Download KG245 SVC ENG_0411

Service Manual
Service Manual
KG245
Model : KG245
Date: April, 2006 / Issue 1.0
Table Of Contents
1. INTRODUCTION...................................5
4.17 Folder on/off Trouble ...............................89
1.1 Purpose ..................................................... 5
1.2 Regulatory Information ............................... 5
1.3 Abbreviations .............................................. 7
5. DOWNLOAD.......................................90
2. PERFORMANCE ..................................9
2.1 H/W Features...............................................9
2.2 Technical Specification ..............................10
3. TECHNICAL BRIEF............................15
5.1 Download Setup ........................................90
5.2 Download Procedure .................................91
5.3 SERVICE AND CALIBRATION .................98
6. BLOCK DIAGRAM ...........................101
7. Circuit Diagram................................103
3.1 Transceiver (SI4210, U401).......................15
3.2 PAM (SKY77328, U500)........................... 19
3.3 26 MHz Clock (VCTCXO, X400)................20
3.4 Power Supplies for RF Circuits
(RF LDO, U403).........................................20
3.5 Digital Main Processor (AD6527, U102)....22
3.6 Analog Main & Power Management
Processor (AD6537B, U101) .....................28
3.7 LCD MODULE ...........................................38
3.8 Camera ......................................................39
3.9 Keypad Switch and Scanning ....................41
3.10 Microphone ..............................................42
3.11 Main Speaker...........................................42
3.12 Headset Interface ....................................43
3.13 Key Back-light Illumination.......................44
3.14 VIBRATOR ..............................................45
3.15 Bluetooth Section Description (M201) .....46
8. pcb layout.........................................111
4. TROUBLE SHOOTING.......................48
11.1 Overview................................................123
11.2 Requirements ........................................123
11.3 Menu and Settings.................................123
11.4 AGC .......................................................125
11.5 APC .......................................................125
11.6 ADC .......................................................125
11.7 Setting....................................................125
11.8 How to do calibration .............................125
4.1 RF Component ..........................................48
4.2 RX Trouble.................................................49
4.3 TX Trouble .................................................55
4.4 Power On Trouble......................................62
4.5 Bluetooth Section Trouble Shooting ..........63
4.6 Charging Trouble .......................................68
4.7 Vibrator Trouble .........................................70
4.8 LCD Trouble ..............................................72
4.9 Camera Trouble.........................................74
4.10 Speaker Trouble ......................................76
4.11 SIM Card Interface Trouble .....................78
4.12 Earphone Trouble ....................................80
4.13 KEY backlight Trouble .............................82
4.14 Receiver Trouble .....................................84
4.15 Microphone Trouble.................................86
4.16 RTC Trouble ............................................88
-3-
9. ENGINEERING MODE......................115
9.1 BB Test [MENU 1] ...................................116
9.2 RF Test [MENU 2] ...................................118
9.3 MF mode [MENU 3] .................................118
9.4 Trace option [MENU 4] ............................119
9.5 Call timer [MENU 5] .................................119
9.6 Fact. Reset [MENU 6]..............................119
9.7 S/W version[MENU 7]..............................119
10. STAND ALONE TEST ....................120
10.1 Introduction ............................................120
10.2 Setting Method.......................................120
10.3 Means of Test ........................................121
11. AUTO CALIBRATION .....................123
12. EXPLODED VIEW & REPLACEMENT
PART LIST ..................................... 127
12.1 Exploded View ...................................... 127
12.2 Replacement Parts ................................129
12.3 Accessory ............................................. 145
-4-
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
-5-
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
-6-
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC
Automatic Power Control
BB
Baseband
BER
Bit Error Ratio
CC-CV
Constant Current - Constant Voltage
DAC
Digital to Analog Converter
DCS
Digital Communication System
dBm
dB relative to 1 milli watt
DSP
Digital Signal Processing
EEPROM
Electrical Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
FPCB
Flexible Printed Circuit Board
GMSK
Gaussian Minimum Shift Keying
GPIB
General Purpose Interface Bus
GSM
Global System for Mobile Communications
IPUI
International Portable User Identity
IF
Intermediate Frequency
LCD
Liquid Crystal Display
LDO
Low Drop Output
LED
Light Emitting Diode
OPLL
Offset Phase Locked Loop
-7-
1. INTRODUCTION
PAM
Power Amplifier Module
PCB
Printed Circuit Board
PGA
Programmable Gain Amplifier
PLL
Phase Locked Loop
PSTN
Public Switched Telephone Network
RF
Radio Frequency
RLR
Receiving Loudness Rating
RMS
Root Mean Square
RTC
Real Time Clock
SAW
Surface Acoustic Wave
SIM
Subscriber Identity Module
SLR
Sending Loudness Rating
SRAM
Static Random Access Memory
PSRAM
Pseudo SRAM
STMR
Side Tone Masking Rating
TA
Travel Adapter
TDD
Time Division Duplex
TDMA
Time Division Multiple Access
UART
Universal Asynchronous Receiver/Transmitter
VCO
Voltage Controlled Oscillator
VCTCXO
Voltage Control Temperature Compensated Crystal Oscillator
WAP
Wireless Application Protocol
-8-
2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item
Feature
Standard Battery
Classification : Li-on
Capacity min 830mAh
Voltage :3.7V
Cell Weight : 22g
Stand by Current
Under the minimum current consumption environment
(such as paging period 9), the level of standby current
is below 4mA.
Talk time
Up to 2.5 hours (GSM TX Level 5)
Stand by time
Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time
Approx. Under 3 hours
RX Sensitivity
GSM, EGSM: -107dBm, DCS: -107dBm
TX output power
GSM, EGSM: 33dBm(Level 5),
DCS, PCS: 30dBm(Level 0)
GPRS compatibility
Class 10
SIM card type
3V Small
Display
Status Indicator
ANT
EAR Phone Jack
PC Synchronization
Speech coding
Main LCD : 128 x 160 260K TFT, 1.77”
Sub LCD : 96 x 64 65K OLED,1.04”
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Menu Key, Clear Key
Send Key, END/PWR Key
Soft Key(Left/Right)
Internal
Yes (mono)
Yes
EFR/FR/HR
Data and Fax
Yes
Vibrator
Yes
Loud Speaker
Yes
Voice Recoding
Yes
Microphone
Yes
Speaker/Receiver
One way dual speaker
Travel Adapter
Yes
Bluetooth / USB
Yes
MIDI
Options
Camera Module
64 Poly (Mono SPK)
Data Kit , CD
Yes (VGA, CMOS)
-9-
Comment
2. PERFORMANCE
2.2 Technical Specification
Item
Description
Specification
EGSM
TX: 890 + (n-1024) x 0.2 MHz
RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)
1
Frequency Band
DCS
TX: 1710 + (n-512) x 0.2 MHz
RX: 1805 + (n-512) x 0.2 MHz (n=512~885)
PCS
TX: 1810 + (n-512) x 0.2 MHz
RX: 1905 + (n-512) x 0.2 MHz (n=512~810)
2
Phase Error
RMS < 5 degrees
Peak < 20 degrees
3
Frequency Error
< 0.1 ppm
GSM, EGSM
4
Power Level
Level
Power
5
33 dBm
6
Toler.
Level
Power
Toler.
2dB
13
17 dBm
3dB
31 dBm
3dB
14
15 dBm
3dB
7
29 dBm
3dB
15
13 dBm
3dB
8
27 dBm
3dB
16
11 dBm
5dB
9
25 dBm
3dB
17
9 dBm
5dB
10
23 dBm
3dB
18
7 dBm
5dB
11
21 dBm
3dB
19
5 dBm
5dB
12
19 dBm
3dB
Level
Power
Toler.
DCS, PCS
Level
Power
0
30 dBm
2dB
8
14 dBm
3dB
1
28 dBm
3dB
9
12 dBm
4dB
2
26 dBm
3dB
10
10 dBm
4dB
3
24 dBm
3dB
11
8 dBm
4dB
4
22 dBm
3dB
12
6 dBm
4dB
5
20 dBm
3dB
13
4 dBm
4dB
6
18 dBm
3dB
14
2 dBm
5dB
7
16 dBm
3dB
15
0 dBm
5dB
- 10 -
Toler.
2. PERFORMANCE
Item
Description
Specification
GSM, EGSM
5
Offset from Carrier (kHz).
Max. dBc
100
+0.5
200
-30
250
-33
400
-60
600~ <1,200
-60
1,200~ <1,800
-60
1,800~ <3,000
-63
3,000~ <6,000
-65
6,000
-71
Offset from Carrier (kHz).
Max. dBc
100
+0.5
200
-30
250
-33
400
-60
600~ <1,200
-60
1,200~ <1,800
-60
1,800~ <3,000
-65
3,000~ <6,000
-65
6,000
-73
Offset from Carrier (kHz)
Max. (dBm)
Output RF Spectrum
400
-19
(due to switching transient)
600
-21
1,200
-21
1,800
-24
Output RF Spectrum
(due to modulation)
DCS, PCS
GSM, EGSM
6
- 11 -
2. PERFORMANCE
Item
Description
Specification
DCS, PCS
6
7
8
Offset from Carrier (kHz).
Max. (dBm)
Output RF Spectrum
400
-22
(due to switching transient)
600
-24
1,200
-24
1,800
-27
Spurious Emissions
Bit Error Ratio
Conduction, Emission Status
GSM, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS, PCS
BER (Class II) < 2.439% @-100 dBm
9
RX Level Report Accuracy
10
SLR
11
12
13
3 dB
8 3 dB
Frequency (Hz)
Max.(dB)
Min.(dB)
100
-12
-
200
0
-
300
0
-12
1,000
0
-6
2,000
4
-6
3,000
4
-6
3,400
4
-9
4,000
0
-
Frequency (Hz)
Max.(dB)
Min.(dB)
100
-12
-
200
0
-
300
2
-7
500
*
-5
1,000
0
-5
3,000
2
-5
3,400
2
-10
4,000
2
Sending Response
RLR
2 3 dB
Receiving Response
* Mean that Adopt a straight line in between 300 Hz and
1,000 Hz to be Max. level in the range.
- 12 -
2. PERFORMANCE
Item
Description
Specification
14
STMR
13 5 dB
15
Stability Margin
> 6 dB
16
dB to ARL (dB)
Level Ratio (dB)
-35
17.5
-30
22.5
-20
30.7
-10
33.3
0
33.7
7
31.7
10
25.5
Distortion
17
Side Tone Distortion
Three stage distortion < 10%
18
System frequency
(13 MHz) tolerance
2.5ppm
19
32.768KHz tolerance
30ppm
At least 65 dBspl under below conditions:
20
Ringer Volume
21
Charge Current
22
23
24
1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : < 450 mA
Pre Charge : < 100 mA
Antenna Bar Number
Power
5
-85 dBm ~
4
-90 dBm ~ -86 dBm
3
-95 dBm ~ -91 dBm
2
-100 dBm ~ -96 dBm
1
-105 dBm ~ -101 dBm
0
~ -105 dBm
Battery Bar Number
Voltage
0
3.51 ~ 3.61 V
1
3.62 ~ 3.69 V
2
3.70 ~ 3.77 V
3
3.78 ~ 3.91 V
4
3.92 V ~
Antenna Display
Battery Indicator
Low Voltage Warning
3.62
0.03V (Call)
3.50
0.03V (Standby)
- 13 -
2. PERFORMANCE
Item
25
Description
Specification
Forced shut down Voltage
3.35 0.03 V
26
Battery Type
1 Li-ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 830mAh
27
Travel Charger
Switching-mode charger
Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 800 mA
- 14 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Transceiver (SI4210, U401)
The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage
supply part, and a VCTCXO part.
The Aero 2 transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular
handsets and wireless data modems. The integrated solution eliminates the IF SAW filter, external low
noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator (VCO modules,
and other discrete components found in conventional designs.)
Figure. 3-1 RECEIVER FUNCTIONAL BLOCK DIAGRAM
- 15 -
3. TECHNICAL BRIEF
(1) Receiver Part
The Aero 2 transceiver uses a low-IF receiver architecture which allows for the on chip integration of the
channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in
conventional super-heterodyne architectures.
A. RF front end
RF front end consists of Front End Module(FL400) and dual band LNAs integrated in transceiver (U401).
The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz PCS 1905MHz ~
1980MHz) are fed into the antenna or Mobile switch.
The Front End Module(FL500) is used to control the Rx and Tx paths. And, the input signals ANT_SW1,
ANT_SW2 of a FL400 are directly connected to baseband controller to switch either Tx or Rx path on.
The logic and current is given below Table 3-1
ANT_SW1
ANT_SW2
GSM Tx
2.5 ~ 3.0 0 V
0V
DCS, PCS Tx
0V
2.5 ~ 3.0 V
GSM Rx
0V
0V
DCS, PCS Rx
0V
0V
Table 3-1 THE LOGIC AND CURRENT
Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850 (864894MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800 (1805-1880 MHz)
band. The PCS input supports the PCS 1900 (1930-1990 MHz) band.
The LNA inputs are matched to the 150 balanced output SAW filters through external LC matching
networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits in register 05h (Figure 3-2).
- 16 -
3. TECHNICAL BRIEF
Figure. 3-2 SI4210 RECEIVER PART
B. Intermediate frequency (IF) and Demodulation
A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with
the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is
internally divided by 2 for GSM 850 and E-GSM 900 modes. The mixer output is amplified with an analog
programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2).
The quadrature IF signal is digitized with high resolution A/D converters (ADCs).
The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal. Digital
decimation and IIR filters perform channel selection to remove blocking and reference interference signals.
The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1). The low selectivity filter has a flatter
group channelization filter is in the baseband chip. After channel selection, the digital output is scaled with a
digital PGA, which is controlled with the DGAIN [5:0] bits in register 05h.
The amplified digital output signal go through with DACs that drive a differential analog signal onto the
RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC input baseband ICs. No special
processing is required in the baseband for offset compensation or extended dynamic range.
Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of
immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of
blockers, and device 1/f noise.
- 17 -
3. TECHNICAL BRIEF
(2) Transmitter Part
The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL)
and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz)
and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (18501910MHz) bands.
Figure. 3-3 SI4210 TRANSMITTER PART
A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit
vector modulator. The modulator provides more than 40dBc of carrier and unwanted sideband rejection and
produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in
the I/Q baseband signals caused by imperfections in the D/A converters. The Tx-Modulator implements a
quadrature modulator. A quadrature mixer upconverts the differential in-phase (TXIP, TXIN) and quadrature
(TXQP, TXQN) signals with the IFLO to generate a SSB IF signal that is filtered and used as the reference
input to the OPLL.
The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 to generate the
quadrature LO signals for the quadrature modulator, resulting in an IF between 383 and 448 MHz.
For the E-GSM 900 band, two different IFLO frequencies are required for spur management.
Therefore, the IF PLL must be programmed per channel in the E-GSM 900 band.
- 18 -
3. TECHNICAL BRIEF
B. OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The
TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the
GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz. To
allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and E-GSM 900
bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. The I and Q signals are
automatically swapped when switching bands. Additionally, the SWAP bit in register 03h can be used to
manually exchange the I and Q signals.
Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadrature modulator
and feedback mixer outputs. The cutoff frequency of the filters is programmable with the FIF[3:0] bits in
register 04h (Figure 3-3), and should be set to the recommended settings detailed in the register
description.
3.2 PAM (SKY77328, U500)
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor
for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM
also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control (PAC) block with an
internal current-sense resistor.
Figure. 3-4 SKY77328
- 19 -
3. TECHNICAL BRIEF
3.3 26 MHz Clock (VCTCXO, X400)
The 26 MHz clock(X400) consists of a VCTCXO(Temperature Compensated Crystal Oscillator) which
oscillates at a frequency of 26 MHz. It is used within the Si4205, analog base band chipset (U101,
AD6537B), digital base band chipset (U102, AD6527)
2V75_VVCXO
X400
R416
3
OUT VCONT
R417
1
AFC
15K
100
4
C442
2.2u
C443
NA
VCC
GND
2
26MHz
C441
1000p
Figure 3-5 VCTCXO CIRCUIT DIAGRAM
3.4 Power Supplies for RF Circuits (RF LDO, U403)
Two regulators are used for RF circuits. One is MIC5255 (U403), and the other is one port of AD6537B
(U101). MIC5255 (U403) supplies power to transceiver (SI4210, U401). One port of AD6537B supplies
power to VVCXO (X400). Main power (VBAT) from battery is used for PAM (SKY77328, U400) because
PAM requires high power.
Supplier
Voltage
PowersPowers
enabled signal
U403(RF)
2.85 V
U401
CLKON
U102(VVCXO)
2.75 V
X400
Battery(VBAT)
3.4 ~ 4.2 V
U400, U403
Table 3-2 RF POWER SUPPLIERS
- 20 -
3. TECHNICAL BRIEF
VBAT
RF2V85
U403
1
5
IN
OUT
2
GND
3
4
EN
BYP
CLKON
MIC5255-2.85BM5
R419
100K
C444
1u
C445
0.01u
Figure 3-6 RF LDO CIRCUIT DIAGRAM
- 21 -
C446
4.7u
3. TECHNICAL BRIEF
3.5 Digital Main Processor (AD6527, U102)
Figure 3-7. SYSTEM INTERCONECTION OF AD6527 EXTERNAL INTERFACE
- 22 -
3. TECHNICAL BRIEF
• AD6527 is an ADI designed processor.
• AD6527 consists of
1. Control Processor Subsystem
• 32-bit ARM7TDMI Control Processor
• 58.5 MHz operation at 1.7V
• On-board 16KB instruction/Data Cache
• 1 Mbits of on-chip System SRAM
2. DSP Subsystem
• 16-bit Fixed Point DSP Processor
• 91 MIPS at 1.7V
• 16K word Data and 16K word Program SRAM
• 4K word Program Instruction Cache
• Architecture supports Full Rate, Enhanced Full Rate, Half Rate, and AMR Speech
Encoding/Decoding Algorithms
3. Peripheral Subsystem
• Shared on-chip peripheral and off-chip interface:
• Support for Burst and Page Mode Flash
• Support for Pseudo SRAM
• Ciphering module for GPRS supporting GAE1 and GAE2 encryption algorithms
• Parallel and Serial Display Interface
• 8 x 8 Keypad Interface
• Four independent programmable backlight plus One Service Light
• 1.8V and 3.0V, 64 kbps SIM interface
• Universal System Connector Interface
• Slow, Medium and Fast IrDA transceiver interface
• Enhanced Generic Serial Port
• Dedicated SPI interface
• Thumbwheel Interface
• JTAG Interface for Test and In-Circuit Emulation
4. Other
• Supports 13 MHz and 26 MHz Input Clocks
• 1.8V Typical Core Operating Voltages
• 204-Ball LFBGA(mini-BGA) Package
5. Applications
• GSM900/DCS1800/PCS1900/PCS850 Wireless Terminals
• GSM Phase 2+ Compliant
• GPRS Class 12 Compliant
• Multimedia Services(MMS)
• Extended Messaging System(EMS)
- 23 -
3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL
The X-TAL oscillates 32.768KHz
B. LCD module interface
The LCD module is controlled by CAMERA IC, CL765A
If CL765A is in the state of by-pass mode, the LCD control signals from AD6527 are by-passed
through CL765A.
In operating mode, the CL765A controls the LCD module through L_MAIN_LCD_CS,
L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, L_DATA[15-00], 2V8_MV,1.8_MV.
Signals
Description
L_MAIN_LCD_CS
MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
L_SUB_LCD_CS
SUB LCD driver chip enable. SUB LCD driver IC has own CS pin
LCD_RESET (GPIO 15)
This pin resets LCD module. This signal comes from DBB directly.
LCD_WR
Enable writing to LCD Driver.
LCD_RD
Enable reading to LCD Driver.
LCD_RS
This pin determines whether the data to LCD module are display
data or control data. LCD_RS can select 16 bit parallel bus.
2V8_MV,1V8_MV
2.85V voltage is supplied to LCD driver IC.
LCD_SIGNAL1
(GPIO_16)
LCD_SIGNAL2
For the future.
(GPIO_17)
Table 3-3. LCD CONTRON SIGNALS DISCRIPTION
- 24 -
3. TECHNICAL BRIEF
C. RF interface
The AD6527 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, CLKON , PA_EN, SEN,
SDATA, SCLK, RF_PWR_DWN.
Signals
Description
PA_BAND (GPO 17)
PAM Band Select
ANT_SW1 (GPO 9)
Antenna switch Band Select
ANT_SW2 (GPO 11)
Antenna switch Band Select
CLKON
RF LDO Enable/Disable
PA_EN (GPO 16)
PAM Enable/Disable
S_EN (GPO 19)
PLL Enable/Disable
S_DATA (GPO 20)
Serial Data to PLL
S_CLK (GPO 21)
Clock to PLL
RF_EN (GPO 4)
Power down Input
Table 3-5. SIM CONTROL SIGNALS DESCRIPTION
D. Key interface
Include 5 column , 5 row and additional GPIO 35 for KEY_ROW5. The AD6527 detects whether key
is pressed or not by using interrupt method.
E. AD6537B Interrupt
AD6537B provides an active-high interrupt output signal. Interrupt signals are generated by the
Auxiliary ADC, audio, and charger modules.
- 25 -
3. TECHNICAL BRIEF
F. SIM interface
The AD6527 provides SIM Interface Module. The AD6527 checks status periodically during
established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,
SIM_RST(GPIO_23)
are required. The descriptions about the signals are given by bellow Table 3-6 in detail.
Signals
Description
SIM_DATA
This pin receives and sends data to SIM card. This model can support
1.8volt and 3.0 volt interface SIM card.
SIM_CLK
Clock 3.25MHz frequency.
SIM_RST
Reset SIM block
(GPIO_23)
Table 3-6. SIM CONTRON SIGNALS DISCRIPTION
2V85_VSIM
2V85_VSIM
1
VCC
2
RST
3
CLK
22p
1000p
C325
C326
(KDS, 1.6T)
C324
NA
SIM_RST
SIM_CLK
220n
SIM_DATA
J301
4
GND
5
VPP
6
I_O
C318
R369
20K
SIM CONNECTOR
Figure 3-8. SIM Interface of AD6527
- 26 -
3. TECHNICAL BRIEF
3.5.2 AD6527 Architecture
Figure 3-9. AD6527 Architecture
The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three main subsystems
connected together through a dynamic and flexible communication bus network. It also includes onboard
system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and
terminal functions like MMI, SIM and Universal System Connector (USC).
The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing, channel
equalization and channel codec functions. The code used to implement such functions can be stored in
external Flash Memory and dynamically downloaded on demand into the DSP’s program RAM and
Instruction Cache.
The micro-controller subsystem supports all the GSM terminal software, including the layer 1, 2 and 3 of the
GSM protocol stack, the MMI, and applications software such as data services, test and maintenance. It is
tightly associated with on-chip system SRAM and also includes boot ROM memory with a small dedicated
routine to facilitate the initialization of the external Flash Memory via code download using the on-chip serial
interface to the external Flash Memory interface.
The peripheral subsystem is composed of system peripherals such as interrupt controller, real time clock,
watch dog timer, power management and a timing and control module. It also includes peripheral interfaces
to the terminal functions: keyboard, battery supervision, radio and display. Both the DSP and the MCU can
access the peripheral subsystem via the peripheral bus (PBUS).
For program and data storage, both the MCU subsystem and the DSP subsystem can access the on chip
system SRAM and external memory such Flash Memory. The access to the SRAM module is made through
the RAM Bus (RBUS) under the control of the bus arbitration logic. Similarly, access to the Flash Memory is
through the parallel External Bus (EBUS).
- 27 -
3. TECHNICAL BRIEF
3.6 Analog Main & Power Management Processor
(AD6537B, U101)
B
Figure 3-10. AD6537B FUNCTIONAL BLOCK DIAGRAM
- 28 -
3. TECHNICAL BRIEF
• AD6537B is an ADI designed Analog Baseband processor. AD6537B covers the processing GMSK
modulation interface, Aux ADC, Voice signal processing and Power Management.
• AD6537B consists of
1. BB Transmit section
• GMSK Modulation
• I-channel & Q-channel Transmit DACs and Filters
• Power Ramping DAC
2. BB Receive section
• I-channel & Q-channel Receive ADCs and Filters
3. Auxiliary section
• Voltage Reference
• Automatic Frequency Control DAC
• Auxiliary ADC
• Light Controllers
4. Audio Section
• 8 kHz & 16 kHz Voiceband Codec
• 48 kHz Monophonic DAC
• Power Amplifiers
5. Power Management section
• Voltage Regulators
• Battery Charger
• Battery Protection
6. Digital Processor section
• Control, Baseband, and Audio Serial Ports
• Interrupt Logic
- 29 -
3. TECHNICAL BRIEF
3.6.1 Baseband Transmit Section
1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-slot and
multi-slot application.
2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a
matched pair of reconstruction filter.
Figure 3-11. AD6537B BASEBAND TRANSMIT SECTION
3.6.2 Baseband Transmit Section
1. This section consists of two identical ADC channels that process baseband in-phase(I) and
quadrature(Q) input signals.
Figure 3-12. AD6537B BASEBAND RECEIVER SECTION
- 30 -
3. TECHNICAL BRIEF
3.6.3 Auxiliary Section
1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an
Auxiliary ADC, and light controllers.
• AFC DAC: 13 bits
2. This section also contains AUX ADC and Voltage Reference
• IDAC: 10 bits
• The Auxiliary ADC provides :
- Two differential inputs for temperature sensing.
- A differential input for the battery charger current sensor
Figure 3-13. AD6537B AUXILIARY SECTION
- 31 -
3. TECHNICAL BRIEF
3.6.4 Audio Section
1. Receive audio signal from microphone. This model uses differential configuration.
2. Send audio signal to speaker. This model uses differential configuration.
3. This section provides an audio codec with a digital-to-analog converter and an analogto-digital
converter, a ring tone volume controller, a microphone interface, and multiple analog input and
output channels.
4. It interconnects with external devices like main microphone, main receiver, and headset. The
descriptions of audio port used in This model are given bellow in detail.
<Up Link>
-AIN1P,AIN1N : Main microphone positive/negative terminal
-AIN2P,AIN2N : Headset microphone positive/negative terminal
-AIN3P,AIN3N : External Analog Input terminal
<Down Link>
-AOUT1P,AOUT1N : Main Speaker positive/negative terminal
-AOUT3P : Headset speaker terminal
Figure 3-14. AD6537B AUDIO SECTION
- 32 -
3. TECHNICAL BRIEF
3.6.5 Power Management
Figure 3-15. AD6537B POWER MANAGEMENT SECTION
1. Power up sequence logic
1. The AD6537B controls power on sequence
2. Power on sequence
- If a battery is inserted, the battery powers the 8 LDOs.
- Then if PWRONKEY is detected, the LDOs output turn on.
- REFOUT is also enabled
- Reset is generated and send to the AD6527
- 33 -
3. TECHNICAL BRIEF
Figure 3-16. AD6537B POWER MODE LOGIC
2. LDO Block
1. There are 8 LDOs in the AD6537B.
- VCORE : supplies Digital baseband Processor core and AD6537B digital core (1.8V, 80mA)
- VMEM : supplies external memory and the interface to the external memory on the digital
baseband processor (1,8V or 2.8V, 150mA)
- VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)
- VSIM : supplies the SIM interface circuitry on the digital processor and SIM card
(1.8V or 2.85V, 20mA)
- VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)
- VABB : supplies the analog portions of the AD6537B
- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)
- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
- 34 -
3. TECHNICAL BRIEF
3. Battery Charging Block
1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization,
trickle charging, and Li-Ion charging control are implemented in hardware.
2. Charging Process
- Check charger is inserted or not
- If AD6537B detects that Charger is inserted, the CC-CV charging starts.
- Exception : When battery voltage is lower than 3.2V, the precharge(low current charge mode)
starts firstly.
- And the battery voltage reach to 3.2V the CC-CV charging starts.
3. Pins used for charging
- GATEDRIVE : charge DAC output
- ISENSE : charge current sense input
- VBATSENSE : battery voltage sense input.
- BATTYPE : battery type identification input
- REFCHG : voltage reference output
4. TA (Travel Adaptor)
- Input voltage: AC 85V ~ 260V, 50~60Hz
- Output voltage: DC 5.2V ( 0.2 V )
- Output current: Max 800mA ( 50mA )
5. Battery
- Li-ion battery (Max 4.2V, Nom 3.7V)
- Standard battery: Capacity - 830mAh
Figure 3-17. AD6537B BATTERY CHARGING BLOCK
- 35 -
3. TECHNICAL BRIEF
AIN3R
AIN2P
AIN2N
AIN1P
AIN1N
NC_R12
P15
R15
P16
R16
R12
AUXIP
AUXIN
VINNORP
VINNORN
C131
C132
C133
C134
39p
39p
39p
39p
From Headset
Microphone
CLOSE TO AD6537B
R109
J15
K15
R11
T11
T9
R9
J16
K16
C2
T8
R8
M2
N15
AGND1
SGND1
SGND2
DGND
LGND
AOUT1P
AOUT1N
AOUT2P1
AOUT2P2
AOUT2N1
AOUT2N2
AOUT3P
AOUT3N
GPI
4.7
RCV_P
C138
39p
SPKP_P
RCV_N
R110
4.7
AUXOP
C139
39p
C143
39p
C142
39p
C144
39p
C140
39p
To Headset
Speaker
Figure 3-18.KG245 HEADSET SPEAKER CIRCUIT (AD6537B)
AIN3R
AIN2P
AIN2N
AIN1P
AIN1N
NC_R12
P15
R15
P16
R16
R12
AUXIP
AUXIN
VINNORP
VINNORN
C131
C132
C133
C134
39p
39p
39p
39p
From Main
Microphone
VBAT
U204
T8
R8
M2
N15
AGND1
SGND1
SGND2
DGND
LGND
C142
39p
RCV_P
C138
39p
SPKP_P
SPK_N
RCV_P
RCV_N
R110
4.7
RCV_N
AUXOP
C139
39p
C143
39p
C4
C2
NO1
IN1
NO2
IN2
NC1
COM1
NC2
COM2
A4
SPK_RCV_SEL
A2
C1
C3
A1
SPK_RCV_P
A3
B1
AOUT1P
AOUT1N
AOUT2P1
AOUT2P2
AOUT2N1
AOUT2N2
AOUT3P
AOUT3N
GPI
4.7
GND
SPK_P
R109
J15
K15
R11
T11
T9
R9
J16
K16
C2
V+
CLOSE TO AD6537B
B4
MAX4684EBC_T
SPK_RCV_N
C229
1u
C140
39p
To Main
Receiver/
Speaker
C144
39p
Figure 3-19. KG245 HEADSET SPEAKER CIRCUIT (AD6537B)
- 36 -
3. TECHNICAL BRIEF
NC_T15
NC_R1
VMEMSEL
GND_NET1
NC_G16
NC_B7
NC_B5
VBATSENSE
VCHG
ISENSE
GATEDRIVE
NORMAL CHARGING
T15
R1
VBAT
R3
T5
G16
VCHARGE
B7
B5
C126
R104
0.2
(1%)
B8
A5
A7
A6
1u
D101
C125
4.7u
(2012)
CUS02
R105
330
Q101
G
S
D3
D4
4
5
3
6
D2
D5
D1
D6
7
2
8
1
TPCF8102-TE85L-F
VCHARGE
VBAT
C210
1u
R209 ERHY0007007
15 (1%,1/8W)
R216
1K
Q201
R215
ONNOFF
10K
VCHG_LED
Pre - CHARGING
6
1
5
2
4
3
UMX1NTN
3
R220
2
7.5K
1
R223
10K
Q202
2SC5585
R226
20
Figure 3-20. CIRCUIT FOR BATTERY CHARGING AT AD6537B
In order to reduce time for trickle charging, additional circuit(Pre-charge circuit) was included.
This circuit has supplied Max 160mA current into the battery additionally.
So call it, it reduce trickle charging time
- 37 -
3. TECHNICAL BRIEF
3.7 LCD MODULE
VGA CAMERA
128x160 MAIN TFT LCD
96x64 SUB OLED
CONNECTOR(60Pin)
INOUT_A3 INOUT_B3
5
1
4.7K
4.7K
8
2
3
7
VCHARGE
6
4
ICVE21184E150R500FR
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
VBAT
2V8_VEXT
10
G1
INOUT_A4 INOUT_B4
FL602
9
9
L_DATA08
L_DATA09
L_DATA10
L_DATA11
8
7
6
G2
INOUT_A2 INOUT_B2
G1
INOUT_A1 INOUT_B1
5
3
4
10
2
G2
1
R601
FL601 ICVE21184E150R500FR
L_DATA00
L_DATA01
L_DATA02
L_DATA03
R602
2V8_C_PWR
2V8_C_PWR
C601
FL606
L_MAIN_LCD_CS
L_SUB_LCD_CS
LCD_WR
LCD_RS
2
3
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
5
FL608
3
4
C612
56p
C613
56p
C614
56p
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
C_SDA
C_SCK
C_RST
7
6
ICVE21184E150R500FR
INOUT_A1 INOUT_B1
5
2
8
9
VCHG_LED
MLED
FLASH_LED
8
7
6
INOUT_A4 INOUT_B4
INOUT_A5 INOUT_B5
7
L_DATA12
L_DATA13
L_DATA14
L_DATA15
L_DATA16
L_DATA17
12
11
10
9
8
14
G1
INOUT_A6 INOUT_B6
13
FL605 ICVE21184E150R500FR
1
2
3
4
IFMODE
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
MLED1
MLED2
MLED3
9
C_MCLK
C_PCLK
C_HS
C_VS
8
7
6
C608
56p
C609
56p
C610
56p
C611
56p
FL607 ICVE21184E150R500FR
1
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
9
8
7
6
C_CD00
C_CD01
C_CD02
C_CD03
10
1
9
10
G1
4
ICVE21184E150R500FR
G2
1
6
G2
0.1uF
5
G2
100
4
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
G1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
LCD_ID
SPK_RCV_P
SPK_RCV_N
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
G2
CN601
R604 100K
6
ICVE31186E150R101FR
INOUT_A1 INOUT_B1
5
7
10
5
3
R603
LCD_RESET
2
10
INOUT_A4 INOUT_B4
1
AXK760145J
8
G2
INOUT_A3 INOUT_B3
G1
4
FL604
(60pin, Socket, 1.5T, 0.4mm)
9
G1
3
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
5
2
G2
1
L_DATA04
L_DATA05
L_DATA06
L_DATA07
10
FL603 ICVE21184E150R500FR
FL609 ICVE21184E150R500FR
27p
27p
1u
1u
C602
C603
C605
C606
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
9
8
7
6
C_CD04
C_CD05
C_CD06
C_CD07
G2
27p
C604
C607
1u
INOUT_A1 INOUT_B1
G1
3
4
5
2
10
1
OLED_ON
BACK_BATT
MOTOR
Figure 3-21. LCD MODULE CIRCUIT
Controlled by L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS,
LCD_WR,LCD_RD,L_DATA[00:17] ports
• L_MAIN_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
• LCD_RESET : This pin resets LCD module. This signal comes from DBB directly.
• LCD_RS: This pin determines whether the data to LCD module are display data or control data.
• L_WR : Write control Signal
• L_RD : Read control Signal. But this pin used only for debugging.
• L_DATA[00:17] : Parallel data lines.
• LCD_SIGNAL1 : LCD type selection signals
• For using 65K color, data buses should be 16 bits.
- 38 -
3. TECHNICAL BRIEF
3.8 Camera
The CL765A contains various highly-advanced functions such as fully-hardwired JPEG codec, image scaler
for Digital Zoom Function, MJPEG codec, high-speed Image data processing, OSD and so on. For the
system level ingegration, the CL765A provides various off-chip interfaces including CMOS/CCD camera
sensor interface, LCD interface, SD card interface and CCIR601/656 interface for external TV encoder
interface.
Figure 3-22. CL765A BLOCK DIAGRAM
- 39 -
3. TECHNICAL BRIEF
CAMERA CTL IC
CAMERA/MIDI LDO
2V85_VCAM
2V8_C_PWR
U501
R502
R503
R504
C_CD07
C_CD06
C_CD05
C_CD04
C_CD03
C_CD02
C_CD01
C_CD00
C_SCK
C_SDA
C_PCLK
C_RST
C_HS
C_VS
C_MCLK
Q501
D
C506
0.1u
SI1305-E3
2
ONNOFF
3
VIN
VOUT1
EN1
VOUT2
EN2
NC3
10
9
8
G
4
S
C501
1u
D9
5
7
NC2
6
GND
11
BGND
BYP
NC1
C503
1u
C504
10u
B8
C9
M10
L3
J8
L9
M9
K8
L8
M8
K7
L7
M5
M4
L4
M3
K4
M2
M1
C508
0.01u
C509
1u
C510
1u
C511
1u
B9
C7
WHITE/FLASH LED LDO
C516
0.01u
4
VIN
C3-
1u
1u
1u
26MHz
C514
A2
A1
VBAT
1
C515
4.7u
B2
E8
J3
K6
A5
B5
C5
F2
L5
C512
A8
A10
D2
H10
C513
XIN
XOUT
C507
0.1u
15
2
EUSY0240501
(Core Logic, CL761A)
GNDI1
GNDI2
GNDI3
GNDI4
GNDC1
GNDC2
GNDC3
GNDC4
GNDC5
J2
12
14
U503
VDDC1
VDDC2
VDDC3
VDDC4
1608
(1.8V=150mA, 2.85V=300mA)
K5
11
VDDL
C1+
G2
STROBE
CIS_TYPE2
CIS_TYPE1
CIS_TYPE0
C_PWDN
C_D7
C_D6
C_D5
C_D4
C_D3
C_D2
C_D1
C_D0
C_SCK
C_SDA
C_PCLK
C_RST
C_HS
C_VS
C_MCLK
VDDS
VDDI1
VDDI2
M_SA0
M_SA1
M_ADS
M_SD0
M_SD1
M_SD2
M_SD3
M_SD4
M_SD5
M_SD6
M_SD7
M_SD8
M_SD9
M_SD10
M_SD11
M_SD12
M_SD13
M_SD14
M_SD15
M_CS_N
M_RD_N
M_WR_N
M_INTR
M_HOLD
M_RESET_N
MS_CS_N
L_RESET_N
L_DA0
L_DA1
L_DA2
L_DA3
L_DA4
L_DA5
L_DA6
L_DA7
L_DA8
L_DA9
L_DA10
L_DA11
L_DA12
L_DA13
L_DA14
L_DA15
L_DA16
L_DA17
L_CS_N
L_WR_N
L_RD_N
L_ADS
LS_CS_N
M_8BIT
L2
L10
J9
K10
H8
H9
J10
G10
G9
G8
F8
F10
E10
F9
D10
E9
C10
H2
G1
L1
K2
K1
K3
K9
C502
0.01u
MIC2211-GOYML
VOUT_FL
3
FB501
13
FB502
R505
FLASH_LED
22
D8
B10
C8
B7
A7
A6
B6
C6
A4
B4
C4
C3
B3
A3
D3
C2
B1
E3
C1
E2
D1
F3
E1
F1
G3
A9
L_DATA00
L_DATA01
L_DATA02
L_DATA03
L_DATA04
L_DATA05
L_DATA06
L_DATA07
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
L_DATA15
L_DATA16
L_DATA17
L_MAIN_LCD_CS
LCD_WR
LCD_RD
LCD_RS
L_SUB_LCD_CS
GPIO_0
GPIO_1
GPIO_2
T_MODE0
SCAN_EN
TEST_EN
J1
H3
H1
M7
M6
L6
2V85_VCAM
C2C3+
C505
10u
1
C1C2+
2V85_VCAM
1V8_MIDI_CORE 2V85_VCAM
100K
100K
100K
VBAT
C517
VOUT_BL
4.7u
9
GND
17
PGND
R508
100K
ADD01
ADD02
ADD01
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
_LCD_CS
_RD
_WR
CAM_INT
CAM_HOLD
CAM_RST
_SUB_CS
R509
100K
R506
16
C_FLASH
1.5K
R511
10
LCD_DIM_CTL
1.5K
EN_FLSH
EN_SET
U502
NC
8
5
ISINK1
6
ISINK2
7
ISINK3
MLED1
MLED2
MLED3
AAT2807AIXN-4.5
R512
1K
R507
1K
C518
1u
C519
1u
Figure 3-23. CL761 CAMERA IC CIRCUIT
A.Camera Interface : Allows you to use the built-in camera to take photos with the phone . The phone
encodes up to 640 x 480 size with free size support.
B.U503 : Camera back-end IC. Camera signal is delivered from Camera Sensor to Camera IC(Q501).
C. Q501,U503,U502 : Regulator for U503 and Camera sensor.
- 40 -
MLED
3. TECHNICAL BRIEF
3.9 Keypad Switch and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad layer of
the PCB when pressed. There are (Normal Key 24EA, Camera side key, Volume up down side key),
connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 324, except for the power switch (KB1), which is connected independently. Functions, the row and column
lines of the keypad are connected to ports of AD6527. The columns are outputs, while the rows are inputs
and have pull-up resistors built in.
When a key is pressed, the corresponding row and column are connected together, causing the row input to
go low and generate an interrupt. The columns/rows are then scanned by AD6527 to identify the pressed
key.
VBAT
R322
680
R323
680
R324
680
100
VA303
R320
100
EVL14K02200
R319
VA302
VA301
R318
100
EVL14K02200
Side Key
END
VA305
680
VOL_DOWN
VOL_UP
EVL14K02200
SW306
POWERKEY
R302
CAMERA
CN602
1
2
3
4
5
EVL14K02200
R301
10K
R321
CLR
100
FAV
SW307
SW308
KEY_ROW0
1
SW309
SW310
2
SW311
3
SW312
LEFT
SW313
MENU
KEY_ROW1
SW314
4
SW315
7
SW320
5
SW316
8
SW321
6
SW317
9
SW322
SW318
UP
SEL
KEY_ROW2
SW319
R331
SW323
RIGHT
SEND
680
KEY_ROW3
SW324
R332
SW325 0
*
SW326
SW327
#
SW328
DOWN
680
KEY_ROW4
680
R349
680
VA306
R343
KEY_COL0
KEY_COL1
R352
680
R354
680
R356
680
KEY_COL2
KEY_COL3
KEY_COL4
S71PL256NC0_TLA084
Figure 3-24. Keypad Switches and Scanning
- 41 -
VA307
T
680
EVL14K02200
R333
KEY_ROW5
EVL14K02200
SW329
CONF
3. TECHNICAL BRIEF
3.10 Microphone
The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN1P
and AIN1N pins of AD6537B. The voltage supply VMIC is output from AD6537B, and is a biased voltage for
the AIN1P. The AIN1P and AIN1N signals are then A/D converted by the voiceband ADC part of
AD6537B.The digitized speech (PCM 8KHz ,16KHz) is then passed to the DSP section of AD6527 for
processing (coding, interleaving etc).
2V5_VMIC
R202
1K
R206
2.2K
R210
100
R217
100
C211
0.1u
C217
39p
C218
39p
VA201
R221
2.2K
(BSE, -42dB, FPCB Type)
VA202
C215
EVL5M02200
C212
39p
39p
VINNORN
MIC
EVL5M02200
VINNORP
C204
10u
C208
39p
CLOSE TO MIC
Figure 3-25. Connection between Microphone and AD6537B
3.11 Main Speaker
In the case of G692 , there are 3 different speakers. One is main speaker for the received voice, another are
loud speaker for playback of ring tone , key tone and other MIDI sounds and the other is headset speaker.
The main speaker is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain is controlled by
the PGA in an AD6537B. The receiver is placed in the folder cover and connected to AOUT1x terminal via
FPCB.
- 42 -
3. TECHNICAL BRIEF
3.12 Headset Interface
This phone chooses a 6 pin type headset which has 6 electrodes such as GND, AUXIP, AUXIN (this pin is
floating), AUXOP, JACK_DETECT, HOOK_DETECT. This type supports mono sound.
Switching from Receiver to Headset Jack
If jack is inserted, JACK_DETECT goes from high to low.
Audio path is switched from receiver to earphone by JACK_DETECT interrupt.
Switching from Headset Jack to Receiver
If jack is removed, JACK_DETECT goes from low to high.
Audio path is switched from earphone to receiver by JACK_DETECT interrupt.
Hook detection
If hook-button is pressed, HOOK_DETECT is changed from high to low.
This is detected by AD6527(GPIO_36).
And then hook is detected.
2V8_VEXT
2V5_JACK
2V5_JACK
U201
CLOSE TO EARJACK
1
R201
2
1K
R204
1.5K
C203
GND
NC
Vin VOUT
3
NCP563Q25T1
AUXIN
C202
10u
(1608)
C201
0.1u
HOOK_DETECT
0.1u
(GPIO_39)
C209
NA
4
C206
22u
J201
C214
AUXOP
AUXIP
R225
1M
C220
39p
EVL5M02200
C219
39p
VA203
0.1u
EVL5M02200
C216
VA204
JACK_DETECT
(GPIO_45)
33u
Figure 3-26. HEADSET JACK INTERFACE
- 43 -
7502-2.5G-SB1-A
(3 pole, ENJE0003501)
R328
12K
C316
27p
R329
10
R330
10
4
5
12K
3
R325
2
C306
C307
- 44 C315
27p
R326
10
Q301
R327
10
UMX1NTN
Figure 3-27. KEY BACK-LIGHT ILLUMINTION
R316
R315
R314
R313
R312
R311
C314
C313
C312
C311
C310
C309
C308
LD314
LEBB-S14H
LD313
LEBB-S14H
LD312
LEBB-S14H
LD311
LEBB-S14H
LD310
LEBB-S14H
R310
75
75
75
75
75
75
75
1u
1u
1u
1u
1u
1u
1u
R309
75
R308
75
R307
75
R306
75
R305
75
R304
75
KEY BACKLIGHT
LD309
LEBB-S14H
LD308
LEBB-S14H
LD307
LEBB-S14H
LD306
LEBB-S14H
LD305
LEBB-S14H
LD304
LEBB-S14H
LD303
LEBB-S14H
LD302
LEBB-S14H
R303
75
1u
1u
C305
VBAT
6
1
KEY_BACKLIGHT
LD301
LEBB-S14H
1u
1u
C304
1u
1u
C303
1u
C302
C301
3. TECHNICAL BRIEF
3.13 Key Back-light Illumination
In key back-light illumination, there are 14 Blue LEDs in Main Board, which are driven by
KEY_BACKLIGHT signal from AD6527.
VBAT
3. TECHNICAL BRIEF
3.14 VIBRATOR
The vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is driven from
VIBRATOR (GPIO_3) of AD6527.
VIBRATOR
VBAT
VBAT
R350
20
R334
47K
Q302
4
R353
R351
220
3
VIBRATOR
R357
EMZ2
7.5K
Figure 3-28. MOTOR
- 45 -
MOTOR
6
1
5
2
1.5K
C317
4.7u
3. TECHNICAL BRIEF
3.15 Bluetooth Section Description (M201)
BLUETOOTH
VBAT
2V8_VBT
ANT201
GND1
R227
U203
FEED
GND2
0
R228
330
BT_EN
AMAN542015LG02
VIN
VOUT
GND BGND
STBY
NC
3
2
1
4
6
5
L201
NA
C248
NA
(SNGF0008801)
BH28FB1WHFV
C232
0.1u
C231
2.2u
C233
2.2u
C230
15p
C234
15p
2V8_VBT
5
2V8_VBT
USC3
1
C237
NA
VCC
4
3
PCM_SYNC8
C240
0.1u
GND
U205
2
B4
PCM_TX
16
_BT_RST
5
V+
TC7SH08FS
C2
PCM_EN
IN1
C4
NO1
A2
A4
IN2
NO2
COM1
NC1
COM2
NC2
C1
C3
USC1
A1
10K
B1
R240
GND
A3
USC2
PCM_RX
1
2
7
8
9
10
28
ANT
2V8_VMEM
C236
0.1u
RESETB
VDD_1_8V
VDD_DIG
VDD_VREGIN
PIO0
PIO1
PIO2
PIO3
PIO4
PIO5
GND1
GND2
GND3
GND4
UART_TX
UART_RX
UART_RTS
UART_CTS
NC
PCM_TX
USC_1
USC_2
U206
MAX4717EBC-T
13
14
12
15
SPI_CLK
SPI_CSB
SPI_MOSI
SPI_MISO
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
22
21
3
4
6
11
25
27
24
23
26
19
17
18
20
M201
LBMA-2C67B2
Figure 3-29. BLUETOOTH CIRCUIT
1) U203(BH28FB1WHFV) : Provide power for bluetooth block
2) U205(TC7SH08FS) : PCM Sync Clock rate converter for bluetooth clock(8kHZ)
3) U206(MAX4717EBC-T) : Analog switch for bluetooth block
4) M201(LBMA-2C67B2) : Bluetooth module
- 46 -
L202
22nH
R232
R233
R235
R236
R237
R238
C249
15p
47
47
47
47
47
47
C238
2.2u
DEBUG_RX
DEBUG_TX
PCM_TX
PCM_RX
PCM_SYNC8
USC0
C239
2.2u
3. TECHNICAL BRIEF
3.16.1 Bluetooth Circuit Description (M201)
Figure 3-30. BLUETOOTH INTERFACE
1. Bluetooth Module Features
- Output power(Class2): 1.0 dBm Typ.
- Receiver Sensitivity: -83 dBM Max.
- Dimensions: 6.9 * 7.9 * 1.5 (unit: mm)
- Wide operating temperature range(Target): -40 to85C (Storage: -40 to 100C)
- D.C Supply voltage range: 1.8V or 3.0V(Nominal)
- Interfaces: UART and SPI for data and PCM for voice
- Stack layer: HCI or RFCOMM
- Compatibility with Bluetooth Specification 1.2
- 47 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
FL400
SW400
U400
U403
U401
U402
X400
Figure 4-1. RF Component
U400
Power Amp Module(SKY77328)
U401
RF Main Chip(SI4210)
U402
Inerter
U403
2.85V Regulator
X400
VVCXO,26MHz Clock
Fl400
FEM
Sw400
Mobile Switch
- 48 -
4. TROUBLE SHOOTING
4.2 RX Trouble
CHECKING FLOW
START
HP8960 : Test mode
62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1) Check
regulator circuit
(2) Check
VCTCXO
(3) Check
Mobile SW
&FEM
(4) Check
RX IQ
Redownload SW or
Do calibration again
- 49 -
4. TROUBLE SHOOTING
(1) Checking Regulator Circuit
TEST POINT
U403. 3
(EN)
U403
U403. 5
(OUT)
Figure 4-2 (a). Regulator Circuit
CIRCUIT
VBAT
RF2V85
U403
1
5
IN
OUT
2
GND
3
4
EN
BYP
CLKON
MIC5255-2.85BM5
R419
100K
C444
1u
C445
0.01u
C446
4.7u
Figure 4-2 (b). Regulator Circuit
CHECKING FLOW
Voltage at
Pin5 of U403
Is 2.85V?
YES
Regulator Circuit is OK
NO
Level at
Pin3 of U403
Is high?
YES
Replace U403
See next Page to check
VCTCXO
- 50 -
NO
Change main board
4. TROUBLE SHOOTING
(2) Checking VVCXO Circuit
CHECKING FLOW
TEST POINT
X400.3
(OUT)
Check Pin 3.
26 MHzO.K?
Refer to Graph 4 -1(b)
No
Check Pin 4.
Refer to Graph 4 -1(a)
X400
2.75V OK?
VVCXO Circuit is OK
See next Page to check
Mobile SW
Yes
Yes
Changing X400
No
X400.4
(VCC)
Check U101, PMIC
Figure 4-3 (a). VVTXO Circuit
CIRCUIT
2V75_VVCXO
X400
R416
3
OUT VCONT
R417
1
AFC
15K
100
4
C442
2.2u
C443
NA
VCC
GND
2
26MHz
C441
1000p
Figure 4-3 (a). VVTXO Circuit
WAVEFORM
Graph 1(b)
Graph 1(a)
- 51 -
4. TROUBLE SHOOTING
(3) Checking Mobile SW & FEM
TEST POINT
SW400
SW400.ANT
SW400.RF
VC_DCSPCS
VC_EGSM
FL400
Figure 4-4(a) Mobile SW & FEM Circuit
CIRCUIT
ANT401
ANT400
WAVEFORM
ANT402
FL301. 10
1p
C407
L407
5.6nH
VC1
VC_DCSPCS
NA
Low
L400
SW400
ANT
G2
Low
RF
G1
VC_EGSM
VC2
C410
NA
KMS-506
C417
22p
GND12
VC_EGSM
GND13
GND11
GND10
ANT SW Control GSM& DCS RX Mode
Graph 2
PCS_RX2
15
14
13
12
11
EGSM_RX1
10
PCS_RX1
DCS_RX2
DCS_RX1
GND9
EGSM_RX2
GND8
GND7
GND6
GND5
GND4
DCSPCS_TX
GND2
EGSM_TX
GND1
5
8
ANT
GND3
1
24
23
22
21
20
19
18
17
16
7
6
4
2
VC_DCSPCS
9
3
C418
NA
FL400
HWXQ511
C439
270p
ANT_SW1
(GPIO_9)
ANT_SW2
(GPIO_11)
ANT_SW1
ANT_SW2
GSM_TX
High
Low
DCS_TX
Low
High
RX
Low
Low
C440
270p
Figure 4-4 (b). Mobile SW & FEM Circuit
Table 1
- 52 -
4. TROUBLE SHOOTING
CHECKING FLOW
For these 2 test case,
No Call connection is needed
Check SW400 Pin ANT,RF
Open
No
Changing SW400
No
Changing SW400
with RF Cable connected.
Yes
Check SW400 Pin ANT,RF
Short
with No RF Cable Connected
Yes
Check C439,C440
VC1 :Low
VC2 :Low
Check whether Ant SW
No
Changing the Board.
Set as RX mode
Yes
RRefer to Table 4-2
Check RF Level of
FL500.10 (for GSM) &
FL500.1(for DCS)
Pin10 : ~ -62dBm
Pin 1 : ~ -63dBm
No
Yes
Ant SW & Mobile SW is OK
See next Page to check
Rx IQ Signal
For this RF Level test case,
RX Stand alone Mode is needed
refer to chapter 11
ANT_SW1
ANT_SW2
GSM_TX
High
Low
DCS_TX
Low
High
RX
Low
Low
Table 4-2
- 53 -
Changing FL400
4. TROUBLE SHOOTING
(4) Checking RX IQ
TEST POINT
WAVEFORM
C425
C427
U401
Figure 4-5 (a). RX IQ Circuit
Graph 3
2p
17
18
19
20
21
22
23
24
L403
5.6nH
C425
1.8p
C426
1.5p
C427
1.5p
U401
SI4210
25
26
27
28
29
30
L404
6.8nH
RFIPP
RFIPN
RFIDP
RFIDN
RFIEP
RFIEN
RFIAP
RFIAN
XMODE
XDIV
AFC
VDD3
VDD4
XTAL2
XTAL1
C423
RFOH
RFOL
GND
VDD2
VDD1
VIO
RESET
16
15
14
13
12
11
CIRCUIT
C428
12p
Figure 4-5 (b). RX IQ Circuit
CHECKING FLOW
Check C425,C427.
No
Check if there is any
Similar?
Major difference
Refer to graph 4-3
Yes
Redownload software and calibration again
- 54 -
Replace U401
4. TROUBLE SHOOTING
4.3 TX Trouble
CHECKING FLOW
START
HP8960 : Test mode
62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1)Check
regulator circuit
(2)Check
VVCXO
(3)Check
Mobile SW
& FEM
(4)Check
PAM control
signal
(5)Check
TX IQ
Redownload SW or
Do calibration again
- 55 -
4. TROUBLE SHOOTING
(1) Checking Regulator Circuit
TEST POINT
U403. 3
(EN)
U403
U403. 5
(OUT)
Figure 4-6 (a). Regulator Circuit
CIRCUIT
VBAT
RF2V85
U403
1
5
IN
OUT
2
GND
3
4
EN
BYP
CLKON
MIC5255-2.85BM5
R419
100K
C444
1u
C445
0.01u
C446
4.7u
Figure 4-6 (b). Regulator Circuit
CIRCUIT
Voltage at
Pin5 of U403
Is 2.85V?
YES
Regulator Circuit is OK
NO
Level at
Pin3 of U403
Is high?
YES
Replace U403
See next Page to check
VVCXO
- 56 -
NO
Change main board
4. TROUBLE SHOOTING
(2) Checking VVCXO Circuit
TEST POINT
CHECKING FLOW
X400.3
(OUT)
X400
VVCXO Circuit is OK
See next Page to check
Mobile SW
Yes
26 MHzO.K?
Check Pin 3.
Refer to Graph 4 -1(b)
No
Yes
2.75V OK?
Check Pin 4.
Refer to Graph 4- 1(a)
No
Changing X400
Check U101, PMIC
X400.4
(VCC)
Figure 4-7 (a). VVCXO Circuit
CIRCUIT
2V75_VVCXO
X400
R416
3
OUT VCONT
R417
1
AFC
15K
100
4
C443
NA
C442
2.2u
VCC
GND
2
26MHz
C441
1000p
Figure 4-7 (b). VVCXO Circuit
WAVEFORM
Graph 4(a)
Graph 4(a)
- 57 -
4. TROUBLE SHOOTING
(3) Checking Mobile SW & FEM
TEST POINT
SW400
SW400.AN T
VC_DCSPCS
VC_EGSM
SW400.RF
FL400
Figure 4-8 (a). SW & FEM Circuit
CIRCUIT
ANT401
ANT400
WAVEFORM
ANT402
1p
C407
L407
5.6nH
NA
L400
SW400
C410
NA
G2
RF
G1
ANT
KMS-506
C417
22p
C418
NA
GND12
VC_EGSM
GND13
GND11
GND10
PCS_RX2
15
14
13
12
11
EGSM_RX1
10
PCS_RX1
DCS_RX2
DCS_RX1
GND9
EGSM_RX2
GND8
GND7
GND6
GND5
GND4
DCSPCS_TX
GND2
EGSM_TX
GND1
5
8
ANT
GND3
1
24
23
22
21
20
19
18
17
16
7
6
4
2
VC_DCSPCS
9
3
Graph 5(a) GSM Tx mode
FL400
HWXQ511
C439
270p
ANT_SW1
(GPIO_9)
ANT_SW2
(GPIO_11)
C440
270p
Graph 5(b) DCS,PCS Tx mode
- 58 -
4. TROUBLE SHOOTING
CHECKING FLOW
For the test,
TX Stand alone Mode is needed. Refer to
chapter 11 (PL=7 for GSM, PL=2 for DCS)
Check C439,C440
Check whether Ant SW
Check VC_EGSM,
Set as TX mode
No
Changing board
VC_DCSPCS
RRefer to Graph4-6
Yes
RRefer to Table 6-11
Check RF Level of
No
Pin5 : ~29.5dBm
Pin 3 : ~26.5dBm
FL400 Pin 5 (for GSM) & Pin 3 (for
DCS)
Go to 4.3.5 Checking PAM
control signal
Yes
Check SW400.ANT, RF with RF
Cable connected.
Open
No
Changing SW400
No
Changing SW400
Yes
Check SW400.ANT,RF
Short
with RF Cable disconnected
Yes
END
ANT SW
VC_EGSM
VC_CDSPCS
DCS TX
0
1
EGSM TX
1
0
EGSM, DCS RX
0
0
Table 4-3
- 59 -
4. TROUBLE SHOOTING
(4) Checking PAM Control Signal
TEST POINT
WAVEFORM
U400
R606 (PA_EN)
Figure 4-9 (a). PAM Control
Graph 6
CIRCUIT
VBAT
R605
100
R606
100
PA_BAND
(GPIO_17)
PA_EN
(GPIO_16)
C404
22u
C405
27p
C406
27p
BS
1
ENABLE
18
Figure 4-9 (b). PAM Control
CHECKING FLOW
Check TX_RAMP and PA_EN
Check if there is
Any Major Difference or not
Refer to Graph 4 - 7
Similar?
Yes
Go to Next Step
- 60 -
No
Redownload S/W
4. TROUBLE SHOOTING
(5) Checking TX IQ
TEST POINT
WAVEFORM
C425
C427
U401
Figure 4-10 (a). TX IQ
Graph 7
2p
17
18
19
20
21
22
23
24
L403
5.6nH
C425
1.8p
C426
1.5p
C427
1.5p
U401
SI4210
25
26
27
28
29
30
L404
6.8nH
RFIPP
RFIPN
RFIDP
RFIDN
RFIEP
RFIEN
RFIAP
RFIAN
XMODE
XDIV
AFC
VDD3
VDD4
XTAL2
XTAL1
C423
RFOH
RFOL
GND
VDD2
VDD1
VIO
_RESET
16
15
14
13
12
11
CIRCUIT
C428
12p
Figure 4-10 (b). TX IQ
CHECKING FLOW
Check if there is
Any Major Difference
Refer to Graph 4 -8
Similar?
Yes
Redownload the Software
And calibrate
- 61 -
No
Replace U101
4. TROUBLE SHOOTING
4.4 Power On Trouble
TEST POINT
C119
(2V75_VVCXO)
C113
(1V8_VCORE)
C118
(2V5_VMIC)
C114
(2V8_VMEM)
C115
(1V8_VRTC)
C116
(2V85_VSIM)
Figure 4-11(a). Power On Trouble
VBAT
2V8_VEXT
2V5_VMIC
2V75_VVCXO
2V75_VABB
2V85_VSIM
1V8_VRTC
2V8_VMEM
1V8_VCORE
CIRCUIT
R102
1K
BACK_BATT
VCORE1
VCORE2
VMEM1
VMEM2
VRTC
VSIM
VABB
VMIC
VVCXO
NC_E15
VEXT1
VEXT2
VBAT_NET
NC_E16
NC_F16
C113
P1
N1
T3
T2
T7
T6
H16
N16
D16
E15
A4
B4
T4
E16
F16
1u
C114
1u
C115
C116
0.1u
1u
C117
C118
C119
2.2u (1608)
1u
1u
C122
1u
Figure 4-11(b). Power On Trouble
- 62 -
4. TROUBLE SHOOTING
CHECKING FLOW
START
Check Battery Voltage
> 3.35V
NO
Charge or Change Battery
YES
Push power-on key
And check the level change
of PWRKEY
NO
Check the contact of power key
Or dome-switch
YES
Check the voltage of
The LDO outputs at U101
YES
NO
Replace U101
VCORE=1.8V
VMEM=2.8V
VEXT=2.8V
VABB=2.75V
VVCXO=2.75V
VRTC=1.8V
VSIM=1.8V or 2.85V
VMIC=2.5V
NO
Logic level at KEYON of U101
= HIGH
Re-download software
YES
Does it work properly?
YES
NO
Does it work properly?
The power-on procedure is
Completed. The problem may
be elsewhere.
THE PHONE WILL
POWER ON.
NO
Replace the main board
- 63 -
4. TROUBLE SHOOTING
4.5 Bluetooth Section Trouble Shooting
TEST POINT
R238
R235
(USC0) (PCM_TX)
R236
(PCM_RX)
R233
(DEBUG_TX)
M201
R232
(DEBUG_RX)
R227
(ANT)
R237
(PCM_SYNC8)
Figure 4-12(a). Bluetooth Section Trouble Shooting
CIRCUIT
BLUETOOTH
VBAT
2V8_VBT
ANT201
GND1
R227
U203
FEED
GND2
0
R228
330
BT_EN
AMAN542015LG02
VIN
VOUT
GND BGND
STBY
NC
3
2
1
4
6
5
L201
NA
C248
NA
(SNGF0008801)
BH28FB1WHFV
C232
0.1u
C231
2.2u
C233
2.2u
C230
15p
C234
15p
2V8_VBT
2V8_VMEM
C236
0.1u
1
VCC
4
3
PCM_SYNC8
C240
0.1u
GND
B4
U205
2
V+
TC7SH08FS
C2
PCM_EN
C4
IN1
NO1
IN2
NO2
COM1
NC1
COM2
NC2
A4
A2
C3
USC1
C1
A3
USC2
R240
10K
A1
GND
USC3
C237
NA
B1
PCM_TX
16
_BT_RST
5
PCM_RX
1
2
7
8
9
10
28
RESETB
USC_2
U206
MAX4717EBC-T
13
14
12
15
VDD_1_8V
VDD_DIG
VDD_VREGIN
PIO0
PIO1
PIO2
PIO3
PIO4
PIO5
GND1
GND2
GND3
GND4
UART_TX
UART_RX
UART_RTS
UART_CTS
NC
PCM_TX
USC_1
ANT
5
2V8_VBT
SPI_CLK
SPI_CSB
SPI_MOSI
SPI_MISO
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
22
21
3
4
6
11
25
27
24
23
26
19
17
18
20
L202
22nH
R232
R233
R235
R236
R237
R238
C249
15p
47
47
47
47
47
47
M201
LBMA-2C67B2
Figure 4-12(b). Bluetooth Section Trouble Shooting
- 64 -
C238
2.2u
DEBUG_RX
DEBUG_TX
PCM_TX
PCM_RX
PCM_SYNC8
USC0
C239
2.2u
4. TROUBLE SHOOTING
Checking flow
Bluettooth Power on
IS _BT_RST signal
shape similar FIG.1
No
Replace U102
U101
Yes
2V8_VBT at
C233 =2.8V ?
Yes
No
2V8_VBT at C233,
C234 =2.8V ?
No
BT_EN at
R228 =2.8V ?
Yes
Yes
Check PCB
pattern
Replace
U207
- 65 -
No
Replace
U102
4. TROUBLE SHOOTING
Replace
Resolder
U101
No
Yes
No
Replace M201
U101
Yes
Not available
Connect BT Headset
Yes
No
IF RF level at Antenna
Feeding about 0dBm?
No
Is soldering of R239,
L202 good?
Yes
Yes
Replace Headset
Replace
M201
- 66 -
Resolder
4. TROUBLE SHOOTING
Establish a call
No
Replace U102
Yes
IIS PCM_RX signal
shape similar FIG.3
No
Replace M201
Yes
Software
Re_download
- 67 -
4. TROUBLE SHOOTING
4.6 Charging Trouble
CIRCUIT DIAGRAM
R105
D101
Q101
R104
Figure 4-13(a). Charging Trouble
CIRCUIT
NC_T15
NC_R1
VMEMSEL
GND_NET1
NC_G16
NC_B7
NC_B5
VBATSENSE
VCHG
ISENSE
GATEDRIVE
T15
R1
VBAT
R3
T5
G16
B7
B5
VCHARGE
C126
R104
0.2
(1%)
B8
A5
A7
A6
1u
D101
(2012)
CUS02
R105
330
Q101
G
S
D3
D4
4
5
3
6
D2
D5
D1
D6
7
2
1
8
TPCF8102-TE85L-F
Figure 4-13(b). Charging Trouble
- 68 -
C125
4.7u
4. TROUBLE SHOOTING
Checking Flow
START
I/O Connector(CN301)
Is well-soldered ?
NO
Resolder the CN301
Pin 4,5 : VCHARGE
Pin12,19 : GND
NO
The TA is out of order
Change the TA
NO
Resolder the
Q101, D101, R104
NO
Replace the
Q101, D101
NO
Replace the
Q101
NO
The battery may have
problems.
Change the battery.
YES
Voltage at anode of
D101 = 5.2V ?
YES
Q101,D101, R104 are
well-soldered?
YES
Voltage across R104 is
about 10~100mV?
YES
0.7V < voltage(R105) < 1.3V?
YES
Battery is charged?
YES
Charging is
properly operating
- 69 -
4. TROUBLE SHOOTING
4.7 Vibrator Trouble
TEST POINT
R357
R353
R334
R350
C317
+
Q302
-
Soldering Check in LCD Module
Figure 4-14(a). Vibrator Trouble
CIRCUIT
VIBRATOR
VBAT
VBAT
R350
20
R334
47K
Q302
4
R353
R351
220
3
VIBRATOR
R357
EMZ2
7.5K
Figure 4-14(b). Vibrator Trouble
- 70 -
MOTOR
6
1
5
2
1.5K
C317
4.7u
4. TROUBLE SHOOTING
Checking Flow
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
START
Is the voltage at pin 3
of Q302 high ?
NO
YES
YES
Is the voltage at pin 2
of Q302 low ?
NO
Check the soldering
of R353, R357
NO
Resolder R353, R357
Check the soldering
of R334
YES
YES
Is the voltage at pin 1
of Q302 high ?
NO
Resolder R334
Check the soldering
of R351
YES
YES
NO
Resolder CN601
YES
Check the soldering
of vibrator ?
NO
Resolder vibrator
YES
Replace vrbrator
YES
Vibrator
Working well !
- 71 -
NO
Resolder R351
Replace Q302
Check the soldering
of CN601 ?
NO
4. TROUBLE SHOOTING
4.8 LCD Trouble
TEST POINT
FL604
FL605
FL602
CN601
FL607
FL609
FL601
FL603
FL606
FL608
Figure 4-15(a). LCD Trouble
LCD Module connection
connector( 60Pin, female )
LCD Module
Camera Module connection
Connector ( 20Pin, female )
Figure 4-15(b). LCD Trouble
- 72 -
4. TROUBLE SHOOTING
CHECKING FLOW
START
Is the connection of
FPCB with connector on
PCB(CN601) ok ?
NO
Reassemble FPCB with CN601 connector
YES
Check the connection LCD
module with connector
On FPCB ?
NO
Reassemble LCD module with connector on FPCB
YES
NO
Check the soldering of
CN601 ?
Resoldering CN601
YES
Change the FPCB and try again
YES
Check the soldering of
EMI filter ?
NO
Resoldering EMI filter(FL600~FL609)
YES
Does LCD work
properly ?
NO
Replace LCD module
YES
LCD working well !
- 73 -
4. TROUBLE SHOOTING
4.9 Camera Trouble
TEST POINT
FL605
FL607
FL609
FL608
Q501
U503
Figure 4-16(a). Camera Trouble
Camera Module
Connector
( 20Pin, male )
Camera Module
Figure 4-16(b). Camera Trouble
- 74 -
4. TROUBLE SHOOTING
CHECKING FLOW
START
Does the LCD itself
Has no trouble ?
NO
Go to the LCD trouble
Replace the U503
NO
YES
Change the camera
module, Does it work
properly ?
NO
Check the voltage
of pin 3 of
U406 is 3V ?
NO
Check the voltage
of pin 1 of
Q501 LOW ?
YES
YES
YES
Replace the Q501
Itís camera moduleís problem
Replace the camera module
NO
Check the voltage of pin 22 of
CN601 if 3V ?
NO
Check the soldering
of CN601 ?
Replace the Q501
YES
Does the image
appears on LCD ?
YES
Camera will work properly
NO
Check the signals of the
FL605~FL608
YES
Replace
FL605~FL608
YES
Check the signals of the
FL605~FL608
YES
Camera will work properly
- 75 -
4. TROUBLE SHOOTING
4.10 Speaker Trouble
Checking Flow
C246
(SPOUT2)
C245
(SPOUT1)
U207
Soldering Check
Figure 4-17(a). Speaker Trouble
CIRCUIT
1V8_MIDI_CORE
2V85_VCAM
64 POLY MIDI IC(MP3 Ringtone)
VBAT
FB201
C221
4.7u
DATA05
DATA06
DATA07
H4
F1
E3
J5
G4
G3
J2
H2
G2
H1
J1
F3
G1
F2
J6
H5
G5
G7
J8
H8
H7
J7
E7
H6
C8
C1
B2
VREF
SPVDD
D7
EXC
EXTOUT
BBL
HPOUTL
BBR
U207
YMU792
MTR
MTR_G7
(EUSY0291001)
LED0
LED1
LED2
HPOUTR
HPC
EQ1
EQ2
_IRQ
EQ3
GPIO
EXTIN
SPVSS
TESTI0
TESTI1
TESTI2
TESTI3
INDEX
B8
F6
RXIN
RXIN_C3
MCLK
HPVSS
D6
G6
C7
SPOUT1
SPOUT1_B7
AVSS
E6
BCLK
LRCK
SDIN
A5
F8
C2
A2
C6
B5
B6
C251
C5
SPKP_P
0.1u
SO
SMODE
IFSEL
SPOUT2
G8
F7
C228
0.1u
C227
0.1u
TXOUT
_CS__SS
A0
A1
_WR_SCK
_RD_SI
D0
D1
D2
D3
D4
D4_H1
D5
D6
D7
B1
_MIDI_IRQ
_RST
CLKI
PLLC
AVDD
E8
C250
100p
E2
D2
DVSS1
DVSS2
DVSS3
C235
2200p
_MIDI_CS
ADD00
ADD01
_WR
_RD
DATA00
DATA01
DATA02
DATA03
DATA04
0
D1
R230
6.8K
R229
DVDD1
E1
DVDD2
J3
DVDD3
D3
_MIDI_RST
26MHz
C222
0.1u
C226
0.1u
IOVDD1
H3
IOVDD2
C225
4.7u
C224
4.7u
D8
J4
C223
0.1u
A6
R242
20K
B3
B4
A3
R234
C241
24K
0.01u
R239
82K
A4
C242
390p
A7
SPK_N
B7
SPK_P
A8
C243
C3
A1
R241
SPKP_P
22n
NA
C4
D4
C244
47p
C245
47p
C246
47p
Figure 4-17(b). Speaker Trouble
- 76 -
C247
0.033u
4. TROUBLE SHOOTING
CHECKING FLOW
START
Voltage across C223
= 1.8V?
No
Check the soldering of
C223
Yes
Yes
Re-soldering
C223
Check the soldering of
C245, C246
No
Re-soldering
C245, C246
Yes
Check the signal level of
C245, C246
No
Re-solder C245,
C246 or Replace
U207
Yes
Check the state of
contact of dual mode speaker
No
Replace speaker
Yes
Speaker
Working well!!
- 77 -
No
Replace C223
4. TROUBLE SHOOTING
4.11 SIM Card Interface Trouble
TEST POINT
J301
Figure 4-18(a). Sim Card Interface
CIRCUIT
2V85_VSIM
2V85_VSIM
1
VCC
2
RST
3
CLK
22p
1000p
C325
C326
(KDS, 1.6T)
C324
NA
SIM_RST
SIM_CLK
220n
SIM_DATA
J301
4
GND
5
VPP
6
I_O
C318
R369
20K
SIM CONNECTOR
Figure 4-18(b). Sim Card Interface
- 78 -
4. TROUBLE SHOOTING
CHECKING FLOW
START
Does the SIM cards
supports 3V ?
NO
Change the SIM Card. Our phone
supports only 3V SIM card.
YES
Voltage at pin1 of
J301 is 2.85V?
NO
Voltage output
of VSIM LDO
Is 2.85V?
YES
Resolder J301
YES
YES
Replace J301
Change the SIM Card
And try again.
Does it work
Properly?
YES
Change SIM Card
NO
Redownload SW.
Does it work
Properly?
YES
SIM Card will be detected.
- 79 -
NO
Change the main board
4. TROUBLE SHOOTING
4.12 Earphone Trouble
TEST POINT
C214
C201
U201
J201
Figure 4-19(a). Earphone Trouble
CIRCUIT
2V8_VEXT
2V5_JACK
2V5_JACK
U201
CLOSE TO EARJACK
1
R201
1K
R204
1.5K
C203
GND
2
NC
Vin VOUT
3
NCP563Q25T1
AUXIN
C202
10u
(1608)
C201
0.1u
HOOK_DETECT
0.1u
(GPIO_39)
C209
NA
4
C206
22u
J201
C214
AUXOP
AUXIP
R225
1M
C220
39p
Figure 4-19(b). Earphone Trouble
- 80 -
EVL5M02200
C219
39p
VA203
0.1u
EVL5M02200
C216
VA204
JACK_DETECT
(GPIO_45)
33u
7502-2.5G-SB1-A
(3 pole, ENJE0003501)
4. TROUBLE SHOOTING
CHECKING FLOW
START
Resolder J201
Does the audio
profile of the phone
change to the
earphone mode?
Resolder component
Set the audio part of the test
Equipment to echo mode
Change the earphone
and try again
Set the audio part of
the test equipment to
PRBS or continuous
wave mode
Download software
NO
Can you hear your
voice from
the earphone?
YES
YES
No
YES
YES
Change earphone
Earphone will work properly
Can you hear
the sound from
the earphone?
Can you hear your
voice from
the earphone?
Download software.
Does it work well?
NO
Change the main board.
- 81 -
Voltage at
C214
=1.2V ?
YES
Check soldering
C214
YES
Change the main board.
4. TROUBLE SHOOTING
4.13 KEY backlight Trouble
TEST POINT
Figure 4-20(a). KEY Backlight Trouble
- 82 -
R328
12K
C316
27p
R329
10
R330
10
Is the level at R325
High?
Are all LEDs
Working?
4
5
12K
3
R325
2
C306
C307
NO
YES
Backlight will work properly.
- 83 C315
27p
R326
10
Q301
R327
10
UMX1NTN
Figure 4-20(b). KEY Backlight Trouble
CHECKING FLOW
START
NO
Check U102
YES
Check the soldering
each R and LED
NO
Replace or resoldering
component
R316
R315
R314
R313
R312
R311
C314
C313
C312
C311
C310
C309
C308
LD314
LEBB-S14H
LD313
LEBB-S14H
LD312
LEBB-S14H
LD311
LEBB-S14H
LD310
LEBB-S14H
R310
75
75
75
75
75
75
75
1u
1u
1u
1u
1u
1u
1u
R309
75
R308
75
R307
75
R306
75
R305
75
R304
75
KEY BACKLIGHT
LD309
LEBB-S14H
LD308
LEBB-S14H
LD307
LEBB-S14H
LD306
LEBB-S14H
LD305
LEBB-S14H
LD304
LEBB-S14H
LD303
LEBB-S14H
LD302
LEBB-S14H
R303
75
1u
1u
C305
VBAT
6
1
KEY_BACKLIGHT
LD301
LEBB-S14H
1u
1u
C304
1u
1u
C303
1u
C302
C301
4. TROUBLE SHOOTING
CIRCUIT
VBAT
4. TROUBLE SHOOTING
4.14 Receiver Trouble
TEST POINT
R110
C140
R109
C139
Figure 4-21(a). Receiber Trouble
CIRCUIT
T8
R8
M2
N15
AGND1
SGND1
SGND2
DGND
LGND
AOUT1P
AOUT1N
AOUT2P1
AOUT2P2
AOUT2N1
AOUT2N2
AOUT3P
AOUT3N
GPI
R109
J15
K15
R11
T11
T9
R9
J16
K16
C2
C142
39p
4.7
RCV_P
C138
39p
SPKP_P
RCV_N
R110
4.7
AUXOP
C139
39p
C143
39p
C144
39p
Figure 4-21(b). Receiver Trouble
- 84 -
C140
39p
4. TROUBLE SHOOTING
CHECKING FLOW
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.
START
Does waveform at
R109 and R110
fluctuate?
NO
Replace main board
YES
Is CN601 connected
properly?
NO
Reassemble CN601
YES
Is receiver connected
Properly?
NO
Resoldering receiver
YES
Receiver will work properly.
- 85 -
4. TROUBLE SHOOTING
4.15 Microphone Trouble
TEST POINT
C133
C218
C217
C134
R202
Figure 4-22(a). Microphone Trouble
CIRCUIT
2V5_VMIC
R202
1K
R206
2.2K
R210
C211
100
0.1u
C217
39p
C218
39p
VA201
R221
2.2K
CLOSE TO MIC
Figure 4-22(b). Microphone Trouble
- 86 -
VA202
R217
C215
EVL5M02200
C212
39p
39p
VINNORN
MIC
100
EVL5M02200
VINNORP
C204
10u
C208
39p
(BSE, -42dB, FPCB Type)
4. TROUBLE SHOOTING
CHECKING FLOW
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
START
Voltage across R202
= DC 2.5V ?
NO
Voltage VMIC of U101
= DC 2.5V?
YES
YES
Resolder R202 & R206.
Check the signal
Level at each side
of MIC.
Is it a few tens
mV AC?
NO
Replace microphone
YES
Check the soldering of
R210, R217,
C211, C215
NO
Resolder component
YES
Microphone will work
properly.
- 87 -
NO
Replace U101
4. TROUBLE SHOOTING
4.16 RTC Trouble
TEST POINT
X101
R106
Figure 4-23(a). RTC Trouble
CIRCUIT
C127
NA
X101
3
2
MC-146
32.768KHz
R115
NA
_MIDI_CS
_LCD_CS
_SUB_CS
R114
4
1
0
C128
R106
10M
T5
NGPCS1
V6
NAUXCS1
N9
GPIO_42_NMAIN_LCD_CS
V7
GPIO_43_NSUB_LCD_CS
1000p N10
CLKON
C129
NA
_RESET
BT_EN
Figure 4-23(b). RTC Trouble
- 88 -
P13
C9
E9
F9
V3
CLKIN
CLKON
OSCOUT
OSCIN
PWRON
NRESET
L18
GPIO_0_IRDA_TX
L14
GPIO_1_IRDA_RX
K16
GPIO_2_NIRDA_EN
4. TROUBLE SHOOTING
4.17 Folder on/off Trouble
TEST POINT
C522
U504
C521
Figure 4-25(a). Folder On/Off Trouble
CIRCUIT
2V8_VEXT
R510
FLIP
100K
OUT
C522
10p
GND
C521
0.1u
VDD
U504
A3212ELH
C520
330p
Figure 4-25(b). Folder On/Off Trouble
- 89 -
5. DOWNLOAD AND CALIBRATION
5. DOWNLOAD AND CALIBRATION
5.1 Download Setup
5.1.1 In case of using the Data kit
Figure 5-1 Describes Download Setup
Preparation
• Target Handset
• Data kit
• Battery
• IBM compatible PC supporting RS-232 with Windows 98 or newer
If you use data kit, you should have a battery with the voltage above 3.7V.
5.1.2 In case of using the PIF
Preparation
• Target Handset
• PIF
• RS-232 Cable and PIF-to-Phone interface Cable
• TA/Power Supply or Battery
• BM compatible PC supporting RS-232 with Windows 98 or newer
If you use battery, you should have a battery with the voltage above 3.7V.
- 90 -
5. DOWNLOAD AND CALIBRATION
5.2 Download Procedure
5.2.1. Computer Program file -> MultiGSM.exe Click
- 91 -
5. DOWNLOAD AND CALIBRATION
5.2.2. Click the “Setting” button.
Then, choose Configuration which is going to download.
- 92 -
5. DOWNLOAD AND CALIBRATION
5.2.3. Configuration Setting
C:\GSMULTI\Model\MG210.dll
- 93 -
5. DOWNLOAD AND CALIBRATION
5.2.4. Press “Start Button”.
KG245
- 94 -
5. DOWNLOAD AND CALIBRATION
5.2.5. After “Start Button”, Which Stand-by condition
KG245
- 95 -
5. DOWNLOAD AND CALIBRATION
5.2.6. SW downloading Condition.
KG245
- 96 -
5. DOWNLOAD AND CALIBRATION
5.2.7. SW downloading END Condition.
KG245
- 97 -
5. DOWNLOAD AND CALIBRATION
5.3 SERVICE AND CALIBRATION
5.3.1. Calibration
A. Equipment Setup
GSM Test Set(8960)
GPIB Cable
Mobile Switch Cable
Power Supply
Battery Simulator
GPIB
Cable
PC
Jig
TA
Figure 5-2 Calibration Equipment List
- 98 -
5. DOWNLOAD AND CALIBRATION
B. RF Calibration Program
1. Execute
"Hot_KimchiD.exe"
2. Click on "APPLY" button.
KG245
KG245
3. Click on "CALIBRATION
START"
- 99 -
5. DOWNLOAD AND CALIBRATION
4. Click on "CALIBRATION
START" button.
KG245
KG245
- 100 -
5. DOWNLOAD AND CALIBRATION
6. BLOCK DIAGRAM
- 101 -
- 102 -
7. CIRCUIT DIAGRAM
2
1
3
5
4
6
7
8
9
10
GUIDE HOLE
1V8_VCORE
OJ101
1V8_VRTC
OJ102 OJ103 OJ104
_ROM_CS1
_ROM_CS2
_WR
_LBS
_UBS
_RD
_WAIT
1
MC-146
32.768KHz
C129
NA
1000p N10
P13
C9
E9
F9
V3
CLKON
_RESET
RPWRON
VIBRATOR
2
3
FLIP
1
R107
D102
100K
KDR331E
FB101
SPK_RCV_SEL
_BT_RST
_F_WP
DSR
_MIDI_RST
CHG_DET
LCD_RESET
OLED_ON
D
R111
0
B18
A18
C16
A17
C15
K5
T7
T8
E11
A12
KEY_ROW5
HOOK_DETECT
_MIDI_IRQ
CAM_INT
CAM_RST
JACK_DETECT
CAM_HOLD
BOOTCTRL1
BOOTCTRL0
R112
0
BOOT MODE
L
L
BYPASS
L
H
UART BOOT
H
L
USB BOOT INT CLOCK
H
H
USB BOOT EXT CLOCK
D15
E14
A16
E13
A15
F13
A14
C14
C13
A13
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
2
C120
47p
_RESET
200
C124
NA
NA
KEY_ROW0
POWERKEY
RPWRON
CLKON
JTAGEN
TCK
T11
L11
V12
P12
V13
T1
T13
T14
R7
A2
T12
D1
L1
J2
M1
ABB_IRQ
CLKOUT
ABB_IRQ
CLKOUT
MCLKEN
ABBRESET
TDI
TMS
B2
B1
A1
C1
R113
TDO_0
0
RXON
TXON
ASM
C8
E8
A7
C7
K1
K2
J1
RESET
KEYOUT
KEYON
DBBON
VCXOEN
NC_T12
INT
MCLK
MCLKEN
ABBRESET
GPO_2
GPO_3
GPO_4
GPO_7
GPO_8
GPO_9
GPO_10
GPO_11
GPO_16
GPO_17
GPO_18
GPO_19
GPO_20
GPO_21
DPLUS
DMINUS
GPIO_35
GPIO_36
GPIO_37
GPIO_38
GPIO_39
GPIO_40
GPIO_45
GPIO_46
GPIO_55
GPIO_56
GPIO_22
GPIO_49
GPIO_50
GPIO_51
GPIO_52
GPIO_53
GPIO_54
GPIO_23_SIM_RESET
GPIO_24_SIM_EN
GPIO_47_SIM_VSEL
SIMCLK
SIMDATAIO
KEYPADROW0
KEYPADROW1
KEYPADROW2
KEYPADROW3
KEYPADROW4
USC0
USC1
USC2
USC3
USC4
USC5
USC6
C6
E6
J9
C5
A3
A2
C4
B1
A1
C3
V14
T13
T14
T15
V16
V17
V18
R16
T16
T18
P16
U18
R18
P18
H1
H2
L2
G2
F1
E2
G1
D2
E1
F2
SYNTH_EN
ONNOFF
RF_PWR_DWN
BATT_TEMP
ANT_SW1
RF_RST
ANT_SW2
PA_EN
PA_BAND
PCM_EN
S_EN
S_DATA
S_CLK
3
C130
1u
A16
C16
B15
C136
C137
1u
1u
A10
B11
R108 82K
(1%)
LCD_ID
L16
M15
M16
C141
0.1u
T9
L10
A11
J10
E10
H10
C10
F10
A10
V9
V11
P11
T10
V10
N18
N14
M16
N13
M18
L16
M13
B6
D15
A8
B9
A9
B10
VBAT
2V8_VEXT
2V5_VMIC
2V75_VVCXO
2V85_VSIM
2V75_VABB
1V8_VRTC
1V8_VCORE
A
R102
1K
BACK_BATT
VCORE1
VCORE2
VMEM1
VMEM2
VRTC
VSIM
VABB
VMIC
VVCXO
NC_E15
VEXT1
VEXT2
VBAT_NET
NC_E16
NC_F16
C113
P1
N1
T3
T2
T7
T6
H16
N16
D16
E15
A4
B4
T4
E16
F16
1u
C114
1u
C115
C116
0.1u
1u
C117
C118
C119
2.2u (1608)
1u
1u
C122
1u
B
NC_T15
NC_R1
VMEMSEL
GND_NET1
NC_G16
TCK
TMS
TDI
TDO
NC_B7
NC_B5
U101
AD6537BABCZ
RXON
TXON
ASM
2V8_VMEM
N2
P2
R2
R6
F15
VBAT1
VBAT2
VBAT3
NC_R6
GND_NET2
C121
0.068u
R103
C123
IP
IN
QP
QN
AFCDAC
PA
SPWR1
SPWR2
A12
A13
A15
A14
B14
B12
IP
IN
QP
QN
AFC
TX_RAMP
R10
T10
R101
0
C15
G15
H15
A3
B3
R5
R4
A4
H9
E7
A6
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
VBATSENSE
VCHG
ISENSE
GATEDRIVE
T15
R1
VBAT
R3
T5
G16
VCHARGE
B7
B5
C126
R104
0.2
(1%)
B8
A5
A7
A6
1u
D101
R105
330
Q101
3
CSDO
CSDI
CSFS
BSDI
BSIFS
BSDO
BSOFS
ASDO
ASDI
ASFS
C125
4.7u
(2012)
CUS02
2
1
G
S
D3
D4
D2
D5
D1
D6
5
6
7
8
TPCF8102-TE85L-F
AIN3L
AIN3R
AIN2P
AIN2N
AIN1P
AIN1N
NC_R12
R13
R14
P15
R15
P16
R16
R12
NC_A16
NC_C16
REF
C
AUXIP
AUXIN
VINNORP
VINNORN
C131
C132
C133
C134
39p
39p
39p
39p
REFBB
REFOUT
CLOSE TO AD6537B
BATTYPE
REFCHG
TEMP2
TEMP1
AUXADC2
AUXADC1
AOUT1P
AOUT1N
AOUT2P1
AOUT2P2
AOUT2N1
AOUT2N2
AOUT3P
AOUT3N
GPI
LIGHT1
LIGHT2
LIGHT3
R109
J15
K15
R11
T11
T9
R9
J16
K16
C2
C142
39p
4.7
RCV_P
C138
39p
SPKP_P
R110
RCV_N
4.7
AUXOP
C139
39p
C143
39p
C140
39p
D
C144
39p
IFMODE
SIM_RST
C_FLASH
Section
SIM_CLK
SIM_DATA
USC0
USC1
USC2
USC3
USC4
USC5
USC6
Date
Sign & Name
Designer
Park Sung Gil
Checked
Jung Jae Won
Approved
Iss.
1
C112
47n
VBAT1-1
VBAT2-1
VBAT2-2
VBAT3-1
VBAT3-2
VBAT4
VBAT5
V8
A8
VDDRTC
N11
AD6527BABCZ
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
GPIO_8
GPIO_9
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
KEYPADCOL0
KEYPADCOL1
KEYPADCOL2
KEYPADCOL3
KEYPADCOL4
VDDUSB
VSIM
C11
D16
F12
F14
K11
R15
T12
E3
H1
M3
T3
T6
A5
U102
D4
E12
F7
F11
H5
H11
H13
K8
K10
K13
L13
M5
N5
N12
N16
P7
V15
GPIO_55 GPIO_56
CLKIN
CLKON
OSCOUT
OSCIN
PWRON
NRESET
C111
22p
4
CSDI
CSDO
CSFS
BSDO
BSOFS
BSDI
BSIFS
ASDI
ASDO
ASFS
G13
GPO_22_KEY_BACKLIGHT
D18
GPO_23_LCD_BACKLIGHT
KEY_BACKLIGHT
LCD_DIM_CTL
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
E
GPO_0_RXON
GPO_1_TXON
GPO_5_ARSM
GPO_6_ATSM
E16
GPIO_33_DEBUG_RX
C18
GPIO_34_DEBUG_TX
DEBUG_RX
DEBUG_TX
2V8_VMEM
K18
K14
J16
J18
H16
J14
H18
G16
J13
G18
H14
G14
F16
F18
E18
L3
L6
L1
L8
M1
L5
N3
N1
P3
N6
P1
R3
R1
N7
P6
T1
TDO_1
L18
GPIO_0_IRDA_TX
L14
GPIO_1_IRDA_RX
K16
GPIO_2_NIRDA_EN
BT_EN
RPWRON
JTAGEN
GPIO_18_TCK
GPIO_19_TMS
GPIO_20_TDI
GPIO_21_TDO
VSSRTC
2
C128
R106
10M
NRAMCS1
NRAMCS2
NROMCS1
GPIO_44_NROMCS2
NWE
NLWR
NHWR
NRD
T5
NGPCS1
V6
NAUXCS1
N9
GPIO_42_NMAIN_LCD_CS
V7
GPIO_43_NSUB_LCD_CS
_MIDI_CS
_LCD_CS
_SUB_CS
R114
0
GPIO_48_ABB_IRQ
CLKOUT
CLKOUT_GATE
GPO_29_ABBRESET
VSSUSB
R115
NA
C127
NA
C110
22u
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
T4
NADV
V2
NWAIT
V4
BURSTCLK
26MHz
4
VBAT
AGND01
AGND02
AGND03
AGND04
AGND05
AGND06
AGND07
AGND08
AGND09
AGND010
AGND011
AGND012
AGND013
AGND014
AGND015
AGND016
AGND017
AGND018
AGND019
AGND020
AGND021
AGND022
AGND023
AGND024
AGND025
AGND026
AGND027
AGND028
AGND029
AGND030
AGND031
AGND032
AGND033
AGND034
AGND035
AGND036
AGND037
AGND4
AGND3
AGND2
AGND1
SGND1
SGND2
DGND
LGND
_RAM_CS1 V5
P8
N8
P9
R4
V1
U1
P5
_RAM_CS1
_ROM_CS1
_ROM_CS2
_WR
_LBS
_UBS
_RD
3
2V85_VCAM
VBAT
0.1u
B13
E5
E6
E7
E10
E11
E12
F5
F6
F7
F10
F11
F12
G5
G6
G7
G10
G11
G12
K5
K6
K7
K10
K11
K12
L5
L6
L7
L10
L11
L12
M5
M6
M7
M10
M11
M12
T16
L15
A11
B16
T8
R8
M2
N15
DSR
USC5
USC4
ADD0
ADD1
ADD2
ADD3
ADD4
ADD5
ADD6
ADD7
ADD8
ADD9
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22
ADD23
VEXT2-1
C1
E5
D3
F6
D1
F5
G6
E1
G5
F3
H8
F1
G3
G1
H3
J6
J8
J3
J5
J1
K6
K3
K1
K9
ADD00
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22
ADD23
B
X101
C109
MODEL
BEETLE
Sheet/Sheets
(KG245)
1/6
DRAWING
NAME
AD6527/AD6537B
DRAWING
NO.
REV.1.0
A9
RTS
CTS
RPWRON
P10
NC4
C108
47n
C107
47n
C106
0.1u
VEXT1-1
VEXT1-2
VEXT1-3
VEXT1-4
VEXT1-5
VEXT1-6
NC2
NC3
DSR
C
2V8_VMEM 2V85_VSIM
USC_1
USC_2
VINT
VBAT
PWR
URXD
UTXD
VBAT
C105
0.1u
C103
0.1u
VMEM1
VMEM2
VMEM3
VMEM4
VMEM5
TX
NC1
ON_SW ON_SW
C104
0.1u
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
RX
C102
0.1u
C12
F8
H6
J11
L9
M6
M14
P14
GND
1
2
3
4
5
6
7
8
9
10
11
12
VCC1
VCC2
VCC3
VCC4
VCC5
VCC6
VCC7
VCC8
A
C101
47n
2.5G
GND
RX
TX
UFLS
2V8_VEXT
VBAT
UART1
3G
2V8_VMEM
4
Notice No.
Date
Name
LG Electronics Inc.
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 103 -
7. CIRCUIT DIAGRAM
1
2
3
5
4
2V8_VEXT
2V5_JACK
6
7
8
9
10
2V5_JACK
2V5_VMIC
U201
AUXIN
0.1u
C202
10u
(1608)
(GPIO_39)
C206
22u
C209
NA
R202
1K
3
NCP563Q25T1
C201
0.1u
HOOK_DETECT
4
C210
1u
R209 ERHY0007007
15 (1%,1/8W)
R206
2.2K
JACK_DETECT
L
INSERT
H
REMOVE
VINNORP
AUXOP
6
33u
R215
ONNOFF
JACK_DETECT
(GPIO_45)
10K
AUXIP
C220
39p
2
4
3
R217
100
3
R220
2
7.5K
1
VINNORN
Q202
C215
0.1u
2SC5585
R221
2.2K
R226
20
R223
10K
MIC
C212
39p
39p
UMX1NTN
7502-2.5G-SB1-A
(3 pole, ENJE0003501)
100
C211
1
5
R210
C204
10u
C208
39p
C217
39p
C218
39p
VA201
R225
1M
VA203
C219
39p
EVL5M02200
EVL5M02200
0.1u
VA204
C216
R216
1K
Q201
J201
C214
AA
EVL5M02200
R204
1.5K
C203
NC
Vin VOUT
EVL5M02200
GND
2
1K
(BSE, -42dB, FPCB Type)
VA202
1
R201
VBAT
VCHG_LED
CLOSE TO EARJACK
A
VCHARGE
BB
B
CLOSE TO MIC
VBAT
64 POLY MIDI IC(MP3 Ringtone)
VBAT
U204
FB201
C250
100p
DATA05
DATA06
DATA07
H4
F1
E3
J5
G4
G3
J2
H2
G2
H1
J1
F3
G1
F2
J6
H5
G5
G7
J8
D
H8
H7
J7
_MIDI_IRQ
E7
H6
B2
BBL
HPOUTL
BBR
SO
SMODE
IFSEL
U207
YMU792
MTR
MTR_G7
(EUSY0291001)
LED0
LED1
LED2
HPOUTR
HPC
EQ1
EQ2
_IRQ
EQ3
GPIO
SPOUT1
SPOUT1_B7
RXIN
RXIN_C3
L201
NA
C6
B5
C231
2.2u
C233
2.2u
C230
15p
RECEIVER
H
SPEAKER
C
C234
15p
2V8_VBT
2V8_VMEM
C236
0.1u
B6
C251
C5
1
PCM_TX
A6
3
USC3
PCM_SYNC8
C240
0.1u
GND
U205
R242
20K
C237
NA
VCC
4
SPKP_P
2
TC7SH08FS
B3
C2
PCM_EN
B4
A3
R234
C241
24K
0.01u
R239
82K
A4
SPVSS
HPVSS
EXTIN
INDEX
IN1
NO1
A2
C3
USC1
C242
390p
NO2
COM1
NC1
COM2
NC2
C1
A1
10K
PCM_RX
1
2
7
8
9
10
28
RESETB
GND1
GND2
GND3
GND4
UART_TX
UART_RX
UART_RTS
UART_CTS
NC
PCM_TX
USC_1
USC_2
13
14
12
15
VDD_1_8V
VDD_DIG
VDD_VREGIN
PIO0
PIO1
PIO2
PIO3
PIO4
PIO5
SPI_CLK
SPI_CSB
SPI_MOSI
SPI_MISO
U206
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
22
21
3
4
6
11
25
27
24
23
26
19
17
18
20
L202
22nH
R232
R233
C249
15p
47
47
C238
2.2u
C239
2.2u
DEBUG_RX
DEBUG_TX
D
R235
R236
R237
R238
47
47
47
47
PCM_TX
PCM_RX
PCM_SYNC8
USC0
M201
MAX4717EBC-T
SPK_N
B7
C4
A4
IN2
A3
USC2
A7
16
_BT_RST
5
LBMA-2C67B2
SPK_P
A8
C243
C3
A1
R241
SPKP_P
22n
NA
Section
C4
C244
47p
C245
47p
C247
0.033u
C246
47p
Date
Sign & Name
Designer
D4
Checked
Approved
Iss.
2
GND2
(SNGF0008801)
2V8_VBT
L
E
1
C248
NA
A2
B8
A5
AVSS
MCLK
D1
G6
C7
BCLK
LRCK
SDIN
TESTI0
TESTI1
TESTI2
TESTI3
4
6
5
AMAN542015LG02
BH28FB1WHFV
C232
0.1u
C2
R240
B1
F6
BT_EN
3
2
1
C229
0.1u
DVSS1
DVSS2
DVSS3
D6
R228
330
SPK_RCV_N
GND1
FEED
0
VIN
VOUT
GND BGND
STBY
NC
SPK_RCV_SEL
EXTOUT
D8
J4
F8
E6
A3
B1
C8
C1
D7
EXC
SPOUT2
G8
F7
COM2
ANT201
R227
SPK_RCV_P
COM1
1u
TXOUT
_CS__SS
A0
A1
_WR_SCK
_RD_SI
D0
D1
D2
D3
D4
D4_H1
D5
D6
D7
NC2
2V8_VBT
U203
C3
VREF
_RST
CLKI
PLLC
A1
VBAT
5
C235
2200p
_MIDI_CS
ADD00
ADD01
_WR
_RD
DATA00
DATA01
DATA02
DATA03
DATA04
E2
D2
IN2
NC1
RCV_N
SPK_RCV_SEL
A2
ANT
R230
6.8K
0
AVDD
R229
SPVDD
D3
_MIDI_RST
26MHz
DVDD1
E1
DVDD2
J3
DVDD3
E8
IOVDD1
H3
IOVDD2
C
C228
0.1u
NO2
C1
RCV_P
BLUETOOTH
C2
IN1
NO1
A4
SPK_N
C227
0.1u
V+
C4
SPK_P
C226
0.1u
B4
C225
4.7u
V+
C224
4.7u
GND
C223
0.1u
C222
0.1u
B4
MAX4684EBC_T
C221
4.7u
GND
2V85_VCAM
B1
1V8_MIDI_CORE
3
4
Notice No.
Date
Name
LG Electronics Inc.
MODEL
BEETLE
Sheet/Sheets
(KG245)
2/6
DRAWING
NAME
AUDIO / BLUETOOTH
/ PRECHARGE
DRAWING
NO.
REV.1.0
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 104 -
7. CIRCUIT DIAGRAM
9
10
KEY BACKLIGHT
SW310
SW311
LEFT
SW312
1u
1u
1u
1u
1u
1u
75
C314
C313
C312
C311
C310
C308
C309
75
LD314
LEBB-S14H
75
1u
AA
R316
R315
R314
LD312
LEBB-S14H
R313
LD311
LEBB-S14H
LD313
LEBB-S14H
75
75
R311
R312
LD310
LEBB-S14H
R310
LD309
LEBB-S14H
LD308
LEBB-S14H
LD307
LEBB-S14H
R308
75
R309
75
R307
75
LD306
LEBB-S14H
R306
75
R305
75
R304
75
1u
75
VBAT
75
SW313
LD304
LEBB-S14H
3
LD303
LEBB-S14H
2
LD302
LEBB-S14H
1
SW309
R303
75
C307
680
LD301
LEBB-S14H
1u
1u
C306
1u
SW308
KEY_ROW0
R323
8
C305
C304
FAV
SW307
1u
CLR
100
1u
R321
C303
100
1u
VA303
R320
C302
100
C301
R319
EVL14K02200
R318
100
VA302
END
A
R322
7
VOL_DOWN
EVL14K02200
680
6
VBAT
VA305
R302
5
Side Key
EVL14K02200
MENU
680
KEY_ROW1
Q301
SW317
6
SW318
UP
SEL
R325
KEY_BACKLIGHT
R324
4
SW316
5
680
12K
1
KEY_ROW2
5
SW315
3
4
2
SW314
SW319
7
SW320
SW321
8
SW322
9
SW323
RIGHT
R331
R328
12K
SEND
B
R329
10
C316
27p
C315
27p
6
POWERKEY
VOL_UP
CAMERA
CN602
1
2
3
4
5
SW306
4
VA301
R301
10K
3
LD305
LEBB-S14H
2
VBAT
EVL14K02200
1
R326
10
R327
10
UMX1NTN
R330
10
680
KEY_ROW3
SW328
CONF
680
KEY_ROW4
I/O CONNECTOR
R350
20
KEY_COL4
R334
47K
2
R375
100K
2V8_VMEM
E
_RD
_WR
_LBS
_UBS
_ROMCS1
_RAM_CS1
_F_WP
_RESET
_WAIT
R376
100
H3
C6
C4
D4
D6
H2
J2
C5
D5
E5
_OE
_WE
R__LB
R__UB
R_CE2
F__CE
R__CE1
_WP_ACC
F__RST
RY__BY
NA
NA
NA
NA
NA
NA
NA
NA
100K
R348
R335
R336
R337
R338
R339
R340
R341
R342
100K
4
3
2V8_VMEM
6
MOTOR
2
USC5
2V8_VMEM
USC4
DEBUG_RX
47
R362
NA
R363
R364
47
47
R365
R366
47
47
R367
47
R368
R370
47
47
R369
20K
B2
B3
B4
B5
B6
B7
B8
B9
C2
C9
F5
G5
G6
G8
H9
SIM_DATA
J301
4
GND
5
VPP
6
I_O
1
VCC
2
RST
3
CLK
(KDS, 1.6T)
C324
NA
Section
Date
Sign & Name
Designer
Checked
5
D
39p
EVL5M02200
3p
10p
EVL14K02200
39p
R373
47K
CHG_DET
R374
47K
SIM_RST
SIM_CLK
SIM CONNECTOR
4
C323
C330
0.1u
1
2
C322
C329
0.1u
CN396
10u
C327
1u
Approved
LG Electronics Inc.
3
NA
R361
C
26
EVL5M02200
1
2
2V85_VSIM
2V85_VSIM
G3
VSS1
J9
VSS2
RFU1
RFU2
RFU3
RFU4
RFU5
RFU6
RFU7
RFU8
RFU9
RFU10
RFU11
RFU12
RFU13
RFU14
RFU15
R359
CN395
BATT_TEMP
C331
1000p
1
USC3
DEBUG_TX
C317
4.7u
J6
A1
DNU1
A10
DNU2
M1
DNU3
M10
DNU4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
5
2
1
EMZ2
7.5K
VA309
_ROMCS1
GND
RFU16
RFU17
RFU18
RFU19
RFU20
RFU21
RFU22
RFU23
RFU24
RFU25
R357
C320
4
3
_ROM_CS1
K2
K6
K9
L2
L3
L4
L6
L7
L8
L9
47
1.5K
F_VCC1 J5
F_VCC2 L5
R_VCC
R360
USC_2
VA308
U302
R351
220
47
100
C319
5
VCC
VIBRATOR
22p
1
Q302
R353
1000p
TC7SH08FS
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
C326
C328
0.1u
U301
J3
G4
K4
H5
H6
K7
G7
J8
K3
H4
J4
K5
J7
H7
K8
H8
220n
2V8_VMEM
D
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
C325
(Spansion,256+64,11.6*8)
(EUSY0288701)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
C318
G2
F2
E2
D2
F3
E3
D3
C3
C7
E7
F7
C8
D8
E8
F8
D9
G9
F4
E4
D7
E6
E9
F9
F6
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22
ADD23
_ROM_CS1
MEMORY
R358
RPWRON
USC_1
USC0
USC6
S71PL256NC0_TLA084
R355
(KSD, Offset Type, 24pin)
680
CN301
25
DSR
R356
_ROM_CS2
R347
680
KEY_COL3
100K
C
VBAT
100K
R354
VIBRATOR
VBAT
R345
680
KEY_COL2
R346
680
R352
USC1 RX
RXD
TXD
USC2 TX
RTS/CTS(PC)
USC4
CTS/RTS(PC)
USC5
USC6 RESET
-
100K
R349
KEY_COL1
VCHARGE VBAT
2V8_VEXT
-
R344
VA306
680
KEY_COL0
VA307
680
KEY_ROW5
R343
UART
DAI
USC0 CLOCK
EVL14K02200
R333
PIN
T
EVL14K02200
SW329
TDO_1
TDI
TCK
TMS
_RESET
JTAGEN
DOWN
2V8_VEXT
2V8_VMEM
SW327
#
C321
R332
SW326
SW325 0
*
VA310
SW324
6
LGIC(42)-A-5505-10:01
MODEL
DRAWING
NAME
DRAWING
NO.
BEETLE
Sheet/Sheets
(KG245)
3/6
MEMORY, MMI, I/O
REV.1.0
7
LG Electronics Inc.
- 105 -
7. CIRCUIT DIAGRAM
1
2
4
3
5
6
7
8
10
9
VBAT
ANT400
ANT401
ANT402
R605
100
R606
100
PA_BAND
(GPIO_17)
PA_EN
(GPIO_16)
A
A
C401
0.01u
C400
18p
C403
12p
C402
33p
C404
22u
C405
27p
1p
C407
C406
27p
PGND
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
21
16
14
13
12
10
9
8
7
5
L407
5.6nH
NA
L400
19
U400
VBATT
VCC1B
6
VCC1A
2
20
G2
DCS_PCS_IN
17
ANT
L406
15nH
GSM_IN
SKY77328
C408
R403
4
24
33p
R405
220
R404
220
3
C411
22p
C412
0.1uF
C413
100p
B
RF
G1
15
C410
NA
KMS-506
GSM_OUT
DCS_PCS_OUT
VAPC
SW400
B
11
C409
8p
2V8_VEXT
RF2V85
BS
1
ENABLE
18
RSVD_GND
C415
0.01u
R407
C416
0.01u
C447
22p
C418
NA
10p
30
R408
180
C417
22p
C414
R409
180
R410
TX_RAMP
R411
1K
C419
NA
RF_RST
(GPIO_10)
RF_PWR_DWN
(GPIO_4)
NA
C420
39p
C421
27p
GND11
GND10
GND9
GND8
GND7
15
14
13
DCS_RX1
12
EGSM_RX2
11
EGSM_RX1
10
2p
PCS_RX1
C425
1.8p
C426
1.5p
C427
1.5p
GND6
L404
6.8nH
GND5
GND3
DCSPCS_TX
GND2
EGSM_TX
RFIPP
RFIPN
RFIDP
RFIDN
RFIEP
RFIEN
RFIAP
RFIAN
U401
SI4210
XOUT
BIP
BIN
BQP
BQN
SDIO
_SEN
SCLK
8
7
6
5
4
3
2
1
QP
C424
39p
C
QN
S_DATA
S_EN
S_CLK
(GPIO_20)
(GPIO_19)
(GPIO_21)
2V75_VVCXO
(1%)
25
26
27
28
29
30
31
32
33
GND4
GND1
17
18
19
20
21
22
23
24
L403
5.6nH
RFOH
RFOL
GND
VDD2
VDD1
VIO
_RESET
_PDN
C423
PCS_RX2
DCS_RX2
IN
XMODE
XDIV
AFC
VDD3
VDD4
XTAL2
XTAL1
XEN
PGND
VC_EGSM
GND12
5
8
C428
12p
C429
27p
RF2V85
L405
27nH
1
C
GND13
ANT
24
23
22
21
20
19
18
17
16
7
6
4
2
VC_DCSPCS
9
3
16
15
14
13
12
11
10
9
IP
C422
39p
FL400
C432
C430
27p
C431
27p
12p
HWXQ511
C433
2.2u
C434
22p
U402
C435
0.1u
SN74AHC1GU04DCKR
C436
ANT_SW1
R412
C437
100
1000p
26MHz
C438
1000p
1000p
(GPIO_9)
2V75_VVCXO
D
ANT_SW2
D
(GPIO_11)
R415
X400
R416
C439
270p
C440
270p
3
100
4
VBAT
RF2V85
C442
2.2u
C443
NA
U403
OUT VCONT
VCC
GND
26MHz
1M
R417
1
AFC
15K
2
C441
1000p
1
5
IN
OUT
2
GND
3
4
EN
BYP
CLKON
Section
MIC5255-2.85BM5
R419
100K
C444
1u
C445
0.01u
Date
Sign & Name
MODEL
C446
4.7u
Designer
E
Checked
Approved
Iss.
1
2
3
4
Notice No.
Date
Name
LG Electronics Inc.
BEETLE
Sheet/
Sheets
(KG245)
4/6
DRAWING
NAME
RF
DRAWING
NO.
REV.1.0
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 106 -
7. CIRCUIT DIAGRAM
1
2
3
4
5
6
7
9
8
10
CAMERA/MIDI LDO
CAMERA CTL IC
A
VBAT
A
1V8_MIDI_CORE 2V85_VCAM
2V85_VCAM
U501
4
C501
1u
C502
0.01u
5
VOUT1
VOUT2
EN2
NC3
10
9
8
2V85_VCAM
7
NC2
6
GND
11
BGND
BYP
NC1
C503
1u
MIC2211-GOYML
2V8_C_PWR
C504
10u
Q501
D
C505
10u
(1.8V=150mA, 2.85V=300mA)
B
C_CD07
C_CD06
C_CD05
C_CD04
C_CD03
C_CD02
C_CD01
C_CD00
C_SCK
C_SDA
C_PCLK
C_RST
C_HS
C_VS
C_MCLK
3
VIN
EN1
100K
100K
100K
2
R502
R503
R504
1
ONNOFF
C506
0.1u
SI1305-E3
G
S
B
VOUT_BL
4.7u
9
17
R506
GND
PGND
16
C_FLASH
1.5K
NC
EN_SET
1.5K
FB501
13
FB502
FLASH_LED
22
MLED
8
5
ISINK1
6
ISINK2
7
ISINK3
EN_FLSH
10
LCD_DIM_CTL
U502
3
R505
MLED1
MLED2
MLED3
R512
1K
C518
1u
C519
1u
D9
R507
1K
M_8BIT
AAT2807AIXN-4.5
B8
C9
M10
L3
J8
L9
M9
K8
L8
M8
K7
L7
M5
M4
L4
M3
K4
M2
M1
G2
STROBE
CIS_TYPE2
CIS_TYPE1
CIS_TYPE0
C_PWDN
C_D7
C_D6
C_D5
C_D4
C_D3
C_D2
C_D1
C_D0
C_SCK
C_SDA
C_PCLK
C_RST
C_HS
C_VS
C_MCLK
L_RESET_N
L_DA0
L_DA1
L_DA2
L_DA3
L_DA4
L_DA5
L_DA6
L_DA7
L_DA8
L_DA9
L_DA10
L_DA11
L_DA12
L_DA13
L_DA14
L_DA15
L_DA16
L_DA17
L_CS_N
L_WR_N
L_RD_N
L_ADS
LS_CS_N
K5
VDDS
J2
VDDL
A8
A10
D2
H10
VDDC1
VDDC2
VDDC3
1608
VDDC4
U503
EUSY0240501
C509
1u
C508
0.01u
C510
1u
C511
1u
C515
4.7u
C516
0.01u
B2
E8
J3
K6
A5
B5
C5
F2
L5
GNDI1
GNDI2
GNDI3
GNDI4
GNDC1
GNDC2
GNDC3
GNDC4
GNDC5
(Core Logic, CL761A)
C507
0.1u
B9
C7
VDDI1
VDDI2
M_SA0
M_SA1
M_ADS
M_SD0
M_SD1
M_SD2
M_SD3
M_SD4
M_SD5
M_SD6
M_SD7
M_SD8
M_SD9
M_SD10
M_SD11
M_SD12
M_SD13
M_SD14
M_SD15
M_CS_N
M_RD_N
M_WR_N
M_INTR
M_HOLD
M_RESET_N
MS_CS_N
1
VOUT_FL
VIN
C517
R511
C3-
1u
1u
C514
15
C22
C3+
1u
C512
11
C1+
4
12
C114
C2+
C513
VBAT
C
L2
L10
J9
K10
H8
H9
J10
G10
G9
G8
F8
F10
E10
F9
D10
E9
C10
H2
G1
L1
K2
K1
K3
K9
L_DATA00
L_DATA01
L_DATA02
L_DATA03
L_DATA04
L_DATA05
L_DATA06
L_DATA07
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
L_DATA15
L_DATA16
L_DATA17
L_MAIN_LCD_CS
LCD_WR
LCD_RD
LCD_RS
L_SUB_LCD_CS
A2
A1
XIN
XOUT
C
26MHz
D8
B10
C8
B7
A7
A6
B6
C6
A4
B4
C4
C3
B3
A3
D3
C2
B1
E3
C1
E2
D1
F3
E1
F1
G3
A9
WHITE/FLASH LED LDO
GPIO_0
GPIO_1
GPIO_2
T_MODE0
SCAN_EN
TEST_EN
J1
H3
H1
M7
M6
L6
2V85_VCAM
R508
100K
R509
100K
D
ADD01
ADD02
ADD01
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
_LCD_CS
_RD
_WR
CAM_INT
CAM_HOLD
CAM_RST
_SUB_CS
D
FLIP SWITCH
2V8_VEXT
R510
FLIP
100K
Section
OUT
C521
0.1u
VDD
A3212ELH
C522
10p
GND
U504
C520
330p
Date
Sign & Name
Designer
Checked
E
Approved
Iss.
1
2
3
4
Notice No.
Date
Name
LG Electronics Inc.
MODEL
DRAWING
NAME
DRAWING
NO.
BEETLE
Sheet/Sheets
(KG245)
5/6
CAMERA IC /
CHARGE PUMP
REV.H
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 107 -
7. CIRCUIT DIAGRAM
3
4
5
4.7K
2
7
3
VCHARGE
100
C601
FL606
L_MAIN_LCD_CS
L_SUB_LCD_CS
LCD_WR
LCD_RS
2
3
4
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
5
FL608
4
C612
56p
C613
56p
C614
56p
7
6
ICVE21184E150R500FR
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
3
5
2
C_SDA
C_SCK
C_RST
8
9
VCHG_LED
MLED
FLASH_LED
8
7
6
G1
6
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
INOUT_A5 INOUT_B5
INOUT_A6 INOUT_B6
13
L_DATA12
L_DATA13
L_DATA14
L_DATA15
L_DATA16
L_DATA17
12
11
10
9
8
FL605 ICVE21184E150R500FR
1
2
3
4
IFMODE
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
MLED1
MLED2
MLED3
9
C_MCLK
C_PCLK
C_HS
C_VS
8
7
6
C
C608
56p
C609
56p
C610
56p
C611
56p
FL607 ICVE21184E150R500FR
1
2
3
4
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
9
C_CD00
C_CD01
C_CD02
C_CD03
8
7
6
10
1
9
10
G1
C
INOUT_A1 INOUT_B1
G2
1
ICVE21184E150R500FR
5
INOUT_A2 INOUT_B2
G2
0.1uF
10
5
R603
LCD_RESET
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
LCD_ID
SPK_RCV_P
SPK_RCV_N
4
6
G2
CN601
R604 100K
6
10
5
3
7
7
ICVE31186E150R101FR
G1
INOUT_A4 INOUT_B4
8
L_DATA08
L_DATA09
L_DATA10
L_DATA11
8
B
INOUT_A1 INOUT_B1
7
INOUT_A3 INOUT_B3
2
9
14
INOUT_A2 INOUT_B2
G1
4
INOUT_A1 INOUT_B1
1
AXK760145J
G1
3
FL604
(60pin, Socket, 1.5T, 0.4mm)
5
2
INOUT_A4 INOUT_B4
2V8_C_PWR
9
G2
L_DATA04
L_DATA05
L_DATA06
L_DATA07
INOUT_A3 INOUT_B3
VBAT
2V8_VEXT
FL603 ICVE21184E150R500FR
1
4
INOUT_A2 INOUT_B2
G2
6
ICVE21184E150R500FR
INOUT_A1 INOUT_B1
G2
R602
1
G1
5
FL602
8
10
INOUT_A4 INOUT_B4
A
9
10
B
10
G2
INOUT_A3 INOUT_B3
G1
4
INOUT_A2 INOUT_B2
9
5
3
INOUT_A1 INOUT_B1
8
FL609 ICVE21184E150R500FR
1
2
OLED_ON
3
27p
1u
1u
C603
C605
C606
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
27p
C602
C607
1u
INOUT_A1 INOUT_B1
5
27p
C604
D
4
9
C_CD04
C_CD05
C_CD06
C_CD07
8
7
6
D
G2
2
G2
1
R601
4.7K
2V8_C_PWR
FL601 ICVE21184E150R500FR
7
VGA CAMERA
128x160 MAIN TFT LCD
96x64 SUB OLED
CONNECTOR(60Pin)
A
L_DATA00
L_DATA01
L_DATA02
L_DATA03
6
10
2
10
1
BACK_BATT
MOTOR
Section
Date
Sign & Name
Designer
Checked
E
Approved
Iss.
1
2
3
4
Notice No.
Date
Name
LG Electronics Inc.
Sheet/
MODEL
DRAWING
NAME
DRAWING
NO.
BEETLE
Sheets
6/6
LCD CONNECTOR
REV.1.0
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 108 -
7. CIRCUIT DIAGRAM
FPCB CONN
VCHARGE
AXK8L60125J
(0.9T, Plug, 0.4mm, 60pin)
(ENBY0020202)
2V8_VEXT
2V8_C_PWR
LCD CONN
CN101
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
LCD_ID
SPK_RCV_P
SPK_RCV_N
390
R100
VCHARGE
LD101
L_DATA00
L_DATA01
L_DATA02
L_DATA03
L_DATA04
L_DATA05
L_DATA06
L_DATA07
LCD_RESET
L_MAIN_LCD_CS
L_SUB_LCD_CS
LCD_WR
LCD_RS
C_SDA
C_SCK
C_RST
OLED_ON
LD100
FLASH_LED
MLED
BACK_BATT
VBAT
MOTOR
2V8_VEXT
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
L_DATA15
L_DATA16
L_DATA17
C_MCLK
C_PCLK
C_HS
C_VS
IFMODE
14-5805-040-000-829
(0.9T, PLUG, 0.4mm, 40pin)
ENBY0027407
VBAT
CN103
LCD_RESET
L_SUB_LCD_CS
L_DATA00
L_DATA01
L_DATA02
L_DATA03
L_DATA04
L_DATA05
L_DATA06
L_DATA07
MLED
MLED1
MLED2
MLED3
MLED1
MLED2
MLED3
C_CD00
C_CD01
C_CD02
C_CD03
C_CD04
C_CD05
C_CD06
C_CD07
MOTOR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
LCD_ID
IFMODE
LCD_RS
L_MAIN_LCD_CS
LCD_WR
L_DATA17
L_DATA16
L_DATA15
L_DATA14
L_DATA13
L_DATA12
L_DATA11
L_DATA10
L_DATA09
L_DATA08
SPK_RCV_N
SPK_RCV_P
OLED_ON
LEWW-S35KA
BAT100
CAMERA CONN
AXK720145
(1.5T, Socket, 0.4mm, 20pin)
2V8_C_PWR
(ENBY0017601)
CN102
C_MCLK
C_PCLK
C_CD00
C_CD01
C_CD02
C_CD03
C_CD04
C_CD05
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
C_RST
C_SCK
C_SDA
TP1
C_HS
C_VS
C_CD07
C_CD06
TP2 TP3
TP4 TP5
TP6
BEETLE
1/1
FPCB
VER.1.0
- 109 -
7. CIRCUIT DIAGRAM
1
2
3
4
5
7
6
9
8
10
A
AA
B
BB
CAMERA
Camera
UP
DOWN
UP
DOWN
1 -> GND
2 -> KEY_COL0
3 -> KEY_COL1
C
4 -> KEY_COL2
5
4
3
2
1
CN302
C
5 -> KEY_ROW0
D
D
E
Section
Date
Designer
08/06
2005
Checked
Approved
Iss.
1
2
3
4
Notice No.
Date
Name
Sheet/
Sign & Name
LG Electronics Inc.
MODEL
M6100 SIDE
Sheets
1/1
DRAWING
NAME
CAM_VOLUME_SIDEKEY_FPCB
DRAWING
NO.
Ver C
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 110 -
8. PCB LAYOUT
- 111 -
8. PCB LAYOUT
- 112 -
8. PCB LAYOUT
KG245
- 113 -
8. PCB LAYOUT
KG245
- 114 -
9. ENGINEERING MODE
9. ENGINEERING MODE
A. About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions
provided by a handset.
B. Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to
non-engineering mode operation.
C. Key Operation
Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key
will switch back to the original test menu.
D. Engineering Mode Menu Tree
Engineering Mode
BB Test
RF Test
MF Mode
Camera
SAR Test
Trace
option
Call Timer
All auto test
UART On
All Calls
LED
LED
UART Off
Reset
Backlight
Backlight
Bluetooth On
Buzzer
Buzzer
Bluetooth Off
Vibrator
Vibrator
ADC
LCD
BATTERY
Key Pad
Audio
MicSpkTest
DAI
Camera
Bluetooth
- 115 -
Fact.
Reset
S/W
Version
9. ENGINEERING MODE
9.1 BB Test [MENU 1]
9.1.1 Camera
1) Main LCD preview : This menu is to test Camera preview on Main LCD screen.
2) Sub LCD Preview : This menu is to test Camera preview on Sub LCD screen.
3) Flash on : This menu is to test Folder Flash light.
- Select this menu if you want to turn on folder flash light.
4) Flash off : This menu is to test Folder Flash light.
- Select this menu if you want to turn off folder flash light.
9.1.2 Backlight
This menu is to test the LCD Backlight and Keypad Backlight.
1) Backlight on : LCD Backlight and Keypad Backlight light on at the same time.
2) Backlight off : LCD Backlight and Keypad Backlight light off at the same time.
3) Backlight value : This controls brightness of Backlight. When entering into the menu, the present
backlight-value in the phone is displayed. Use Left/Right key to adjust the level of
brightness. The value of the brightness set at last will be saved in the NVRAM.
9.1.3 Buzzer
This menu is to test the melody sound.
1) Melody on : Melody sound is played through the speaker.
2) Melody off : Melody sound is off.
9.1.4 Vibrator
This menu is to test the vibration mode.
1) Vibrator on : Vibration mode is on.
2) Vibrator off : Vibration mode is off.
- 116 -
9. ENGINEERING MODE
9.1.5 ADC (Analog to Digital Converter)
This displays the value of each ADC.
1) MVBAT ADC : Main Voltage Battery ADC
2) AUX ADC : Auxiliary ADC
3) TEMPER ADC : Temperature ADC
9.1.6 BATTERY
1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order :
BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT,
BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE,
BAT_RECHARGE_LMT
2) TEMP Cal : This displays the value of Temperature Calibration.
The following menus are displayed in order : TEMP_HIGH_LIMIT,
TEMP_HIGH_RECHARGE_LMT, TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT
9.1.7 Audio
This is a menu for setting the control register of Voiceband Baseband Codec chip.
Although the actual value can be written over, it returns to default value after switching off and on the
phone.
1) VbControl1 : VbControl1 bit Register Value Setting
2) VbControl2 : VbControl2 bit Register Value Setting
3) VbControl3 : VbControl3 bit Register Value Setting
4) VbControl4 : VbControl4 bit Register Value Setting
5) VbControl5 : VbControl5 bit Register Value Setting
6) VbControl6 : VbControl6 bit Register Value Setting
9.1.8 DAI (Digital Audio Interface)
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
1) DAI AUDIO : DAI audio mode
2) DAI UPLINK : Speech encoder test
3) DAI DOWNLINK : Speech decoder test
4) DAI OFF : DAI mode off
- 117 -
9. ENGINEERING MODE
9.2 RF Test [MENU 2]
9.2.1 SAR test
This menu is to test the Specific Absorption Rate.
1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required.
2) SAR test off : TX process off
9.3 MF mode [MENU 3]
This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will
process the test automatically, and phone displays the previous menu after completing the test.
9.3.1 All auto test
LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,
9.3.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
9.3.3 Buzzer
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2,
Volume 3, Volume 0 (mute), Volume 4, Volume 5.
9.3.4 Vibrator
Vibrator is on for about 1.5 seconds.
9.3.5 LCD
1)LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
2)SubLCD
Sub LCD screen resolution tests horizontally and vertically one by one and fills the screen.
9.3.6 Key pad
When a pop-up message shows ‘Press Any Key’, you may press any keys including side keys, but not
[Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test will be
completed in 15 seconds automatically.
- 118 -
9. ENGINEERING MODE
9.3.7 MicSpk Test
The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically.
9.3.8 Camera
Camera preview function is activated on Main LCD screen.
9.4 Trace option [MENU 4]
This is NOT a necessary menu to be used by neither engineers nor users.
9.5 Call timer [MENU 5]
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
1) All calls : This displays total conversation time. User cannot reset this value.
2) Reset settings : This resets total conversation time to this, [00:00:00].
3) DAI DOWNLINK : Speech decoder test
4) DAI OFF : DAI mode off
9.6 Fact. Reset [MENU 6]
This Factory Reset menu is to format data block in the flash memory and this procedure set up the
default value in data block.
Attention
1 Fact. Reset (i.e.Factory Reset) should be only used during the Manufacturing process.
2 Servicemen should NOT progress this menu, otherwise some of valuable data such as Setting
value, RF Calibration data, etc. cannot be restored again.
9.7 S/W version[MENU 7]
This displays software version stored in the phone.
- 119 -
10. STAND ALONE TEST
10. STAND ALONE TEST
10.1 Introduction
This manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
10.2 Setting Method
A. COM port
a. Move your mouse on the “Connect” button, then click the right button of the mouse and select “Com
setting”.
b. In the “Dialog Menu”, select the values as explained below.
- Port : select a correct COM port
- Baud rate : 38400
- Leave the rest as default values
B. Tx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APC
a. Select either Power level or Scaling Factor.
b. Power level
- Input appropriate value GSM (between 5~19) or DCS (between 0~15)
c. Scaling Factor
- A ‘Ramp Factor’ appears on the screen.
- You may adjust the shape of the Ramp or directly input the values.
C. Rx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Gain Control Index (0~ 26) and RSSI level
- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 in Gain Control
Index.
- Normal phone should indicate the value of RSSI close to -16dBm.
- 120 -
10. STAND ALONE TEST
10.3 Means of Test
a. Select a COM port
b. Set the values in Tx or Rx
c. Select band and channel
d. After setting them all above, press connect button.
e. Press the start button
Figure 10-1. HW test program
- 121 -
10. STAND ALONE TEST
Figure 10-2. HW test setting
Figure 10-3. Ramping profile
- 122 -
11. AUTO CALIBRATION
11. AUTO CALIBRATION
11.1 Overview
Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration
with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply).
Autocal generate calibration data by communicating with phone and measuring equipment then write it
into calibration data block of flash memory in GSM phone.
11.2 Requirements
-PC or Notebook installed with Microsoft Windows 98/ME/2000/XP
-Auto Calibration program(Autocal.exe)
-GSM Phone
-LGE PIF JIG, Serial Cable, Data Cable
-Agilent 8960(Call Setting Instrument)
-Tektronix PS2521G(Programmable Power Supply)
11.3 Menu and Settings
-File(F) Clear View : Clear Calibration Status window texts
-File(F) Save View : Save Calibration Status window texts
-File(F) Save Setting : Save Current Calibration settings to setting file(*.cal)
-File(F) Load Setting : Load saved Calibration setting
-File(F) Make BIN ALL : Make binary file after calibration finished
-File(F) Make BIN BAT.Cal only : Make binary file of battery cal data only after calibration finished
-File(F) Make & Write BIN : Make binary file after calibration finished then download it to the Flash
Memory
-View(V) Tools : Enable or disable Tool bar
-View(V) Status : Enable or disable status bar
-Connection(C) Connect : Connect the phone with PC. This procedure checks whether the PC is
connected “ag8960” or not. After that it performs sync. procedure with
phone. If the sync. procedure is successful state column on status bar
changed to SETUP, else you should disconnect phone and try again from
the beginning and also check the whole connection. All measurement is
performed at state SETUP.
-Connection(C) Port Setting : Show COM port setting dialog and Baudrate you can change,etc.
-GPIB(G) Connect : Connect the Ag8960 GPIB card with PC.
- 123 -
11. AUTO CALIBRATION
Figure 11-1. Auto Calibration Program
Screen ➝ Cable loss : Enter the RF cable loss GSM and DCS
Screen ➝ GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address
Screen ➝ ADC Channel : Default ADC Calibration Channel
Screen ➝ Auto Calibration Item : Default Calibration Settings about Tx, Rx, ADC and write BIN file
- 124 -
11. AUTO CALIBRATION
11.4 AGC
This procedure is for Rx calibration.
In this procedure, We can get RSSI correction value. Set band EGSM and press Start button theresult
window will show correction values per every power level and gain code and the samemeasure is
performed per every frequency.
11.5 APC
This procedure is for Tx calibration.
In this procedure you can get proper scale factor value and measured power level.
11.6 ADC
This procedure is for battery calibration.
You can get main Battery Config Table and temperature Config Table
11.7 Setting
check com port and cable loss. Select automatic calibration item. If you uncheck one item calibration
will stop from the unchecked item. This is useful when you want to process only one item.
11.8 How to do calibration
A. Connect cable between phone and serial port of PC.
B. Connect Ag8960 equipment and Power Supply and phone.
C. Set correct port and baud rate.
D. Press Start button. AutoCal process all calibration procedure
i. AGC EGSM
ii. AGC DCS
iii. APC EGSM
iv. APC DCS
v. ADC
E. After finished all measurement. The state is return to SETUP.
F. The Cal file will be generated and then the calibration data will be written into phone and then will be
reset.
- 125 -
- 126 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
64
1
60
4
2
7
66
63
11
12
16
31
22
18
23
27
25
29
32
68
19
33
3
5
6
70
69
20
14
8
26
17
15
9
36
71
10
62
48
41
43
44
80
34
24 24
45
65 28
21
67
30
79
49
55
35
73
75
48
58
74
54
77
76
56
59
77
46
51
55
41
37
77
38
39
40
72
53
47
50
52
- 127 -
57
- 128 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts
<Mechanic component>
Level
Location
No.
1
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
GSM(FOLDER)
TGFF0087301
Specification
KG241 TMD
Color
Remark
Black
2
AAAY00
ADDITION
AAAY0142201
Black
3
MCJA00
COVER,BATTERY
MCJA0029701
Dark Silver
2
APEY00
PHONE
APEY0265001
Dark Silver
3
ACGG00
COVER ASSY,FOLDER
ACGG0070501
Dark Silver
4
ABFZ00
BRACKET ASSY
ABFZ0007001
Dark Silver
5
AWAB00
WINDOW ASSY,LCD
AWAB0020801
6
BFAA00
FILM,INMOLD
BFAA0036801
6
MWAF00
WINDOW,LCD(SUB)
MWAF0032001
5
MBFF00
BRACKET,LCD
MBFF0008401
5
MGAD00
PAD
MPBZ0136101
5
MGAD01
GASKET,SHIELD FORM
MGAD0108501
5
MGAZ00
GASKET
MGAZ0034001
5
MPBQ00
PAD,LCD(SUB)
MPBQ0027201
5
MTAE00
TAPE,WINDOW(SUB)
MTAE0026801
5
MTAZ01
TAPE,PROTECTION
MTAB0106901
4
ACGH00
COVER ASSY,
FOLDER(LOWER)
ACGH0041701
Dark Silver
5
MCJH00
COVER,FOLDER(LOWER)
MCJH0033401
Dark Silver
30
5
MFBC00
FILTER,SPEAKER
MFBC0021301
Black
28
5
MPBG00
PAD,LCD
MPBG0043701
Black
26
5
MPBJ00
PAD,MOTOR
MPBJ0032101
PAD MOTOR LOWER
Black
5
MTAB00
MAGNET,SWITCH
MMAA0000601
LG-G510,511,512 common use, DIA : 3.0mm+1.5t
Silver
5
MTAD00
TAPE,WINDOW
MTAD0049301
MAIN
34
5
MTAZ00
TAPE
MTAZ0113001
CAMERA
29
4
ACGJ00
COVER ASSY,
FOLDER(UPPER)
ACGJ0054301
Black
5
MCJJ00
COVER,FOLDER(UPPER)
MCJJ0041101
Black
6
MICC00
INSERT
MICZ0016001
5
MDAD00
DECO,CAMERA
MDAD0019701
5
MDAY00
DECO
MDAY0024701
DECO FLASH
5
MIDZ00
INSULATOR
MIDZ0090801
BACKUP
Blue
64
5
MPBJ00
PAD,MOTOR
MPBJ0031001
UPPER
Black
9
5
MPBN00
PAD,SPEAKER
MPBN0028101
UPPER
Black
10
KG245 SUB WINDOW (INMOLD)
13
CONN
Dark Gray
15
Dark Silver
19
Black
12X3GOLDTAPE
Gold
Black
17
14
TAPE,PROTECTION BRACKET INSIDE
LOWER
M1.4X3
Blue
8
Silver
Blue
- 129 -
27
4
2
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
MPBT00
PAD,CAMERA
MPBT0026301
5
MPBZ00
PAD
MPBZ0121301
PAD_BATT
5
MTAA00
TAPE,DECO
MTAA0110001
CAMERA
5
5
MTAA01
TAPE,DECO
MTAA0109901
FLASH
3
5
MTAB00
TAPE,PROTECTION
MTAB0100301
5
MTAB01
TAPE,PROTECTION
MTAB0112801
5
MTAD00
TAPE,WINDOW
MTAD0049201
5
MWAE00 WINDOW,CAMERA
MWAE0015001
4
ACGK00
COVER ASSY,FRONT
ACGK0067701
Dark Silver
5
MBHY00
BUMPER
MBHY0018201
Dark Silver
37
5
MCJK00
COVER,FRONT
MCJK0054801
Dark Silver
39
6
MICA00
INSERT,FRONT
MICA0021101
Cyber Mirror
5
MDAG00
DECO,FRONT
MDAG0017701
Dark Gray
38
5
MFBD00
FILTER,MIKE
MFBD0014101
LOWER
Black
42
5
MGAD00
GASKET,SHIELD FORM
MGAD0111401
GASKET, SHIELD TAPE(FRONT)
Gold
18,40
5
MPBZ00
PAD
MPBZ0125601
PAD MIC
Black
5
MSGB00
STOPPER,HINGE
MSGB0013301
5
MTAZ00
TAPE
MTAZ0132001
STOPPER HINGE
4
GMEY00
SCREW MACHINE,BIND
GMEY0002001
1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD
d2.7
4
MCCH00
CAP,SCREW
MCCH0074601
4
MGAZ00
GASKET
MGAZ0028601
4
MHFD00
HINGE,FOLDER
MHFD0011801
4
MIDA00
INSULATOR,LCD
MIDA0019601
4
MIDA01
INSULATOR,LCD
MIDA0019701
4
MPBF00
PAD,FLEXIBLE PCB
MPBF0014701
4
MTAB00
TAPE,PROTECTION
MTAB0101401
67
4
MWAC00 WINDOW,LCD
MWAC0063401
35
4
MBFZ00
BRACKET
MBFZ0024801
4
MBJL00
BUTTON,SIDE
4
MCCC00
4
Description
Part Number
Specification
Color
Remark
Black
12
Black
63
CAMERA
7
6
Gray
GASKET SHIELD
36
62
Silver
33
Gold
70
31
INSULATOR,LCD2
SHIELD REAR
Blue
68
Blue
69
Black
66
Silver
75
MBJL0030101
Dark Gray
46
CAP,EARPHONE JACK
MCCC0033201
Silver
49
MCJN00
COVER,REAR
MCJN0050401
Dark Silver
53
4
MGAD00
GASKET,SHIELD FORM
MGAD0107801
BTOB CONN
Gold
16,48
4
MGAZ00
GASKET
MGAZ0030501
3X7.0
Gold
76
4
MIDZ00
INSULATOR
MIDZ0097201
6.3x3.5 PC SHEET 0.1t
Black
4
MLEA00
LOCKER,BATTERY
MLEA0029001
4
MLEY00
LOCKER
MLEY0000801
SIM LOCKER
- 130 -
Dark Silver
57
Silver
54
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
4
MPBH00
PAD,MIKE
MPBH0020701
4
MPBZ00
PAD
MPBZ0122701
4
MSDZ00
SPRING,LOCKER
MSDC0004101
4
MTAB00
TAPE,PROTECTION
MTAB0100601
4
MTAC00
TAPE,SHIELD
MTAC0034701
3
MCCE00
CAP,RECEPTACLE
MCCE0026501
Silver
47
3
MCCF00
CAP,MOBILE SWITCH
MCCF0033201
Dark Silver
28
3
MKAZ00
KEYPAD
MKAZ0027401
Dark Silver
5
MIDZ00
INSULATOR
MIDZ0098901
5X10 BLUE 0.05t
Blue
5
MIDZ01
INSULATOR
MIDZ0086601
INSULATOR PCB TOP
Blue
78
5
MIDZ02
INSULATOR
MIDZ0096801
PCB-2
Blue
80
5
MIDZ03
INSULATOR
MIDZ0085001
INSULATOR_PCB
Blue
77
Description
Part Number
Specification
Color
Remark
REAR
Black
50
SHIELD
Black
74
Pearl Blue
SIDE_KEY
Blue
51
73
- 131 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
<Main component>
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Level
Location
No.
4
SACY00
PCB ASSY,FLEXIBLE
SACY0042002
5
SACE00
PCB ASSY,FLEXIBLE,SMT
SACE0037102
6
SACC00
PCB ASSY,FLEXIBLE,SMT
BOTTOM
SACC0024601
7
CN101
CONNECTOR,
BOARD TO BOARD
ENBY0013007
60 PIN,0.4 mm,STRAIGHT ,AU ,STACKING HEIGHT 1.5
/ HEADER FOR LCM FPCB
7
CN102
CONNECTOR,
BOARD TO BOARD
ENBY0019501
20 PIN,.4 mm,ETC , ,H=1.5, Socket
7
CN103
CONNECTOR,
BOARD TO BOARD
ENBY0027407
40 PIN,0.4 mm,ETC ,AU ,H:1.0MM
6
SACD00
PCB ASSY,FLEXIBLE,SMT
TOP
SACD0034501
7
LD100
DIODE,LED,MODULE
EDLM0008702
WHITE ,3 LED,3.5*2.8*1.0 ,R/TP ,1.0t
7
LD101
DIODE,LED,CHIP
EDLH0007901
RED ,1608 ,R/TP ,Indicator,0.4T Red LED
7
R100
RES,CHIP
ERHY0000231
390 ohm,1/16W,J,1005,R/TP
6
SPCY00
PCB,FLEXIBLE
SPCY0071801
POLYI ,.5 mm,MULTI-5 ,KG245 LCD FPCB
4
SJMY00
VIBRATOR,MOTOR
SJMY0006503
3 V,0.08 A,10*3.45 ,17mm double tape
20
4
SUSY00
SPEAKER
SUSY0015501
ASSY ,8 ohm,90 dB,16 mm,3.7T
21
4
SVCY00
CAMERA
SVCY0009501
CMOS ,VGA ,Omnnivision 1/6"
25
LCD MODULE
SVLM0017801
MAIN ,M_128*160 S_96_64 ,M_33.8*46.24*4.0 ,262k
,TFT ,TM ,M_LGDP4511 S_LGDP4213 ,S_PM OLED
65K
24
BATTERY,CELL,LITHIUM
SBCL0001303
2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY
4
SVLM00
4
Description
Part Number
Specification
Color
Remark
22
Black
Black
3
ACGM00
COVER ASSY,REAR
ACGM0068601
Black
4
ENZY00
CONNECTOR,ETC
ENZY0013201
2 PIN,3 mm,ETC , ,H=6.5
72
4
SNGF00
ANTENNA,GSM,FIXED
SNGF0015801
4.0:1 ,0 dBd, ,GSM900/DCS1800/PCS1900 Internal Pbfree
71
3
GMEY00
SCREW MACHINE,BIND
GMEY0002001
1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD
d2.7
3
SAFY00
PCB ASSY,MAIN
SAFY0156502
4
SAFB00
PCB ASSY,MAIN,INSERT
SAFB0055902
5
ADCA00
DOME ASSY,METAL
ADCA0048001
5
MGAZ00
GASKET
MGAZ0029801
5
SPKY00
PCB,SIDEKEY
SPKY0029401
POLYI ,0.2 mm,DOUBLE ,KG245 CAMERA-VOLUME
SIDEKEY FPCB
5
SUMY00
MICROPHONE
SUMY0003802
FPCB ,-42 dB,4*1.5 ,
4
SAFF00
PCB ASSY,MAIN,SMT
SAFF0078802
5
MLAB00
LABEL,A/S
MLAB0000601
HUMIDITY STICKER
5
MLAC00
LABEL,BARCODE
MLAC0003301
EZ LOOKS(use for PCB ASSY MAIN(hardware))
32,55
45
44
Gold
- 132 -
79
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
SAFC00
PCB ASSY,MAIN,SMT
BOTTOM
SAFC0069303
6
ANT201
ANTENNA,GSM,FIXED
SNGF0015701
3.0:1 ,0 dBd, ,3.0:1,5.4*2.0*1.5 Bluetooth Chip Pb-Free
6
C101
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C102
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C103
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C104
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C105
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C106
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C107
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C108
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C109
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C110
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6
C111
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C112
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C113
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C114
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C115
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C116
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C117
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C118
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C119
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C120
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C121
CAP,CERAMIC,CHIP
ECCH0000165
68 nF,6.3V,K,X5R,HD,1005,R/TP
6
C122
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C125
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C126
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C128
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C130
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C131
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C132
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C133
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C134
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C136
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C137
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C138
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C139
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
Description
Part Number
Specification
- 133 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C140
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C141
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C142
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C143
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C144
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C201
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C202
CAP,CERAMIC,CHIP
ECCH0007901
10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP
6
C203
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C204
CAP,TANTAL,CHIP,MAKER
ECTZ0005201
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C206
CAP,TANTAL,CHIP,MAKER
ECTZ0003602
22 uF,6.3V ,M ,STD ,2012 ,R/TP
6
C208
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C210
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C211
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C212
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C214
CAP,TANTAL,CHIP,MAKER
ECTZ0000406
33 uF,10V ,M ,STD ,3216 ,R/TP
6
C215
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C216
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C217
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C218
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C219
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C220
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C221
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C222
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C223
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C224
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C225
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C226
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C227
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C228
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C229
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C230
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C231
CAP,CERAMIC,CHIP
ECCH0007901
10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP
6
C232
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C233
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C234
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C235
CAP,CERAMIC,CHIP
ECCH0000147
2.2 nF,50V,K,X7R,HD,1005,R/TP
6
C236
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Description
Part Number
Specification
- 134 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C238
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C239
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C240
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C241
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C242
CAP,CERAMIC,CHIP
ECCH0000138
390 pF,50V,K,X7R,HD,1005,R/TP
6
C243
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C244
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C245
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C246
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C247
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C249
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C250
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C251
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C315
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C316
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C317
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C318
CAP,CHIP,MAKER
ECZH0001211
220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP
6
C319
CAP,TANTAL,CHIP,MAKER
ECTZ0005201
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C320
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C321
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C322
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C323
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C325
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C326
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C327
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C328
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C329
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C330
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C331
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C400
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C401
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C404
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6
C405
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C406
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C407
CAP,CHIP,MAKER
ECZH0000802
1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C408
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C409
CAP,CHIP,MAKER
ECZH0000853
8.2 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Specification
- 135 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C411
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C412
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C413
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C414
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C415
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C416
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C417
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C420
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C421
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C422
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C423
CAP,CHIP,MAKER
ECZH0000803
2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C424
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C425
CAP,CERAMIC,CHIP
ECCH0000178
1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP
6
C426
CAP,CHIP,MAKER
ECZH0000822
1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C427
CAP,CHIP,MAKER
ECZH0000822
1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C428
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C429
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C430
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C431
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C432
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C433
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C434
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C435
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C436
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C437
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C438
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C439
CAP,CHIP,MAKER
ECZH0001116
270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6
C440
CAP,CHIP,MAKER
ECZH0001116
270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6
C441
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C442
CAP,CHIP,MAKER
ECZH0001421
2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP
6
C444
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C445
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C446
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C447
INDUCTOR,CHIP
ELCH0005010
1.8 nH,S ,1005 ,R/TP ,
6
C501
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C502
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C503
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
Part Number
Specification
- 136 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C504
CAP,CERAMIC,CHIP
ECCH0007901
10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP
6
C505
CAP,TANTAL,CHIP,MAKER
ECTZ0005201
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C506
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C507
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C508
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C509
CAP,CHIP,MAKER
ECZH0003202
1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP
6
C510
CAP,CHIP,MAKER
ECZH0003202
1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP
6
C511
CAP,CHIP,MAKER
ECZH0003202
1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP
6
C512
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C513
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C514
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C515
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C516
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C517
CAP,CERAMIC,CHIP
ECCH0007901
10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP
6
C518
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C519
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C601
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C602
VARISTOR
SEVY0005201
5.5 V, ,SMD ,1005, 50pF
6
C603
VARISTOR
SEVY0005201
5.5 V, ,SMD ,1005, 50pF
6
C604
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
C605
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C606
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C607
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C613
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C614
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
CN301
CONNECTOR,I/O
ENRY0004101
24 PIN,0.5 mm,ETC , ,Off-Set type
6
CN601
CONNECTOR,
BOARD TO BOARD
ENBY0013008
60 PIN,0.4 mm,STRAIGHT ,AU ,STACKING HEIGHT 1.5
/ SOCKET FOR LCM FPCB
6
D101
DIODE,SWITCHING
EDSY0012101
US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t)
6
D102
DIODE,SWITCHING
EDSY0016001
ESM ,15 V,100 mA,R/TP ,PB-FREE
6
FB101
FILTER,BEAD,CHIP
SFBH0007102
10 ohm,1005 ,Ferrite Bead
6
FB201
FILTER,BEAD,CHIP
SFBH0007102
10 ohm,1005 ,Ferrite Bead
6
FB501
FILTER,BEAD,CHIP
SFBH0007102
10 ohm,1005 ,Ferrite Bead
6
FB502
FILTER,BEAD,CHIP
SFBH0007102
10 ohm,1005 ,Ferrite Bead
6
FL400
FILTER,SEPERATOR
SFAY0005602
900 ,1800.1900 ,2.7 dB,3.0 dB,30 dB,30 dB,ETC
,5.6*4.5*1.4, TRIPLE FEM
6
FL601
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
Description
Part Number
Specification
- 137 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
FL602
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL603
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL604
FILTER,EMI/POWER
SFEY0012301
SMD ,,18V, SMD, 6CH, 15pF, 50ohm, EMI/ESD Fillter
Array, Pb-free
6
FL605
FILTER,EMI/POWER
SFEY0007104
SMD ,5.6 V, 4ch. R-Varistor Array(200Ohm,25pF)
6
FL606
FILTER,EMI/POWER
SFEY0010401
SMD ,4ch, 18V, 15pF, 50ohm Pb-free
6
FL607
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL608
FILTER,EMI/POWER
SFEY0007104
SMD ,5.6 V, 4ch. R-Varistor Array(200Ohm,25pF)
6
FL609
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
J201
CONN,JACK/PLUG,
EARPHONE
ENJE0003501
3 ,5 PIN,
6
J301
CONN,SOCKET
ENSY0017501
6 PIN,ETC , ,2.54 mm,H=2.1, 5 Direction
6
L202
INDUCTOR,CHIP
ELCH0004711
22 nH,J ,1005 ,R/TP ,
6
L403
INDUCTOR,CHIP
ELCH0005014
5.6 nH,S ,1005 ,R/TP ,
6
L404
INDUCTOR,CHIP
ELCH0001049
6.8 nH,J ,1005 ,R/TP ,PBFREE
6
L405
INDUCTOR,CHIP
ELCH0005005
27 nH,J ,1005 ,R/TP ,
6
L406
INDUCTOR,CHIP
ELCH0001031
15 nH,J ,1005 ,R/TP ,PBFREE
6
L407
INDUCTOR,CHIP
ELCH0001054
5.6 nH,S ,1005 ,R/TP ,PBFREE
6
M201
IC
EUSY0239102
6.9 * 7.9 * 1.5 mm ,28 PIN,R/TP ,Bluetooth Module v1.2,
26MHz, For GSM
6
Q101
TR,FET,P-CHANNEL
EQFP0004201
2.9*1.9*0.8(t) ,.7 W,20 V,-6 A,R/TP ,NDC652P
upgrade(substitution) item, Pb free
6
Q201
TR,BJT,ARRAY
EQBA0000406
SC-70 ,0.2 W,R/TP ,CDMA,Common use
6
Q202
TR,BJT,NPN
EQBN0007101
EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
6
Q301
TR,BJT,ARRAY
EQBA0000406
SC-70 ,0.2 W,R/TP ,CDMA,Common use
6
Q302
TR,BJT,ARRAY
EQBA0002701
EMT6 ,150 mW,R/TP ,NPN, PNP, 150 mA
6
Q501
TR,FET,P-CHANNEL
EQFP0004501
SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET,
Pb free
6
R101
RES,CHIP
ERHY0000201
0 ohm,1/16W,J,1005,R/TP
6
R102
RES,CHIP
ERHY0000261
10K ohm,1/16W,J,1005,R/TP
6
R103
RES,CHIP
ERHY0000225
200 ohm,1/16W,J,1005,R/TP
6
R104
RES,CHIP
ERHY0001102
0.2 ohm,1/4W ,F ,2012 ,R/TP
6
R105
RES,CHIP
ERHY0000230
330 ohm,1/16W,J,1005,R/TP
6
R106
RES,CHIP
ERHY0000512
10M ohm,1/16W,J,1608,R/TP
6
R107
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R108
RES,CHIP
ERHY0000152
82K ohm,1/16W,F,1005,R/TP
6
R109
RES,CHIP
ERHY0000202
4.7 ohm,1/16W,J,1005,R/TP
Description
Part Number
Specification
- 138 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R110
RES,CHIP
ERHY0000202
4.7 ohm,1/16W,J,1005,R/TP
6
R111
RES,CHIP
ERHY0000254
4.7K ohm,1/16W,J,1005,R/TP
6
R112
RES,CHIP
ERHY0000254
4.7K ohm,1/16W,J,1005,R/TP
6
R113
RES,CHIP
ERHY0000201
0 ohm,1/16W,J,1005,R/TP
6
R114
RES,CHIP
ERHY0000201
0 ohm,1/16W,J,1005,R/TP
6
R201
RES,CHIP
ERHY0000241
1K ohm,1/16W,J,1005,R/TP
6
R202
RES,CHIP
ERHY0000241
1K ohm,1/16W,J,1005,R/TP
6
R204
RES,CHIP
ERHY0000244
1.5K ohm,1/16W,J,1005,R/TP
6
R206
RES,CHIP
ERHY0000247
2.2K ohm,1/16W,J,1005,R/TP
6
R209
RES,CHIP
ERHY0007007
15 ohm,1/8W ,F ,2012 ,R/TP
6
R210
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R217
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R221
RES,CHIP
ERHY0000247
2.2K ohm,1/16W,J,1005,R/TP
6
R225
RES,CHIP
ERHY0000296
1M ohm,1/16W,J,1005,R/TP
6
R227
RES,CHIP
ERHY0000201
0 ohm,1/16W,J,1005,R/TP
6
R228
RES,CHIP
ERHY0000230
330 ohm,1/16W,J,1005,R/TP
6
R229
RES,CHIP
ERHY0000201
0 ohm,1/16W,J,1005,R/TP
6
R230
RES,CHIP
ERHY0000257
6.8K ohm,1/16W,J,1005,R/TP
6
R232
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R233
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R234
RES,CHIP
ERHY0000267
24K ohm,1/16W,J,1005,R/TP
6
R235
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R236
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R237
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R238
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R239
RES,CHIP
ERHY0000152
82K ohm,1/16W,F,1005,R/TP
6
R240
RES,CHIP
ERHY0000261
10K ohm,1/16W,J,1005,R/TP
6
R242
RES,CHIP
ERHY0000265
20K ohm,1/16W,J,1005,R/TP
6
R301
RES,CHIP
ERHY0000261
10K ohm,1/16W,J,1005,R/TP
6
R302
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R322
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R325
RES,CHIP
ERHY0000262
12K ohm,1/16W,J,1005,R/TP
6
R326
RES,CHIP
ERHY0000203
10 ohm,1/16W,J,1005,R/TP
6
R327
RES,CHIP
ERHY0000203
10 ohm,1/16W,J,1005,R/TP
6
R328
RES,CHIP
ERHY0000262
12K ohm,1/16W,J,1005,R/TP
6
R329
RES,CHIP
ERHY0000203
10 ohm,1/16W,J,1005,R/TP
6
R330
RES,CHIP
ERHY0000203
10 ohm,1/16W,J,1005,R/TP
Description
Part Number
Specification
- 139 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R333
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R334
RES,CHIP
ERHY0000273
47K ohm,1/16W,J,1005,R/TP
6
R344
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R345
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R346
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R347
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R348
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R350
RES,CHIP
ERHY0000203
10 ohm,1/16W,J,1005,R/TP
6
R351
RES,CHIP
ERHY0000226
220 ohm,1/16W,J,1005,R/TP
6
R353
RES,CHIP
ERHY0000244
1.5K ohm,1/16W,J,1005,R/TP
6
R355
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R357
RES,CHIP
ERHY0000258
7.5K ohm,1/16W,J,1005,R/TP
6
R358
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R360
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R361
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R363
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R364
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R365
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R366
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R367
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R368
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R369
RES,CHIP
ERHY0000265
20K ohm,1/16W,J,1005,R/TP
6
R370
RES,CHIP
ERHY0000213
47 ohm,1/16W,J,1005,R/TP
6
R373
RES,CHIP
ERHY0000273
47K ohm,1/16W,J,1005,R/TP
6
R374
RES,CHIP
ERHY0000273
47K ohm,1/16W,J,1005,R/TP
6
R375
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R376
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R403
RES,CHIP
ERHY0008201
24 ohm,1/16W ,J ,1005 ,R/TP
6
R404
RES,CHIP
ERHY0000226
220 ohm,1/16W,J,1005,R/TP
6
R405
RES,CHIP
ERHY0000226
220 ohm,1/16W,J,1005,R/TP
6
R407
RES,CHIP
ERHY0000210
30 ohm,1/16W,J,1005,R/TP
6
R408
RES,CHIP
ERHY0000224
180 ohm,1/16W,J,1005,R/TP
6
R409
RES,CHIP
ERHY0000224
180 ohm,1/16W,J,1005,R/TP
6
R410
RES,CHIP
ERHY0000241
1K ohm,1/16W,J,1005,R/TP
6
R412
RES,CHIP
ERHY0000201
0 ohm,1/16W,J,1005,R/TP
6
R415
RES,CHIP,MAKER
ERHZ0000205
1 Mohm,1/16W ,F ,1005 ,R/TP
6
R416
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
Description
Part Number
Specification
- 140 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R417
RES,CHIP
ERHY0000263
15K ohm,1/16W,J,1005,R/TP
6
R419
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R502
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R503
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R504
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R505
RES,CHIP
ERHY0000208
22 ohm,1/16W,J,1005,R/TP
6
R506
RES,CHIP
ERHY0000244
1.5K ohm,1/16W,J,1005,R/TP
6
R507
RES,CHIP
ERHY0000241
1K ohm,1/16W,J,1005,R/TP
6
R508
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R509
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R511
RES,CHIP
ERHY0000244
1.5K ohm,1/16W,J,1005,R/TP
6
R512
RES,CHIP
ERHY0000241
1K ohm,1/16W,J,1005,R/TP
6
R601
RES,CHIP
ERHY0000254
4.7K ohm,1/16W,J,1005,R/TP
6
R602
RES,CHIP
ERHY0000254
4.7K ohm,1/16W,J,1005,R/TP
6
R603
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R604
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
R605
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R606
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
SW400
CONN,RF SWITCH
ENWY0002301
ANGLE ,SMD ,0.8 dB,
6
U101
IC
EUSY0169301
148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG
BASEBAND / TYPHOON B, Pb Free
6
U102
IC
EUSY0181504
CSP BGA ,204 PIN,R/TP ,AD6527 w/USB
6
U201
IC
EUSY0204801
SC82-AB (SC70-4) ,4 PIN,R/TP ,80mA CMOS LOW IQ
LDO VOLTAGE REGULATOR / 2.5V
6
U203
IC
EUSY0223002
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH
OUTPUT CONTROL / 2.8V
6
U204
IC
EUSY0119002
4X3 UCSP / CODE : B12-4 ,10 PIN,R/TP ,DUAL SPDT
ANALOG SWITCHES(Pb Free)
6
U205
IC
EUSY0227901
SON5-P-0.35(fSV) ,5 PIN,R/TP ,2-INPUT AND GATE, Pb
Free
6
U206
IC
EUSY0163901
uCSP ,10 PIN,R/TP ,Dual Analog Switch, 300MHz
Bandwidth
6
U207
IC
EUSY0291001
67ball WLCSP, 64Poly+MP3 ,67 PIN,R/TP ,
6
U301
IC
EUSY0288701
BGA ,84 PIN,ETC ,256(1die flash)*64(PSRAM), 3V,
8x11.6x1.2mm, 84ball, Pb-Free
6
U302
IC
EUSY0227901
SON5-P-0.35(fSV) ,5 PIN,R/TP ,2-INPUT AND GATE, Pb
Free
6
U400
PAM
SMPY0008301
35 dBm,53 %,0.0000025 A, dBc,50 dB,6.0*6.0*1.2 ,SMD
,FOR QUAD BAND GSM AND GPRS
6
U401
IC
EUSY0223202
5.0*5.0 ,32 PIN,R/TP ,AERO11 TRANSCEIVER, D
Version
6
U402
IC
EUSY0077201
SC70 ,5 PIN,R/TP ,Inverter Gate, Pb Free
Description
Part Number
Specification
- 141 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
U403
6
Description
Part Number
Specification
IC
EUSY0118602
SOT23 ,5 PIN,R/TP ,2.85V/150mA Low Noise uCap LDO
Regulator, PBFREE
U501
IC
EUSY0277901
MLF ,10 PIN,R/TP ,Dual(1.8V/150mA,2.9V/300mA) LDO
Regulator
6
U502
IC
EUSY0245401
DFN ,16 PIN,R/TP ,Main 3 LEDs(60mA) + Flash (300mA)
Charge pump
6
U503
IC
EUSY0240501
BGA(6.2*7.2*1.3t) ,96 PIN,R/TP ,128Kbyte SRAM, VGA
Camera IC
6
VA201
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
VA202
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
VA203
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
VA204
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
VA308
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
VA309
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA310
VARISTOR
SEVY0003901
5.5 V, ,SMD ,480pF, 1005
6
X101
X-TAL
EXXY0015601
.032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3
6
X400
VCTCXO
EXSK0006601
26 MHz,2.5 PPM,10 pF,SMD ,3.2*2.5*1.2 ,Pb Free
5
SAFD00
PCB ASSY,MAIN,SMT TOP
SAFD0069103
6
C301
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C302
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C303
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C304
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C305
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C306
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C307
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C308
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C309
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C310
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C311
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C312
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C313
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C314
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C520
CAP,CERAMIC,CHIP
ECCH0000137
330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6
C521
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C522
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
LD301
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD302
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD303
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD304
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
- 142 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
LD305
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD306
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD307
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD308
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD309
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD310
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD311
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD312
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD313
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD314
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
R215
RES,CHIP
ERHY0000261
10K ohm,1/16W,J,1005,R/TP
6
R216
RES,CHIP
ERHY0000241
1K ohm,1/16W,J,1005,R/TP
6
R220
RES,CHIP
ERHY0000258
7.5K ohm,1/16W,J,1005,R/TP
6
R223
RES,CHIP
ERHY0000261
10K ohm,1/16W,J,1005,R/TP
6
R226
RES,CHIP
ERHY0000207
20 ohm,1/16W,J,1005,R/TP
6
R303
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R304
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R305
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R306
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R307
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R308
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R309
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R310
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R311
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R312
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R313
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R314
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R315
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R316
RES,CHIP
ERHY0000209
27 ohm,1/16W,J,1005,R/TP
6
R318
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R319
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R320
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R321
RES,CHIP
ERHY0000220
100 ohm,1/16W,J,1005,R/TP
6
R323
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R324
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R331
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R332
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
Description
Part Number
Specification
- 143 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R343
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R349
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R352
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R354
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R356
RES,CHIP
ERHY0000237
680 ohm,1/16W,J,1005,R/TP
6
R510
RES,CHIP
ERHY0000280
100K ohm,1/16W,J,1005,R/TP
6
U504
IC
EUSY0129501
SC-74A ,3 PIN,R/TP ,HALL-EFFECT SWITCH, Pb Free
6
VA301
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA302
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA303
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA305
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA306
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
6
VA307
VARISTOR
SEVY0000702
14 V,10% ,SMD ,
5
SPFY00
PCB,MAIN
SPFY0124401
FR-4 ,0.8 mm,BUILD-UP 8 ,KG245 MAIN PCB
5
WSYY00
SOFTWARE
WSYY0350401
KG245P64-07-V10f-XXX-XX MAR 28 2006
Description
Part Number
Specification
- 144 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.3 Accessory
Level
Location
No.
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
Specification
3
ADEY00
DATA KIT
ADEY0004801
KG245 CD Ass'y for Russia
4
MBAZ00
BAG
MBAZ0004701
CD Cover
4
MCHZ00
COMPACT DISK
MCHZ0015401
4
MMBA00
MANUAL,INSTALLATION
MMBA0018501
Installation guide for Mobile Agent
3
MHBY00
HANDSTRAP
MHBY0000404
Hand Strap 135mm
3
SBPL00
BATTERY PACK,LI-ION
SBPL0077901
3.7 V,830 mAh,1 CELL,PRISMATIC ,FG101
RUSSV423450, Innerpack
3
SGDY00
DATA CABLE
SGDY0004401
DK-20G, G7000 ,Cable bulk
3
SGEY00
EAR PHONE/EAR MIKE
SET
3
SSAD00
ADAPTOR,AC-DC
3
WSAY00
SOFTWARE,APPLICATION WSAY0041401
SGEY0003204
SSAD0007828
L1200 ,MONO TYPE
100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,EU
PLUG(24P),STD
060321_KG245_CIS
- 145 -
Color
Remark
59
Black
Note
Note