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►Go
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Green by Reducing Knock
On chip knock system makes tight emissions controls affordable, bringing 3–5%
On-chip
3 5%
improvement of economy and power
Knock system helps reduce global warming by lowering CO2 emissions by 3–5% for same
amount of fuel
Power and memory size allow fast development of “clean
clean sheet”
sheet solutions to meet emissions
legislation
No active external components required for on-chip knock system because of variable onchip gain and sensor bias
Same integrated components can be used for a patented sensor diagnostics scheme that
meets on-board diagnostics
►Improves
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Performance
Combination of hardware decimator and DMA can lead to a savings of up to 5% of the CPU
load
eTPU and I/O configured to handle electronic manual transmissions (paddle flap)
applications where up to four brushless DC motors are used
Offers 32 eTPU2 channels to handle complex timer applications and offload the CPU
►Ease
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MPC563xM Key Benefits
of Use
Offers a 144-pin quad flat package (QFP) option; QFP has visible pins, making it easier to
assemble and inspect since infrared and X-ray technology is not required
Microsecond bus enabled for connecting ASIC with MPC563xM family
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