boot from serial TWI memory
Boot from TWI host
Boot from UART host (slave mode)
Table 2-1: Bootmode CM-BF534/537
Connect BMODE0 to Vcc and leave BMODE1, BMODE2 pins open for Boot Mode 001
equals to 8 or 16 bit PROM/FLASH boot mode. This is the default boot mode of the
Blacksheep software.
2.3 Memory MAP
Memory Type
FLASH
PF4 Flag Low
PF5 Flag Low
FLASH
PF4 Flag High
PF5Flag Low
FLASH
PF4 Flag Low
PF5 Flag High
FLASH
PF4 Flag High
PF5 Flag High
SD-RAM
Start Address
0x20000000
End Address
0x200FFFFF
Size
2MB
Comment
¼ of 8MB Flash,
PF48F2000P0ZBQ0S
0x20000000
0x200FFFFF
2MB
¼ of 8MB Flash,
PF48F2000P0ZBQ0S
0x20000000
0x200FFFFF
2MB
¼ of 8MB Flash,
PF48F2000P0ZBQ0S
0x20000000
0x200FFFFF
2MB
¼ of 8MB Flash,
PF48F2000P0ZBQ0S
0x00000000
0x01FFFFFF
32MB
16Bit Bus, Micron
MT48LC16M16A2FG
Table 2-2: Memory Map
2.4 Electrical Specification
2.4.1 Supply Voltage
ƒ
3.3V DC +/-10%
2.4.2 Supply Voltage Ripple
ƒ
100mV peak to peak 0-20 MHz
2.4.3 Processor Oscillator Frequency
ƒ
25MHz
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2.4.4 Real Time Clock Crystal
ƒ
32.768kHz
2.4.5 Supply Current
ƒ
ƒ
Maximum current: 200mA at 3.3V
Typical operating conditions at 25°C environment temperature:
o Processor running at 500MHz, Core Voltage 1.2V, SDRAM 50% bandwidth
utilization at 125MHz; 150mA at 3.3V
o Processor running at 250MHz, Core Voltage 0.85V SDRAM 50% bandwidth
utilization at 83,3MHz; ; Ethernet Idle: 85mA at 3.3V
o Processor running at 600MHz, Core Voltage 1.2V, SDRAM 50% bandwidth
utilization at 120MHz, 160mA at 3.3V
2.5 Environmental Specification
2.5.1 Temperature
ƒ
Operating at full 500MHz:: -40 to + 85° C
2.5.2 Humidity
Operating: 10% to 90% (non condensing)
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3 TCM-BF537 (Connector Version)
3.1 Mechanical Outline
Figure 3-1 shows the top view of the Core Module (All dimensions are given in millimeters!)
Figure 3-1: Mechanical Outline (TOP VIEW)
Figure 3-2: Mechanical Outline (BOTTOM VIEW)
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Figure 3-3 shows a side view of the Core Module with mounted connectors.
Figure 3-3: Side View with Connectors mounted
The total minimum mounting height including receptacle at the motherboard is 5.8mm.
The mechanical outline in Figure 3-4 shows the footprint for the connectors on your base
board (TOP VIEW).
Figure 3-4: Connector Footprint for Base Board (TOP VIEW)
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3.2 Connector Footprint of Baseboard
For the Connector version (2x Hirose 0.6mm pitch) the footprint for the base board looks like
shown in Figure 3-4.
For the baseboard the following connectors have to be used.
Part Baseboard
P1,P2
Manufacturer
Hirose
Manufacturer Part No.
FX8-60S-SV
Table 3-1: Baseboard connector types
The Connectors on the TCM-BF537 are of the following type:
Part
P1,P2
Manufacturer
Hirose 3mm height
Manufacturer Part No.
FX8-60P-SV
Table 3-2: Core Module connector types
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3.3 Schematic Symbol of Connector Version
SPORT0
CAN
TWI
Addr.
Bus
GPIO
Power
Ethernet/
GPIO
PPI/
SPORT1
Control
Signals
UARTs
SPI
Data
Bus
JTAG
Connector
Symbol
Figure 3-5: Schematics Symbol of Connector Version of the TCM-BF537
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3.4 Connectors PIN Assignment
3.4.1 Connector P1 – (1-60)
Pin
No.
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
Signal
RSCLK0/TACLK2
TSCLK0/TACLK1
PH15 / MIICRS
PH7 / COL
Vin 3.3V
PG0/PPI1D0
PG4/PPI1D4
PG8/PPI1D8/DR1SEC
PG12/PPI1D12/RE1PRI
PPI1SY3/PF7/TMR2
MDC
PF1/DMAR1/TACI1/Rx0
PF13/SPI_SCK
GND
TDI
nEMU
TDO
MDIO
PF12/SPI_MISO
PF14/SPI_SS
PPI1Clk/PF15/TMRCLK
PG15/PPI1D15/DT1PRI
PG11/PPI1D11/RFS1
PG7/PPI1D7
PG3/PPI1D3
GND
PH5/MIITxCLK
PF10/SPI_SSEL1
DT0SEC/CANTX/SPI_SS
EL7
DR0SEC/TACI0/CANRX
Signal
type
I/O
I/O
I/O
I/O
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PWR
I
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PWR
I/O
I
O
Pin
No.
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
Signal
Signal
type
DR0PRI/ TACLK4
I
DT0PRI/SPI_SSEL2
O
SDA
I/O
PH6/MIIPHYINT
I/O
Vin 3.3V
PWR
PG2/PPI1D2
I/O
PG6/PPI1D6
I/O
PG10/PPI1D10/RSCLK1 I/O
PG14/PPI1D14/TFS1
I/O
PPI1SY1/PF8/TMR0
I/O
PF3/Rx1/TMR6/TACI6
I/O
PF11/SPI_MOSI
I/O
BMODE0
I
TCK
I
nTRST
I
TMS
I
BMODE2
I
BMODE1
I
PF0/DMAR0/Tx0
I/O
PF2/Tx1/TMR7
I/O
PPI1Sy2/PF8/TMR1
I/O
PG13/PPI1D13/TSCLK1 I/O
PG9/PPI1D9/TD1SEC
I/O
PG5/PPI1D5
I/O
PG1/PPI1D1
I/O
GND
PWR
PF6/TMR3/SPI_SSEL4
I/O
SCL
I/O
TFS0
I/O
I
60
RFS0/TACLK3
I/O
Table 3-3: Connector P1 pin assignment
NOTE: The processor pins PF4 and PF5 are used for flash addressing on the Core Module.
They are not accessible at the connectors.
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3.4.2 Connector P2 – (61-120)
Pin No.
Signal
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
A1
A5
A9
A13
A17
nABE1 / SDQM1
PH3/ETxD3
PH10/ERxD2
PH13/ERxCLK
GND
nAWE
D0
D4
D8
D12
D15
D11
D7
D3
nReset
nARE
VDD-RTC
PH12/ERxDV
PH9/ERxD1
PH2/ETxD2
nABE0 / SDQM0
A16
A12
A8
A4
Signal
type
O
O
O
O
O
O
I/O
I/O
I/O
PWR
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
O
PWR
I/O
I/O
I/O
O
O
O
O
O
Pin No.
Signal
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
A3
A7
A11
A15
A19
PH1/ETxD1
PH8/ERxD0
ADRY
CLKBUF
nAMS3
CLKOUT (SCLK)
D2
D6
D10
D14
D13
D9
D5
D1
nAOE
nAMS2
PH14/ERXER
PH11/ERxD3
PH4/ETxEN
PH0/ETxD0
A18
A14
A10
A6
A2
Signal
type
O
O
O
O
O
I/O
I/O
I
O
O
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
I/O
PWR
I/O
I/O
O
O
O
O
O
Table 3-4: Connector P2 pin assignment
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4 TCM-BF537BP (Boarder Pad Version)
4.1 Mechanical Outline
Figure 4-1 shows the Top view of the Core Module (All dimensions are given in millimeters!)
Figure 4-1: Mechanical Outline (TOP VIEW)
Figure 4-2 shows a side view of the Core Module with boarder pads.
Figure 4-2: Side View of the Boarder Pads
The total minimum mounting height of the Boarder Pad version is only 3.1mm!
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4.2 Footprint of Boarder Pad Baseboard
Figure 4-3 shows the pin assignment of the Boarder Pad Version.
Numbering of PINs is clockwise ascending
Figure 4-3: Boarder Pad Footprint for the Base Board (TOP VIEW)
Note: Conducting paths and Vias within the footprint must be solder resistant. Do not place
any component within the footprint either.
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4.3 Schematic Symbol of Boarder Pad Version
U?
6
5
8
7
12
11
14
13
76
4
3
33
68
32
66
65
28
29
49
67
42
43
44
45
46
47
50
51
52
53
54
55
56
57
58
59
39
40
41
38
2
30
31
37
27
26
34
35
36
18
19
16
17
20
21
22
23
24
25
RSCLK0 / TACLK2
RFS0 / TACLK3
DR0PRI / TACLK4
DR0SEC / TACI0 / CAN_Rx
TSCLK0 / TACLK1
TFS0 / SPI_SSEL3
DT0PRI / SPI_SSEL2
DT0SEC / SPI_SSEL7 / CAN_Tx
PH15 / MIICRS
SCL
SDA
PF10 / SPI_SSEL1
PH7 / COL
PF6 / TMR3 / SPI_SSEL4
PH6 / MIIPHYINT
PH5 / MIITxCLK
Vin 3V3
GND
Vin 3V3
TCM-BF537
GND
Borderpads
PG0 / PPI1D0
PG1 / PPI1D1
ETxD0 / PH0
PG2 / PPI1D2
ETxD1 / PH1
PG3 / PPI1D3
ETxD2 / PH2
PG4 / PPI1D4
ETxD3 / PH3
PG5 / PPI1D5
ETxEN / PH4
PG6 / PPI1D6
ERxD0 / PH8
PG7 / PPI1D7
ERxD1 / PH9
PG8 / PPI1D8 / DR1SEC
ERxD2 / PH10
PG9 / PPI1D9 / DT1SEC
ERxD3 / PH11
PG10 / PPI1D10 / RSCLK1
PG11 / PPI1D11 / RFS1
ERxDV / PH12
PG12 / PPI1D12 / DR1PRI
ERxCLK / PH13
PG13 / PPI1D13 / TSCLK1
ERXER / PH14
PG14 / PPI1D14 / TFS1
CLKBUF
PG15 / PPI1D15 / DT1PRI
VDD-RTC
PPI1Sy3 / PF7 / TMR2
PPI1Sy2 / PF8 / TMR1
PPI1Sy1 / PF9 / TMR0
PPI1Clk / PF15 / TMRCLK
MDC
PF2 / Tx1 / TMR7
PF3 / Rx1 / TMR6 / TACI6
PF14 / SPI_SS
RESET
PF1 / DMAR1 / TACI1 / Rx0
PF0 / DMAR0 / Tx0
PF11 / SPI_MOSI
PF12 / SPI_MISO
PF13 / SPI_SCK
Bmode1
Bmode0
MDIO
60
61
62
63
64
69
70
71
72
73
74
75
1
9
15
Bmode2
TCK
TDO
TDI
TMS
TRST
EMU
T-CM-BF537
Figure 4-4: Schematics of the Boarder Pad Version of the TCM-BF537BP
Blackfin TCM-BF537 Hardware User Manual
Page 14
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Maximum Power at Minimum Size
4.4 Boarder Pad Pin Assignment
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Signal
CLKBUF
MDC
SDA
SCL
RFS0/TACLK3
RSCLK0/TACLK2
DR0SEC/TACI0/CAN_Rx
DR0PRI/ TACLK4
VDD-RTC
not available
TFS0/SPI_SSEL3
TSCLK0/TACLK1
DT0SEC/SPI_SSEL7/CAN
_Tx
DT0PRI/SPI_SSEL2
nReset
MDIO
BMODE2
BMODE1
BMODE0
TCK
TDO
TDI
TMS
TRST
EMU
PF0/DMAR0/Tx0
PF1/DMAR1/TACI1/Rx0
Vin 3.3V
GND
PF2/Tx1/TMR7
PF3/Rx1/TMR6/TACI6
PF6/TMR3/SPI_SSEL4
PF10/SPI_SSEL1
PF11/SPI_MOSI
PF12/SPI_MISO
PF13/SPI_SCK
PF14/SPI_SS
PPI1Clk/PF15/TMRCLK
Signal
type
O
O
I/O
I/O
I/O
I/O
I
I
PWR
Signal
I/O
I/O
O
Pin
No.
39
40
41
42
43
44
45
46
47
48
49
50
51
O
I
I/O
I
I
I
I
O
I
I
I
O
I/O
I/O
PWR
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
PG8/PPI1D8/DR1SEC
PG9/PPI1D9/TD1SEC
PG10/PPI1D10/RSCLK1
PG11/PPI1D11/RFS1
PG12/PPI1D12/RE1PRI
PG13/PPI1D13/TSCLK1
PG14/PPI1D14/TFS1
PG15/PPI1D15/DT1PRI
PH0/ETxD0
PH1/ETxD1
PH2/ETxD2
PH3/ETxD3
PH4/ETxEN
PH5/MIITxCLK
PH6/MIIPHYINT
GND
PH7 / COL
PH8/ERxD0
PH9/ERxD1
PH10/ERxD2
PH11/ERxD3
PH12/ERxDV
PH13/ERxCLK
PH14/ERXER
PH15 / MIICRS
PPI1Sy3/PF7/TMR2
PPI1Sy2/PF8/TMR1
PPI1Sy1/PF9/TMR0
PG0/PPI1D0
PG1/PPI1D1
PG2/PPI1D2
PG3/PPI1D3
PG4/PPI1D4
PG5/PPI1D5
not available
Vin 3.3V
PG6/PPI1D6
PG7/PPI1D7
Signal
type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Table 4-1: Boarder pin assignment
Blackfin TCM-BF537 Hardware User Manual
Page 15
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Maximum Power at Minimum Size
5 TCM-BF537BGA (Ball Grid Array version)
5.1 Mechanical Outline
Figure 5-1 shows the top view of the Core Module (All dimensions are given in millimeters!)
Figure 5-1: Mechanical Outline (TOP VIEW)
Figure 5-2: Mechanical Outline (BOTTOM VIEW)
Blackfin TCM-BF537 Hardware User Manual
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Maximum Power at Minimum Size
Figure 5-3 shows the side view of the TCM-BF537BGA Core Module.
Figure 5-3: Side View of the BGA version
The total minimum mounting height of the BGA version is only 3.1mm!
5.2 BGA PAD Numbering
Figure 5-4 shows the pin assignment of the BGA version of the Core Module. The Rows I, O,
Q and S are not present!
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10 C11 C12 C13 C14
C15
C16
C17
D1
D2
D3
D15
D16
D17
E1
E2
E3
E15
E16
E17
F1
F2
F3
F15
F16
F17
G1
G2
G3
G15 G16 G17
H1
H2
H3
H15
H16
H17
J1
J2
J3
J15
J16
J17
K1
K2
K3
K15
K16
K17
L1
L2
L3
L15
L16
L17
M1
M2
M3
M15 M16 M17
N1
N2
N3
N15
N16
N17
P1
P2
P3
P15
P16
P17
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10 R11 R12 R13 R14
R15
R16
R17
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
T14
T15
T16
T17
U1
U2
U3
U4
U5
U6
U7
U8
U9
U10 U11 U12 U13 U14
U15
U16
U17
T11
T12
T13
Figure 5-4: BGA Pin Assignment (TOP VIEW)
Blackfin TCM-BF537 Hardware User Manual
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5.3 Footprint of BGA Baseboard
Figure 5-5 shows the top view of the BGA footprint for your base board.
Figure 5-5: BGA Footprint for the Base Board (TOP VIEW)
Blackfin TCM-BF537 Hardware User Manual
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Maximum Power at Minimum Size
B1
A15
A14
B15
B14
D2
C2
B2
C1
R10
R11
T10
T11
U10
U11
5.4 Schematic Symbol of BGA Version
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
TCM-BF537
ABE0
PG0 / PPI1D0
ABE1
BGA
PG1 / PPI1D1
ETxD0 / PH0
PG2 / PPI1D2
ETxD1 / PH1
PG3 / PPI1D3
ETxD2 / PH2
PG4 / PPI1D4
ETxD3 / PH3
PG5 / PPI1D5
ETxEN / PH4
PG6 / PPI1D6
ERxD0 / PH8
PG7 / PPI1D7
ERxD1 / PH9
PG8 / PPI1D8 / DR1SEC
ERxD2 / PH10
PG9 / PPI1D9 / DT1SEC
ERxD3 / PH11
PG10 / PPI1D10 / RSCLK1
ARDY
PG11 / PPI1D11 / RFS1
ERxDV / PH12
PG12 / PPI1D12 / DR1PRI
ERxCLK / PH13
PG13 / PPI1D13 / TSCLK1
ERXER / PH14
PG14 / PPI1D14 / TFS1
CLKBUF
PG15 / PPI1D15 / DT1PRI
VDD-RTC
PPI1Sy3 / PF7 / TMR2
GND
PPI1Sy2 / PF8 / TMR1
AMS2
PPI1Sy1 / PF9 / TMR0
AMS3
PPI1Clk / PF15 / TMRCLK
ARE
MDC
AWE
PF2 / Tx1 / TMR7
AOE
PF3 / Rx1 / TMR6 / TACI6
MEMCLK
PF14 / SPI_SS
RESET
PF1 / DMAR1 / TACI1 / Rx0
D0
PF0 / DMAR0 / Tx0
D1
PF11 / SPI_MOSI
D2
PF12 / SPI_MISO
D3
PF13 / SPI_SCK
D4
Bmode1
D5
Bmode0
D6
MDIO
D7
GND
D8
Bmode2
D9
TCK
D10
TDO
D11
TDI
D12
TMS
D13
TRST
D14
EMU
D15
A7
B7
C7
A8
B8
C8
B9
C9
A10
B10
C10
A11
C11
A12
B12
C12
A13
B13
C13
B6
A6
T2
T1
R2
R1
P2
M2
M1
L2
L1
A4
K2
K1
J2
A1
H3
J3
B3
A3
B5
A5
B4
A2
D1
A17
B17
C16
C17
D16
D17
E16
E17
F16
F17
G16
G17
H16
H17
J16
J17
R7
R8
R9
R12
R13
R14
C3
C6
A9
B11
C14
C15
A16
B16
D15
G15
K15
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
U9
T9
U8
T8
U7
T7
U6
T6
U5
T5
U4
T4
U3
T3
U2
U1
T12
U12
T13
U13
H1
U17
T17
T14
R16
R17
U15
T15
U14
L15
L16
H2
N15
L17
M16
M17
N16
N17
P16
P17
RSCLK0 / TACLK2
RFS0 / TACLK3
DR0PRI / TACLK4
DR0SEC / TACI0 / CAN_Rx
TSCLK0 / TACLK1
TFS0 / SPI_SSEL3
DT0PRI / SPI_SSEL2
DT0SEC / SPI_SSEL7 / CAN_Tx
PH15 / MIICRS
SCL
SDA
PF10 / SPI_SSEL1
PH7 / COL
PF6 / TMR3 / SPI_SSEL4
PH6 / MIIPHYINT
PH5 / MIITxCLK
WP_Flash
FA21
FA20
PF5
PF4
F3
G1
F1
F2
E2
E3
D3
E1
J1
G2
G3
T16
N1
U16
N2
P1
NMI
BG
BHG
BR
Vcc
Vcc
Vcc
Vcc
Vcc
Vcc
TCM-BF537
U?
Figure 5-6: Schematics Symbol of the BGA Version of the TCM-BF537BGA
Blackfin TCM-BF537 Hardware User Manual
Page 19
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Maximum Power at Minimum Size
5.5 BGA Pin Assignment
Pin
No.
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A12
A13
A14
A14
A15
A16
A17
B1
B2
B3
B4
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
C1
C2
C3
C6
C7
C8
K2
K15
L1
Signal
CLKBUF
MEMCLK
nAMS3
ARDY
nAWE
nABE1
A1
A4
GND
A9
A14
A17
A12
FA20
FA21
GND
Signal
type
O
O
O
I
O
O
O
O
PWR
O
O
O
O
I
I
PWR
Pin
No.
C9
C10
C11
C12
C13
C14
C15
C16
C17
D1
D2
D3
D15
D16
D17
E1
D0
nWP_Flash
nBGH
nAMS2
nAOE
nAOE
nARE
nABE0
A2
A5
A7
A10
GND
A15
A18
PF4/TMR5/SPI_SSL6
PF5/TMR4/SPI_SSL5
GND
D1
nBR
nBG
GND
GND
A3
A6
PH12/ERxDV
GND
PH11/ERxD3
I/O
I
O
O
O
O
O
O
O
O
O
O
PWR
O
O
I/O
I/O
PWR
I/O
I
O
PWR
PWR
O
O
I/O
PWR
PWR
E2
E3
E16
E17
F1
F2
F3
F16
F17
G1
G2
G3
G15
G16
G17
H1
H2
H3
H16
H17
J1
J2
J3
J17
K1
T2
T3
T4
Blackfin TCM-BF537 Hardware User Manual
Signal
A8
A11
A13
A16
A19
GND
GND
D2
D3
nReset
nNMI
DT0PRI/SPI_SSEL2
GND
D4
D5
DT0SEC/CANTX/SPI_SS
EL7
TSCLK0/TACLK1
TFS0
D6
D7
DR0PRI/ TACLK4
DR0SEC/TACI0/CANRX
RSCLK0/TACLK2
D8
D9
RFS0/TACLK3
SCL
SDA
GND
D10
D11
MDC
MDIO
VDD-RTC
D12
D13
PH15/MIICRS
PH14/ERXER
GND
D15
PH13/ERxCLK
PH0/ETxD0
PG13/PPI1D13/TSCLK1
PG11/PPI1D11/RFS1
Signal
type
O
O
O
O
O
PWR
PWR
I/O
I/O
I
I
O
PWR
I/O
I/O
O
I/O
I/O
I/O
I/O
I
I
I/O
I/O
I/O
I/O
I/O
I/O
PWR
I/O
I/O
I/O
I/O
PWR
I/O
I/O
I/O
I/O
PWR
I/O
I/O
I/O
I/O
I/O
Page 20
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Maximum Power at Minimum Size
L2
L15
L16
L17
M1
M2
M16
M17
N1
N2
N15
N16
N17
P1
P2
P16
P17
R1
R2
R7
R8
R9
R10
R11
R12
R13
R14
R16
R17
T1
PH10/ERxD2
BMODE1
BMODE0
BMODE2
PH9/ERxD1
PH8/ERxD0
TCK
TDO
PH7 / COL
PH6/MIIPHYINT
GND
TDI
TMS
PH5/MIITxCLK
PH4/ETxEN
TRST
EMU
PH3/ETxD3
PH2/ETxD2
GND
GND
GND
Vcc
Vcc
GND
GND
GND
PF1/DMAR1/TACI1/Rx0
PF0/DMAR0/Tx0
PH1/ETxD1
I/O
I
I
I
I/O
I/O
I
O
I/O
I/O
PWR
I
I
I/O
I/O
I
I
I/O
I/O
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
I/O
I/O
I/O
T5
T6
T7
T8
T9
T10
T11
T12
T13
T14
T15
T16
T17
U1
U2
U3
U4
U5
U6
U7
U8
U9
U10
U11
U12
U13
U14
U15
U16
U17
PG9/PPI1D9/TD1SEC
PG7/PPI1D7
PG5/PPI1D5
PG3/PPI1D3
PG1/PPI1D1
Vcc
Vcc
PPI1SY3/PF7/TMR2
PPI1SY1/PF9/TMR0
PF14/SPI_SS
PF12/SPI_MISO
PF10/SPI_SSEL1
PF3/Rx1/TMR6/TACI6
PG15/PPI1D15/DT1PRI
PG14/PPI1D14/TFS1
PG12/PPI1D12/RE1PRI
PG10/PPI1D10/RSCLK1
PG8/PPI1D8/DR1SEC
PG6/PPI1D6
PG4/PPI1D4
PG2/PPI1D2
PG0/PPI1D0
Vcc
Vcc
PPI1Sy2/PF8/TMR1
PPI1Clk/PF15/TMRCLK
PF13/SPI_SCK
PF11/SPI_MOSI
PF6/TMR3/SPI_SSEL4
PF2/Tx1/TMR7
I/O
I/O
I/O
I/O
I/O
PWR
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PWR
PWR
I/O
I/O
I/O
I/O
I/O
I/O
Table 5-1: BGA Version Pin Assignment
5.6 Flash Memory Extension PINS
5.6.1 PINS FA20 and FA21
These pins are the Address lines A20 and A21 of the Intel P30 Flash and are pulled down by
default.
If only 2MB of Flash are needed leave these pins open. PF4 and PF5 can be used as IO pins.
If 4MB are needed connect PF4 to FA20 for addressing the upper 2MB
If 8MB are needed connect PF5 to FA21 for addressing the upper 4MB
5.6.2 PINS PF4 and PF5
Can be used to extend the addressable Flash memory or as PF4 and PF5 Processor IO pins.
Please see Table 5-1 for the pin Assignment.
Blackfin TCM-BF537 Hardware User Manual
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5.6.3 /WP_FLASH
Is pulled high by default so flash is unprotected. To write protect the flash connect this pin to
GND
Blackfin TCM-BF537 Hardware User Manual
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6 Application Example Schematics
In the following two examples of connecting a Physical Ethernet chip and a USB 2.0 chip to
the Core Module are given.
6.1 Schematic Example for Connecting a Physical Ethernet Chip
Since the ADSP-BF537 Blackfin Chip from Analog Devices contains already Ethernet
functionality only a physical Ethernet chip has to be connected to the TCM-BF537 Core
Module in order to use this feature.
3V3
2.5V_VA
ERxDV
ERxCLK
ERxER
MII_CRS
COL
MDC
MDIO
nRESET
nPD
ERxDV
ERxC LK
ERxER
MII_C RS
C OL
MDC
MDIO
nRESET
ERxD3
ERxD2
ERxD1
ERxD0
3
4
5
6
9
10
11
22
21
2
1
48
nPD
30
MII_PHYINT
25
GND
KS8721
VddRCV
VddRX
VddTX
VddPLL
Vdd_CORE
RxD3/PHYAD
RxRxD2/PHYAD2
Rx+
RxD1/PHYAD3
FXSD/FXEN
RxD0/PHYAD4
TxRx_DV/CRSDV/PCS_LBPK
Tx+
Rx_CLK
Rx_ER/ISO
REXT
38
31
42
L1e
220R
C2e
10u
47
2.5V_PLL L2e
13
2.5V
220R
32
33
34
40
41
14
TxD3
TxD2
TxD1
TxD0
Tx_EN
Tx_CLK/REFCLK
Tx_ER/TXD4
C3e
10u
MDC
MDIO
SPEED100/FEF
COLLISION/NWAYEN
ACTIVITY/TEST
FDUPLEX
RESET
CLKIN/XTAL1
GND
GND
3V3
R1e
49R9
R2e
49R9
V1e
V2e
C4e
GND
100n
C5e
TxTx+
GND
37
R5e
27
29
26
28
LED_SPEED
GND
L3e
RxRx+
8
7
6
3
2
1
RD
RX
TD
TX
9
10
11
xRx-
14
15
16
xTx-
xRx+
R7e
49R9
R6e
49R9
R8e
75R
V4e
27R
R4e
2.5V_VA
27R
3V3
350u
V3e
R3e
xTx+
100n
GND
6k49
CRS/RMII_BTB
COL/RMII
2.5V_VA
R9e
75R
11
12
X1e
8
7
6
5
4
3
2
1
9
10
LED_AC T
2.5V_VA
C6e
1n
GND
GND
GND
46
PD
R10e
INT/PHYAD0
XTAL2
45
220R
R11e
GND
GND
GND
GND
GND
GND
GND
GND
MII_PHYINT
ETxEN
MII_TxC LK
ERxD[3..0]
U1e
20
19
18
17
16
15
14
13
ETxD3
ETxD2
ETxD1
ETxD0
ETxEN
MII_TxCLK
ERxD[3..0]
C1e
10u
7
24
ETxD[3..0]
Vdd
Vdd
ETxD[3..0]
8
12
23
35
36
39
43
44
220R
GND
CLKBUF
C LKBUF
3V3
C7e
100n
C8e
100n
GND
Figure 6-1: Configuration with Physical Chip
Designator
Value
Part Number
Description
Quantity
C1e, C2e, C3e
C4e, C5e, C7e, C8e
C6e
L1e, L2e
L3e
R1e, R2e, R6e, R7e
R3e, R4e
R5e
R8e, R9e
R10e, R11e
10u
100n
1n
220Z
350u
49R9
27R
6k49
75R
220R
C0805C106K9PAC
2238 246 19876
2238 586 15623
74279263
749010010
MC 0.063W 0603 1% 49R9
MC 0.063W 0603 1% 27R
MC 0.063W 0603 1% 6K49
MC 0.0654W 0603 1% 75R
MC 0.063W 0603 1% 220R
Capicator non-polarized
Capicator non-polarized
Capicator non-polarized
Ferrite
Inductor
Resistor
Resistor
Resistor
Resistor
Resistor
10/100BASE Physical
Layer Transceiver
ESD Protection Diode
RJ45-Connector with LEDs
3
4
1
2
1
4
2
1
2
2
U1e
V1e, V2e, V3e, V4e
X1e
KS8721BLI
CDS3C05GTA
2-406549-1
1
4
1
Table 6-1: Bill of Material of Sample Schematic
Blackfin TCM-BF537 Hardware User Manual
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6.2 Schematic Example for Connecting a USB 2.0 Chip
The following example shows how to connect a USB 2.0 chip to the TCM-BF537 core
Module.
USB-nRESET
ALE
R1u
58
53
61
59
60
50
34
51
52
10k
RESET
ALE
CS
IOR
IOW
DMARD
DMAWR
DACK
EOT
TRST
TEST
TMC2
25
12p
GND C2u
Y1u
1
GND
12p
26
R7u
13
GND
XIN
RSDM
DM
XOUT
DP
RSDP
RREF
VBUS
24
56
33
41
54
4
10
64
VSSC
VSSC
VSSIO
VSSIO
VSSIO
GND
GND
2k43
VBUS
LD0
LD1
LD2
LD3
LD4
LD5
LD6
LD7
LD8
LD9
LD10
LD11
LD12
LD13
LD14
LD15
LCLKO
DREQ
IRQ
C1u
3
3V3
GND
AVDD
PVDD
NET2272REV1A-LF
1
2
3
4
8
7
6
5
R2u
10k
40
18
17
AVSS
AVSS
COM
GND
USB-nAMS2
nARE
nAWE
LA0
LA1
LA2
LA3
LA4
RPU
19
20
21
22
23
35
36
37
38
39
43
44
45
46
47
49
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
GND
3V3
R3u
10k
57
62
63
9
8
D[15..0]
R4u
1k
USB-nIRQ
USB-nIRQ
X1u
R5u
39R
6
5
R6u
39R
R8u
1k5
6
2
3
4
1
5
USBDUSBD+
GND
2
R9u
47k
V1u
R10u
1M
C3u
10n
USBDUSBD+
GND
VCC
USB-B
12
14
16
USB-nRESET
D[15..0]
15
11
3
48
1
R11u
10k
32
31
30
29
28
VDDIO
VDDIO
VDDIO
VDD33
R12u
10k
2V5A
U1u
A0
A1
A2
A3
A4
3V3
VDD25
VDDC
VDDC
A[4..0]
A[4..0]
3V3
27
42
55
7
2V5
GND
GND
3V3
2V5
L1u
2V5A
220R
C4u
10n
C5u
10n
C6u
100n
C7u
10u
C8u
10u
GND
C9u
10n
C10u
100n
GND
L2u
C11u
10n
C12u
100n
220R
Figure 6-2: Configuration with USB 2.0 Chip
Designator
Value
Part Number
Description
Quantity
C1u, C2u
C3u, C4u, C5u, C9u, C11u
C6u, C10u, C12u
C7u, C8u
L1u, L2u
R1u, R3u, R11u, R12u
R2u
R4u
R5u, R6u
R7u
R8u
R9u
R10u
12p
10n
100n
10u
220R
10k
10k
1k
39R
2k43
1k5
47k
1M
2238 867 15129
2238 916 15636
2238 246 19876
C0805C106K9PAC
74279263
MC 0.063W 0603 1% 10K
2350 025 11003
MC 0.063W 0603 1% 1k
MC 0.0654W 0603 1% 39R
MULTICOMP
MC 0.063W 0603 1% 1K5
MC 0.063W 0603 1% 47k
MC 0.063W 0603 1% 1M
Capicator non-polarized
Capicator non-polarized
Capicator non-polarized
Capicator non-polarized
Ferrite
Resistor
4-Resistor Array
Resistor
Resistor
Resistor
Resistor
Resistor
Resistor
USB 2.0 Peripheral
Controller TQPF
2
5
3
2
2
4
1
1
2
1
1
1
1
U1u
V1u
NET2272REV1A-LF
CDS3C05GTA
Blackfin TCM-BF537 Hardware User Manual
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X1u
Y1u
2411 01
Q 30.0-JXS32-12-10/20
USB-Device Normal
Crystal Oscillator
1
1
Table 6-2: Bill of Material of Sample Schematic
Blackfin TCM-BF537 Hardware User Manual
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7 Software Support
7.1 BLACKSheep
The Core Module is delivered with a pre-flashed basic version of the BLACKSheep VDK
multithreaded framework. It contains a boot-loader for flashing the Core Module via the serial
port.
Please mind the software development documents.
7.2 uClinux
The Core Module is supported by the open source platform at http://blackfin.uclinux.org.
Since the Core Modules are pre-flashed with BLACKSheep you have to flash uBoot first. For
flashing the uBoot you can use the BLACKSheep boot-loader.
For using the Ethernet functionality of the TCM-BF537 Core Modules you need the EXTBF5xx-ETH-USB Blackfin Extension Board.
Blackfin TCM-BF537 Hardware User Manual
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8 Known Bugs
NONE
Table 8-1: Known Bugs
Blackfin TCM-BF537 Hardware User Manual
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9 Product Changes
Version
V1.1
Changes
Boarder Pad and BGA Versions added, 28mmx28mm outline
Table 9-1: Product Changes
Blackfin TCM-BF537 Hardware User Manual
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10 Document Revision History
Date
Document Revision
2007 04 17
Borderpad and BGA symbols corrected; Rx1 and Tx1 were mixed
up
Corrections of the description of the BP and BGA versions.
Corrected Typo in page 7 Table 2-2: PF5 one time instead of two
times PF4
2007 04 04
2007 01 08
2006 10 02
Release V1.1 of TCM Boards
Main updates: Separate Connector, Boarder and BGA pad version
Boader Pads: 76 Boarder pads without Data and Address bus pins
Connector Version: As in version V1.0
BGA Version: Additional Processor pins, added Flash addressing
flexibility
2006 04 26
2006 04 26
2006 03 07
Removed limited address range, all 8MB addressable
Updated bug list: only 4MB addressable.
Updated document: Connector symbol, fixed Bug naming of pin 22
and pin 40 (connector version) Rx and Tx was flipped.
First release V1.0 of the Document
Table 10-1: Revision History
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A
List of Figures and Tables
Figures
Figure 1-1: Main Components of the Core Module................................................................... 1
Figure 2-1: Detailed Block Diagram.......................................................................................... 3
Figure 3-1: Mechanical Outline (TOP VIEW)........................................................................... 6
Figure 3-2: Mechanical Outline (BOTTOM VIEW) ................................................................. 6
Figure 3-3: Side View with Connectors mounted...................................................................... 7
Figure 3-4: Connector Footprint for Base Board (TOP VIEW)................................................. 7
Figure 3-5: Schematics Symbol of Connector Version of the TCM-BF537.............................. 9
Figure 4-1: Mechanical Outline (TOP VIEW)......................................................................... 12
Figure 4-2: Side View of the Boarder Pads.............................................................................. 12
Figure 4-3: Boarder Pad Footprint for the Base Board (TOP VIEW) ..................................... 13
Figure 4-4: Schematics of the Boarder Pad Version of the TCM-BF537BP ........................... 14
Figure 5-1: Mechanical Outline (TOP VIEW)......................................................................... 16
Figure 5-2: Mechanical Outline (BOTTOM VIEW) ............................................................... 16
Figure 5-3: Side View of the BGA version.............................................................................. 17
Figure 5-4: BGA Pin Assignment (TOP VIEW) ..................................................................... 17
Figure 5-5: BGA Footprint for the Base Board (TOP VIEW)................................................. 18
Figure 5-6: Schematics Symbol of the BGA Version of the TCM-BF537BGA ..................... 19
Figure 6-1: Configuration with Physical Chip ......................................................................... 23
Figure 6-2: Configuration with USB 2.0 Chip......................................................................... 24
Tables
Table 2-1: Bootmode CM-BF534/537 ....................................................................................... 4
Table 2-2: Memory Map ............................................................................................................ 4
Table 3-1: Baseboard connector types ....................................................................................... 8
Table 3-2: Core Module connector types................................................................................... 8
Table 3-3: Connector P1 pin assignment ................................................................................. 10
Table 3-4: Connector P2 pin assignment ................................................................................. 11
Table 4-1: Boarder pin assignment .......................................................................................... 15
Table 5-1: BGA Version Pin Assignment................................................................................ 21
Table 6-1: Bill of Material of Sample Schematic .................................................................... 23
Table 6-2: Bill of Material of Sample Schematic .................................................................... 25
Table 8-1: Known Bugs ........................................................................................................... 27
Table 9-1: Product Changes ..................................................................................................... 28
Table 10-1: Revision History ................................................................................................... 29
Blackfin TCM-BF537 Hardware User Manual
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