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Chapter 1 – Introduction
1.4 SPECIFICATIONS
Table 1-1 lists the XVME-113 Memory Module's Hardware Specifications.
Table 1-1. XVME-113 Memory Module Hardware Specifications
Characteristic
Specification
Maximum Memory Capacity:
RAM
EPROM
FLASH
EEPROM
1 bank of 16 sites, 1 bank of 8 sites
12 Mbytes Total
24 Mbytes Total
12 Mbytes Total
12 Mbytes Total
Device Sizes Supported:
RAM
EPROM
FLASH
EEPROM
128K by 8 up to 512K by 8
128K by 8 up to 1024K by 8
128K by 8 up to 512K by 8
128K by 8 up to 512K by 8
Device Speeds Supported:
50, 100, 150, 200 ns
Power Requirements:
+5 V @ .7A typ. .9 A max.
Battery Rating:
1.9 Amp hours
Battery Life:
2.0 years typ. (using a 628128 Hitachi RAM or equivalent device)
VMEbus COMPLIANCE
Complies with VMEbus Specifications, IEEE 1014, Rev C.1
A32/A24:D32/D16/D08(EO)DTB Slave for memory banks
A16:D16/D08(EO)DTB Slave for Real Time Clock and configuration port
4 BUS GRANT INs are connected to their respective BUS GRANT OUTs
IACKIN is connected to IACKOUT
DOUBLE - 6U Form Factor
Supports RMW as well as UAT for memory banks
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