Download EM7180SFP Data Sheet

EM7180SFP
5.
Typical Application Circuit
VDD
R1
2.4k
VDD
R2
2.4k
VDD
VREG
Sensor
Fusion
Platform
SCLS
SCL
SDAS
SDA
Host_Int
Host MCU
GPIO
SA0
GND
GND
Fig. 12 Sensor Fusion Platform Connection to Host MCU
6. Package Information
6.1. Module dimensions
The 2 following figures describe the sensor fusion platform dimensions and recommended assembly footprint.
The Module thickness is max 2.1mm (at BMX055 sensor location).
Fig. 13 Reference outline dimensions (top view, component side)
Copyright 2014, EM Microelectronic-Marin SA
7180SFP-DS Version 1.1, 10-Dec-14
16
www.emmicroelectronic.com
420005-A01, 2.0