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Service Manual
Service Manual
KG270/MG160
Model : KG270/MG160
Date: April, 2007 / Issue 1.0
Table Of Contents
1. INTRODUCTION ...............................5
4.13 Headphone Trouble .............................75
1.1 Purpose .................................................. 5
4.14 Charging Trouble .................................77
1.2 Regulatory Information............................ 5
4.15 FM Radio Trouble ................................79
2. PERFORMANCE...............................7
5. DOWNLOAD.......................................82
2.1 H/W Features...........................................7
5.1 Download Setup.....................................82
2.2 S/W Features ...........................................8
5.2 Download Process .................................83
3. TECHNICAL BRIEF ........................14
6. BLOCK DIAGRAM ..........................88
3.1 Digital Main Processor(PMB7880).........14
7. Circuit Diagram ..............................89
3.2 Power Amplifier Module (SKY77318) ....22
3.3 26 MHz Clock (DCXO)...........................24
3.4 RTC(32.768KHz Crystal) .......................25
3.5 LCD Interface(3-wire SPI interface) .......26
8. PCB LAYOUT ..................................93
9. ENGINEERING MODE ....................95
3.6 SIM Card Interface.................................28
9.1 About Engineering Mode .......................95
3.7 KEYPAD Interface .................................29
9.2 Access Codes ........................................95
3.8 Battery Charging Block Interface ...........30
9.3 Key Operation ........................................95
3.9 RF Interface ...........................................31
9.4 Engineering Mode Menu Tree ...............95
3.10 Audio Interface.....................................33
10. CALIBRATION ..............................92
3.11 Key LED Interface................................37
3.12 Vibrator Interface .................................38
3.13 Memory Interface .................................39
10.1 Test Equipment Setup .........................92
10.2 Calibration Steps..................................92
3.14 Power Block Interface ..........................40
11. STAND ALONE TEST .................109
3.15 FM Radio Interface ..............................42
11.1 Test Program Setting .........................109
4. TROUBLE SHOOTING ...................44
11.2 Tx Test ...............................................111
4.1 RF Trouble .............................................44
11.3 RX Test ..............................................112
4.3 Power On Trouble..................................54
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 113
4.4 SIM Card Trouble...................................56
12.1 Exploded View .................................. 113
4.2 TX Trouble .............................................50
4.5 Vibrator Trouble .....................................58
4.6 Keypad Trouble......................................60
4.7 RTC Trouble ..........................................62
4.8. Key backlight Trouble ...........................64
4.9. LCD Trouble..........................................66
4.10. Microphone Trouble ............................69
4.11. Receiver Trouble.................................71
4.12 Speaker Trouble ..................................73
-3-
12.2 Replacement Parts ............................115
12.3 Accessory ......................................... 124
-4-
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, description and download the features of
this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
-5-
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
-6-
2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item
Specifications
Band
GSM DUAL Band(900/1800)
Type
Bar type
Dimension
98 * 45 * 12.9mm
Weight
60g
Battery
750mAh Li-ion
Talk Time
Over 2hours @EGSM,TX Level : 5
Stand-by Time
Over 200 hours @Paging period : 5
RTC
Under 4 hours when removed battery.
Antenna
Internal Type(Dual-band)
LCD(Main)
1.52"(128x128 pixels), 65K Color STN LCD
Back Light
Yes
Back Light color
Blue
Vibrator
Yes
Speaker&Receiver
Yes(11x07 Receiver, 16®™ Speaker)
C-MIC
Yes
Earphone Jack
Mono or Stereo(Optional)
SIM
Yes(Plug in Type) : 3.0V
MIDI
16 poly
I/O Connect
18 Pins (included Earphone Jack)
-7-
2. PERFORMANCE
2.2 S/W Features
Function
Detail Item
Specification
Operating System OS
O
Data
Circuit
O
Packet
X
Infrared (IrDA)
X
Bluetooth
X
USB
X
USB Mass storage
X
RS232
O
Voice Recording
X
Voice Command
X
Answering machine
X
User Memory
O
TBD
X
MMS
Connectivity
Voice Function
Memory
Etc.
OSE
Under 300KB
Pictures (Still Image &
X
Moving Image)
X
MP3 (Music Contents)
X
Java Contents
O
Wallpaper
3 bitmap images
O
Ringtone
10 MIDI Ringtones
X
external memory (microSD)
Camera
Camera Module
X
Audio
Voice Codec
O
AMR
O
FM Radio
O
Integrated handsfree speaker
O
-8-
FR, HR, EFR, AMR-NB
Speaker phone mode
2. PERFORMANCE
Function
Display
Detail Item
Specification
RSSI
O
6 level
Battery Level
O
5 level
RTC
O
Multi?Language
O
Basic:English
Max. 4 language of Latin
2 or 3 language of etc.
Quick Access Mode
X
PLMN/Service Indicator
O
Dimming Clock
X
Dual Clock
X
Local Time / Selected Area Time
Last Dialed Number
O
10
Last Received Number
O
10
Last Missed Number
O
10
Scratch Pad Memory
X
Call
Call Waiting
O
Manage-ment
Call Swap
O
Call Retrieve
O
Auto Answer
X
Automatic Redial
O
Calling Line dentification
O
Full Call divert
O
Speed Dialing
O
Last Number Redial
O
Multi-party Call (Conference Call)
O
Explicit Call Transfer
X
Normal Features
-9-
Etc.
2. PERFORMANCE
Function
Network
DTMF
Audio
Cell Broadcast
Detail Item
Specification
Automatic Network Selection
O
Manual Network Selection
O
Network Service Status
O
DTMF Signaling
O
DTMF Enable & Disable
O
Key Tone Volume
O
6 Level (Include Mute)
Ring Tone Volume
O
6 Level (Include Mute)
Ring Tone Pattern
O
10Type(fixed)
Ring Type Silent
O
Vibrator & Ring (Indicator)
Earpiece Volume
O
6 Level (Include Mute)
Mute
O
Read Cell Broadcast
O
Cell Broadcast Categories
O
Cell Broadcast Message
O
Language
Phone Book
Entry
O
300
Field
O
Office,Mobile
Numeric Store and Recall
O
Alphabetic Store
O
Alphabetic Recall
O
Scroll by alphabetic or
O
numeric order
Last Number Dialed
O
10
Last Number Missed
O
10
Last Number Received
O
10
Copy & Move
O
Fixed Dial Number
O
Barred Dial Number
X
Service Dial Number
O
Email Entry
X
Picture ID
X
Video Caller ID
X
My Name card
X
- 10 -
Etc.
2. PERFORMANCE
Function
Supp. Services
Detail Item
Call Forwarding
Call Barring
Specification
O
All Incoming Calls,
O
No Reply
O
On Busy,
O
Not reachable
O
All Outgoing Calls,
O
International Calls,
O
Etc.
Calls except to Home Country
incoming Calls,
O
All incoming Calls when roaming
Conference Call
O
up to 3 calls
Plug?In Type
O
3 V only
SIM Lock
O
Service Provider / Network Lock
SIM Toolkit
O
Class 1, 2, 3
Prepaid SIM Operation
O
Mega SIM
X
Short Messaging
Read Message
O
Manage-ment
Write and Edit Message
O
Send and Receive Message
O
Reply to Message
O
SIM
Not Support EMS
Forward Message
Extract Number from Message
O
Message Status
O
Message Unread Indicator
O
Settable Message Center Number, O
Reply Path and Validity
Visible and Audible Message
O
O
Receive Alerting
Voice Mail
O
Settable Voice Mail Center Number
O
Message Protocol
O
Normal, Fax, National Paging,
Email, X400, ERMES, Voice
Message Overflow Indicator
O
Message Center Number
O
Help Menu
X
- 11 -
2. PERFORMANCE
Function
Sound contents
Detail Item
Specification
Ringtones
O
Karaoke
X
Stutter Sound
X
Flip tone
X
Button tone
O
Others
X
Miscellaneous
Development & Test Facility
O
Function
Field Test Facility
O
Display Software Version
O
IMEI
O
Language
O
Selectable Auto Language
Predictive word input
O
T9
Schedule
O
20 input (20 character)
To Do List
X
50 input
Memo
O
20 input (40 character)
D-day counter
X
Send via Bluetooth
X
Setting Local Time
O
Display Two Number of Cities Time
X
Dual clock
Daylight saving
X
Summer time calibration function
NITS
X
Automatic setting as country code in SIM
O
Currency, Surface, Length, Weight,
Text Input
Scheduler
World Time
Unit converter
Schedule, Memo, To Do list, Messaging
Temperature, Volume, Velocity
Stop watch
O
Calculator
Calculation
O
PC Sync
Phone Book Sync
X
Message Sync
X
Multimedia Contents Sync
X
Scheduler Sync
X
+-*/
E-MAIL, EMS, Schedule, Phonebook,
Name card etc.
Sync ML
DS
X
DM
X
Game
Menu
X
Quick Access Mode (Profile)
X
External Interface Electrical Man Machine Interface O
Development and Test Facility
O
- 12 -
Etc.
2. PERFORMANCE
Function
Handset
Security
Real Time Clock
Accessory
Detail Item
Specification
Restore Factory Setting
Read Software Version
Battery Charging Mode
Emergency Call
Handset Lock
Security Code
SIM Lock
Key guard
12/24 hour
Calendar
Time Zone
Daylight saving
Alarm Manager
Dimming Clock
Power-off Alarm
On Alarm Event
Hand strap
Embedded microSD Card
microSD Adapter
Stereo earmic
O
O
O
O
O
O
O
O
O
O
O
X
O
X
O
O
X
X
X
O
earmic w/music remote controller
Neck strap
LCD Cleaner
Holster
Data cable
CD
Holster charger
X
X
X
X
O
X
X
additional standard battery
Extended Battery
Desktop Charger
Cigar Lighter Adapter
Portable Handsfree
Bluetooth headset
Bluetooth stereo earset controller
Car kit
Leather Pouch
Stylus Pen
X
X
X
X
X
X
X
X
X
X
X
X
Compass
- 13 -
Etc.
Delete all
Automatic Leap Year Adjustment
Once, Daily, Mon~Fri, Mon~Sat
Display
EarMic Type
Provides optionally
only for supporting
FM radio function.
RS232 cable
Option
Standard battery Back-up
and Holster function
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Main Processor(PMB7880)
Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM
- 14 -
3. TECHNICAL BRIEF
3.1.1 Overview of E-GOLDvoice
The E-GOLDvoice is a GSM baseband modem including RF transceiver covering the low bands
GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands.
E-GOLDvoice is Dual Band, therefore, it supports by default a low / high pair of bands at the same
time:
1. GSM850 / GSM1800
2. GSM850 / GSM1900
3. GSM900 / GSM1800
4. GSM900 / GSM1900
The E-GOLDvoice is optimized for voice-centric Mobile Phone applications.
The E-GOLDvoice is designed as a single chip solution that integrates the digital, mixed-signal, RF
functionality and a direct-to-battery Power Management Unit.
The transceiver consists of:
• Constant gain direct conversion receiver with an analog I/Q baseband interface
• Fully integrated Sigma/Delta-synthesizer capability
• Fully integrated two-band RF oscillator
• Two-band digital GMSK modulator with digital TX interface
• Digitally controlled crystal oscillator generating system clocks.
The E-GOLDvoice supports a direct battery connection, hence eliminating the need for an external
Power Management Unit. The E-GOLDvoice has different power down modes and an integrated
power up sequencer.
The E-GOLDvoice is powered by the C166®S MCU and TEAKLite® DSP cores. The operating
temperature range from -40C to 85C. It is manufactured using the 0.13 •Ïm CMOS process.
- 15 -
3. TECHNICAL BRIEF
3.1.2 Features
] Baseband
• High performance fixed-point TEAKlite DSP
• C166S high performance microcontroller
• There are several Interfaces:
- I2S interface for DAI connections (for Tape Approval)
- High Speed SSC Interface for connection of external peripherals
- SIM Interface
- Keypad Interface (6x4 or 5x5 keys)
- EBU for external RAM/FLASH connection
- Asynchronous serial interface
- JTAG Interface
- Black & white and color displays are supported
- PWM source to drive vibrator
- Keypad and display backlight supported.
] Receiver
• Constant gain, direct conversion receiver with fully integrated blocking filter
• Two integrated LNAs
• No need of interstage and IF filter
• Highly linear RF quadrature demodulator
• Programmable DC output level
• Very low power budget.
] Transmitter
• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz
• Single ended outputs to PA, Pout = +3.5 dBm
• Very low power budget.
] RF-Synthesizer
• Σ∆Synthesizer for multi-slot operation
• Fast lock-in times (< 150 •Ïs)
• Integrated loop filter
• RF Oscillator
• Fully integrated RF VCO.
] Crystal Oscillator
• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.
- 16 -
3. TECHNICAL BRIEF
] Mixed Signal and Power Management Unit
• DC/DC boost for voltages up to 15V for driving White or Blue LEDs
• 8-Ohm loud speaker driver (250/350mW)
• 16-Ohm earpiece driver
• 32-Ohm headset driver
• 4 measurement interfaces (PA temperature, battery voltage, battery temperature,and ambient
temperature)
• Differential microphone input
• System start up circuitry
• Charger circuitry for NiCd, NiMh and LiIon cells
• Integrated regulators for direct connection to battery.
- 17 -
3. TECHNICAL BRIEF
3.1.3 GSM System Description
The E-GOLDvoice is suited for mobile stations operating in the GSM850/900/1800/1900 bands.
In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified
to target level by the RF transceiver chipset.
Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel
filtering is done by a digital baseband filter in each path.
The DSP performs:
1. The GMSK equalization of the received baseband signal (SAIC support available)
2. Viterbi channel decoding supported by an hardware accelerator.
The recovered digital speech data is fed into the speech decoder.
The E-GOLDvoice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech CODEC
algorithms.
The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data
stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a
programmable gain stage.
The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output
driver for external loud speaker is implemented.
In the transmit direction the differential microphone signal is fed into a programmable gain amplifier.
The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled
voice signal passes a digital decimation filter.
The E-GOLDvoice performs speech and channel encoding (including voice activity detection (VAD)
and discontinuous transmission (DTX)) and digital GMSK modulation.
In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in
the 850 MHz, 900 MHz, 1.8 GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLDvoice
supports dual band applications.
Finally, an RF power module amplifies the RF transmit signal at the required power level. Using
software, the E-GOLDvoice controls the gain of the power amplifier by predefined ramping curves (16
words, 11 bits).
For baseband operation, the E-GOLDvoice supports:
• Making or receiving a voice call
• Sending or receiving an SMS.
- 18 -
3. TECHNICAL BRIEF
3.1.4 PMU Details
The E-GOLDvoice includes battery charger support (various sensor connections for temperature,
battery technology, voltage, etc.) and a ringer buffer.
E-GOLDvoice avoids the need for an external power management component because its internal
power management unit contains:
• Voltage regulators for the On-chip and Off-chip functional blocks
• Charger circuitry for NiCd, NiMh and LiIon cells.
3.1.5 Bus Concept
The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus.
There is an interconnection between the TEAKlite bus and the C166S X-Bus.
3.1.6 C166S Buses
The C166S is connected to three buses:
1. Local Memory (LM) bus
2. X-Bus
3. PD-Bus.
3.1.7 TEAKLite Bus
The TEAKlite is connected to the TEAKlite bus.
3.1.8 Bus Interconnections
The interconnection between the X-Bus and the TEAKlite Bus uses:
• Multicore Synchronization
• Shared Memory.
3.1.9 Clock Concept
The E-GOLDvoice has a flexible clock control.
3.1.10 Interrupt Concept
The C166 MCU carries out the E-GOLDvoice interrupt system.
3.1.11 Debug Concept
The E-GOLDvoice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in
parallel with:
• A single JTAG port (that is, on a single host)
• Mutual breakpoint control.
- 19 -
3. TECHNICAL BRIEF
3.1.12 C166 Debug Concept
The debugging of the C166 uses the OCDS and the Cerberus.
3.1.13 TEAKLite Debug Concept
TEAKlite debugging uses the OCEM and the SEIB.
3.1.14 Power Management
The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone
application. The integrated PMU is directly connected to the battery and provides a set of linear
voltage regulators (LDO’s).
These LDO’s generate all required supply voltages and currents needed in a low feature mobile
phone. A charger control circuit charges NiCd, NiMH and LiIon batteries.
The charger control supports hardware controlled pre-charging and software controlled charging. It
offers a wide charger voltage range, making halfwave/full-wave charging with cheap transformers
possible.
White/blue backlight generation is supported with a special driver for very a low external parts count.
Power consumption during operation phases is minimized due to flexible clock switching In the
Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the
controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during
Standby via SW.
3.1.15 On-Chip Security Concept
Secure boot is based on a public/private key approach. Flash images that are not signed with the
private key during phone manufacture cannot be loaded.
Verification of the Flash code is done with the public key. The public key as well as hash and verify
algorithms are stored in the ROM, which ensures a hardware secured boot procedure.
The following security features are supported:
• Prevention of illegal Flash programming
• Flash programming makes use of the E-GOLDvoice ID for personalization checks with IMEI and
SIM-lock protection
- 20 -
3. TECHNICAL BRIEF
The security features use the following mechanism:
• Boot ROM flow:
- Controls the boot transition to external flash
- Controls the flash update
• Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLDvoice chip has its
own fused ID.
Further details on the E-GOLDvoice security concept are not publicly documented.
3.1.16 Asynchronous Operation Mode Concept
The E-GOLDvoice can operate in either:
• The traditional synchronous mode with the 26MHz system clock synchronized on the base station
• A special asynchronous mode (XO concept).
In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the
residual frequency offset is compensated in the digital signal processing domain. This processing
includes frequency and timing compensation of the baseband and voiceband signals.
- 21 -
3. TECHNICAL BRIEF
3.2 Power Amplifier Module (SKY77318)
Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.
The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching
circuitry for 50 Ω input and output impedances and a Power Amplifier Control (PAC) block with an
internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC
function and interface circuitry.
Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA
block supports the GSM bands and the other supports the DCS1800 and PCS1900 bands. Both PA
blocks share common power supply pins to distribute current.
The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate
substrate. The assembly is encapsulated with plastic overmold.
- 22 -
3. TECHNICAL BRIEF
RF input and output ports of the SKY77318 are internally matched to a 50 Ω load to reduce the
number of external components for a quad-band design. Extremely low leakage current (2.5 µA,
typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains
bandselect switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the
Band Select (BS) signal.
In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT orGSM_OUT) and the Analog
Power Control (VAPC) controls the level of output power.
The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power
amplifier control (iPAC) function, which is insensitive to variations in temperature, power supply,
process, and input power.
The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
- 23 -
3. TECHNICAL BRIEF
3.3 26 MHz Clock (DCXO)
Figure. 3-3 E-GoldVoice DCXO Overview
DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature
Compensated Crystal Oscillator) are two different techniques used To maintain the mobile’s reference
oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial
crystal frequency offset, temperature drift and aging.
These static and dynamic frequency variations have to be compensated, otherwise the mobile would
be in danger of losing connection to the network.
The technique used to perform the frequency compensation is generally termed Automatic Frequency
Control (AFC).
To summarize the operation of DCXO, GSM Baseband processor will calculate the AFC compensation
(which is continuously updated) required based on the measured frequency error. Then the required
AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns
control the DCXO core and generates The 26MHz system clock.
- 24 -
3. TECHNICAL BRIEF
3.4 RTC(32.768KHz Crystal)
32.768KHZ CRYSTAL
X100
32KIN
32KOUT
4
3
1
2
MC-146_12_5PF
18p
18p
C104
C105
32.768KHz
Figure. 3-4 E-Gold Voice RTC Interface
The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external
interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup
battery. This allows the generation of external interrupts, even when the main PMB7880 supply
voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC
and VSS_RTC.
The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880
F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip
32 KHz oscillator module.
The low clock frequency and the optimized low power design give the possibility to run the chip with a
minimum of power dissipation. For example, for this specific application the 26 MHz reference
oscillator can be switched off during system standby and a lowpower time reference can be kept when
the 32k clock is provided to the RTC.
The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32
kHz oscillator, as described in the following sections. The module RTC Shell solely performs level
translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally
associated with the RTC.
- 25 -
3. TECHNICAL BRIEF
3.5 LCD Interface(3-wire SPI interface)
2V8_VIO
CN200
1
2
LCD_RESET
SSC0_CLK
R205
R207
4
47
5
47
7
R206
47
8
R208
47
CS3
SSC0_MTSR
10
MLED1
11
MLED2
C209
27p
6
9
MLED
C208
NA
MTPD
3
MTPG
C210
27p
12
14
15
13
R210
100K
C211
27p
LCD_ID
C212
27p
C213
NA
C221
1u
IMSA-9671S-13Y902
(ENQY0013801)
Figure 3-5-1. LCD Interface
CHARGE PUMP
VBAT
U200
5
8
MLED
11
W_LED_DRV
R202
100K
C202
27p
4
IN
AAT3157ITP-T1
10
C1+
C1C2+
C200
1u
9
7
C201
CP
1u
C2-
EN_SET
GND
D1
D2
D3
NC
6
1
2
3
12
MLED1
MLED2
C203
27p
Figure 3-5-2. Charge pump interface
- 26 -
C204
27p
C214
NA
3. TECHNICAL BRIEF
Signals
CS3
Description
This signal enable to access to the driver IC of LCD.
SSC0_MTSR
This signal transfer serial data to driver IC.
SSC0_CLK
This signal transfer serial clock to driver IC.
LCD_RESET
MLED
This signal makes driver IC to HW default status.
This signal provide power to white LEDs.
MLED1/2
This signal be feed back from white LEDs.
2V8_VIO
This signal provides power to LCD modules.(2.8V)
The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a trimode
load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED
applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel
from a 2.7V to 5.5V input.
The current sinks may be operated individually or in parallel for driving higher current LEDs. A low
external parts count (two 1µF flying capacitors and two small 1µF capacitors at VIN and VOUT) make
this part ideally suited for small, battery-powered applications. AnalogicTech's S2Cwire™ (Simple
Serial Control™) serial digital input is used to enable, disable, and set current for each LED with 16
settings down to 50µA.
The low-current mode supply current can be as low as 50µA to save power.
Data
Output (mA/Ch)
Data
Output (mA/Ch)
1
20.0
9
5.0
2
17.0
10
4.2
3
14.0
11
3.4
4
12.0
12
2.8
5
10.0
13
1.0
6
8.6
14
0.5
7
7.0
15
0.1
8
6.0
16
0.05
Figure 3-5-3. Charge pump Output Current
- 27 -
3. TECHNICAL BRIEF
3.6 SIM Card Interface
2V85_VSIM
SIM_DATA
R303
2V85_VSIM
0
R302
4.7K
2V85_VSIM
J300
4
GND
VCC
5
VPP
RST
6
CLK
I_O
8
GND2 GND1
1
2
3
7
SIM_RST
SIM_CLK
C311
0.1u
C310
22p
C312
22p
Figure 3-6. SIM CARD Interface
The EGoldVoice provides SIM Interface Module. The AD6527 checks status Periodically During
established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.
Signals
Description
SIM_RST
This signal makes SIM card to HW default status.
SIM_CLK
This signal is transferred to SIM card.
SIM_DATA
This signal is interface datum.
- 28 -
3. TECHNICAL BRIEF
3.7 KEYPAD Interface
2V0_VRTC
KEY MATRIX
END
SW200
END_KEY
1
SW201
2
SW202
3
SW203
SW204
LEFT
SW205
MENU
R201
KEY_OUT1
680
C205
NA
SW206
4
SW207
7
SW212
5
SW208
8
SW213
6
SW209
9
SW214
UP
SW210
SEL
R203
KEY_OUT2
680
C206
NA
SW211
RIGHT
SW215
SEND
R204
KEY_OUT3
680
C207
NA
SW216
*
SW2170
SW218
#
SW219
DOWN
R209
KEY_OUT4
680
C215
NA
C216
NA
C217
NA
C218
NA
C219
NA
C220
NA
R211 680
KEY_IN0
R212 680
KEY_IN1
R213 680
KEY_IN2
R214 680
KEY_IN3
R215 680
KEY_IN4
Figure 3-7 KEY MAXTRIX Interface
The keypad interface is connected to the X-Bus, together with the XBIU and the Shared Memory
Register, using a single Bus Interface.
The keypad supports two scan modes:
• By default, the keypad is a 4x6 scan matrix (4 input and 6 output pins).
• To set the keypad to a 5x5 scan matrix (5 input and 5 output pins)
The scan mode should be determined at the very beginning of the system start because changes are
not allowed later.
- 29 -
3. TECHNICAL BRIEF
3.8 Battery Charging Block Interface
CHARGING IC
2V8_VIO
VBAT VCHARGE
VCHARGE
R118
NA
R119
1.8K
U101
1
CHARGE_DETECT
2
R121
CHG_STATUS
NA
C126
(10V,K,X5R)
1u
C127
0.015u
VIN
_FAULT
VBAT
VSEN_TEMP
10
C125
1u
9
R120
NA
(10V,K,X5R)
3
4
_STATUS
IREF
TIME
V2P8
5
GND
11
PGND
EN
8
R122
0
CHG_EN_TEST
7
R123
6
NA
CHG_EN
C128
R124
R125
1u
160K
100K
ISL9201IRZ-T
(1%)
Figure 3-8. Charging IC Interface
The AAT3681A is a high performance battery charger designed to charge single Cell
lithiumion/polymer batteries with up to 500mA of current from an external power source.
It is a stand-alone charging solution, with just one external component required For complete
functionality. The AAT3681A precisely regulates battery charge voltage and current for 4.2V lithiumion/polymer battery cells.
The adapter/USB charge input constant current level can be programmed up to 500mA for rapid
charging applications.
The AAT3681A has four basic modes for the battery charge cycle:
pre-conditioning/trickle charge; constant current/fast charge; constant voltage; and end of charge.
- 30 -
3. TECHNICAL BRIEF
3.9 RF Interface
FL400
9
3
7
VC1
VC2
C417
27p
5
8
10
C418
27p
LMSP2PAA-575TEMP
GSM1800_1900TX
GSM1800_1900RX
VC_GSM850_900TX
VC_GSM1800_1900TX
IN
GND1
GND2
GND3
GSM850_900TX
GSM850_900RX
1
6
2
4
Figure 3-9-1. ASM interface
C419
G4
G3
G1
4 I2
O2_2
6
O2_1
7
O1_2
8
O1_1
9
C420
1 I1
FL401
GSM_RXN
L403
18nH
5 10
G2
3
2
3p
C421
3p
GSM_RXP
3p
DCS_RXN
B9308
L404
5.1nH
PART_NO SFSB0001401
IN CASE OF GSM850/PCS1900
CHANGE THIS DUAL SAW FILTER
TO PART_NO SFSB0001301
C422
3p
DCS_RXP
Figure 3-9-2. SAW Filter interface
E-GOLDvoice features a fully integrated constant-gain direct conversion receiver, i.e. there is no
interstage filter needed and the baseband level at the analogue IQinterface follows directly the RF
input level. Depending on the baseband ADC dynamic range, single- or multiple-step gain switching
schemes are possible.
An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and
reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset
compensation is implemented and can be switched depending on the gain setting.
- 31 -
(50V,J,NP0)
(10V,Z,Y5V)
(50V,J,NP0)
VBAT
(16V,K,X7R)
(50V,J,NP0)
C401
39p
R402
1K
TX_RAMP
3. TECHNICAL BRIEF
VBAT
R404
R405
DCS_PCS_OUT
0
0
VAPC
15
R406
11
0
19
C412
NA
21
EGSM_OUT
RSVD_GND
U400
SKY77318
2
DCS_PCS_IN
EGSM_IN
3
(50V,J,NP0) (16V,K,X7R)
R407
4
GSM_OUT
0
ENABLE
P_GND
BS
18
TXON_PA
1
R408
NA
R409
NA
BS
C413
27p
C414
27p
16
14
13
12
10
9
8
7
5
R410
0
C415
NA
DCS_PCS_OUT
C408
0.01u
C409
NA
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
C411
NA
C407
27p
VCC1A
C406
18p
6
C405
33p
VCC1B
C402
10u
(2012)
VBATT
C404
0.01u
20
C403
12p
17
L402
NA
C416
NA
Figure 3-9-3. PAM(Power Amplifier Module) interface
The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant
envelope GMSK modulation. This configuration allows a very low power design with a reduced
external component count.
The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface
signal into the digital modulator.
The following Gaussian filter shapes the digital data stream for the GMSK modulation. Additionally a
pre-distortion filter compensates the attenuation of the PLL transfer function resulting in a very low
distortion at the transmit output.
The filtered digital data stream is scaled appropriately and added to the channel word. This sum is fed
into the MASH modulator. The output of the MASH modulator is a sequence of integer divider values
representing the high resolution fractional input signal. This sequence controls the MMD (multi
modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of the
VCO is achieved.
- 32 -
3. TECHNICAL BRIEF
3.10 Audio Interface
K14
LOUD2
L15
LOUD1
VMIC
MICP2
MICN2
MICP1
MICN1
EPPA1
EPP1
EPN1
VMIC
SPK_N
SPK_P
P12
P11
R12
P15
R13
M14
M12
N15
AUXIP
AUXIN
VINNORP
VINNORN
EPPA1
REC_P
REC_N
C124
1000p
Figure 3-10-1 Audio interface
The audio front-end of E-GOLDvoice offers the digital and analog circuit blocks for both receive and
transmit audio operation and ringing. It features a high-quality, digital-to-analog path with amplifying
stages for connecting acoustic transducers to the E-GOLDvoice. In the transmit direction the supply
voltage generation for microphones, low-noise amplifier and analog to digital conversion are integrated
on the E-GOLDvoice.
For E-GOLDvoice the EPp1/EPn1 driver are used as differntial Earpiece-Driver, EPPa1 is used as
single-ended Headset-Driver.
The audio front-end itself can be considered to be organized in three sub-blocks:
• Interface to processor cores (TEAKlite and - indirectly - C166S)
• Digital filters
• Analog part.
- 33 -
3. TECHNICAL BRIEF
The interface to the processor cores consists of a direct physical connection to the TEAKlite DSP bus
and a set of firmware commands to handle communication between the C166S and the audio frontend which serves as the interface peripheral for audio algorithms running on the DSP or the controller.
The audio front-end Generates interrupts on certain occasions, for example, when exchange of data is
requested. The core interface part of the audio front-end also contains the control and status registers
which are used to set up certain operation modes of the peripheral.
The section next to the core interface contains the digital filters for interpolation and decimation of the
audio signals being received and transmitted. The data path for the receive direction can be set up to
process sampling rates between 8kHz and 48kHz.
The interpolation filters for the respective sampling rates are implemented in a dedi-cated hardware
block and are automatically selected to suite the chosen sampling rate.
Low-pass interpolation filtering, which produces an unsigned 16-bit data stream with a sampling rate of
4 MHz, is performed digitally. D-to-A conversion, postfiltering, and final amplification are performed on
the analog part. The amplifier buffer for voiceband receive does also support ringer functionality. The
ringer functionality is activated by Setting bits RINGSELPN or RINGSELPA in the voiceband part of
the analog control register.
In transmit direction, amplification, prefiltering and A-to-D conversion (analog ∑∆ modulation) are
performed on the analog part. The resulting 2-Mbit/s data stream is filtered by a digital low-pass
decimation filter for further processing by DSP firmware.
Two sampling rates, 8kHz and 16kHz, are supported.
The analog section contains all the necessary analog functional blocks including microphone supply
generation, output and input amplifiers and analog filtering.
Signals
Description
EPp1
Main Receiver Positive signal(Differential signal)
EPn1
Main Receiver Negative signal(Differential signal)
EPpa1
Headset signal(Single Ended signal)
Loud1
Speaker Output Positive signal(Differential signal)
Loud2
Speaker Output Negative signal(Differential signal)
MICP1
Main Microphone Positive signal(Differential signal)
MICN1
Main Microphone Negative signal(Differential signal)
MICP2
Headset Microphone Positive signal(Differential signal)
MICN2
Headset Microphone Negative signal(Differential signal)
VMIC
Main/Headset Microphone supply power
- 34 -
3. TECHNICAL BRIEF
RECEIVER
L100
22nH
L101
22nH
CN100
1
REC_P
2
C100
39p
11*07*3T receiver
REC_N
(SURY0013001)
C102
39p
C103
39p
Figure 3-10-2 Main Receiver interface
SPEAKER
SPEAKER AMPLIFIER
R102
C116
R103
NA
VBAT
82K
NA
C118
0.1u
R105
U100
A3
20K
SPK_P
A1
C3
20K
100K
R110
0.22u
LOUD_SPK_EN
82K
R106
C1
INM
OUTA
_SD
VM
BYPASS
VP
L103
27nH CN101
1
L104
27nH
2
A2
B2
16pi 3.4T speaker
(SUSY0025801)
B3
C120
1 uF
D100
C122 C123
0.1u 0.1u
(2012)
C121
RADIO_SPK_L
0.1u
R108
20K
C119
NCP2890AFCT2G
C2
OUTB
INP
(10V,K)
Gain : Rf/Rin
Figure 3-10-3 Main Speaker interface
- 35 -
diode
R104
diode
0.1u
VM_P
C117
B1
SPK_N
D101
3. TECHNICAL BRIEF
VMIC
MAIN_MIC
R300
1K
R301
R304
C306
VINNORP
C304
10u
C303
39p
2.2K
0.1u
OB4-15L42-C33L
100ohm
C308
C307
0.1u
2
1
39p
R307
C309
0.1u
MIC300
VINNORN
R309
C313
2.2K
C314
39p
39p
100ohm
Figure 3-10-4 Main Microphone interface
1.5K
R316
VMIC
C317
R318
AUXIN
C318
NA
C320
0.1u
C321
2V8_VIO
39p
AUXIP
EAR_MIC
I/O CONNECTOR
2.2K
C319
10u
0.1u
R321
100K
VCHARGE
FOR RADIO
FB300
1800
FB301
FB302
10u
10u
1800
1800
HS_DET
2V8_VIO
39p
39p
RPWRON
R324
100K
C326
C323
C324
C325
NA
R323 100K
R322
CN301
2V8_VIO
2V8_VIO
AUXOP_FML
AUXOP_FMR
TXD
RXD
FM_ANT
VBAT
DSR
C328
56p
C327
10u
(2012)
(10V,Z,Y5V)
(50V,J,NP0)
L300
270nH
1608
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
FOR RADIO
2 : AUDIO
4 : EAR_L
5 : EAR_R
6 : TXD
7 : RXD
8 : JACK_D
9,10 : BATT
11 : R/ON
12,13 : CHG
20
22
HSEJ-18S04-25R
VBAT
BATT_TEMP
R332
C336
3p
0
3
2
1
CN302
C337
18p
(50V,J,NP0)
(50V,C,NP0)
(TOL:0.25P)
Figure 3-10-5 Headset interface
- 36 -
C322
10p
3. TECHNICAL BRIEF
3.11 Key LED Interface
KEY_BACKLIGHT
R222
1K
1u
C223
R221
100ohm
LD205
LEBB-S14H
R220
100ohm
LD204
LEBB-S14H
R219
100ohm
LD203
LEBB-S14H
R218
100ohm
LD202
LEBB-S14H
R217
100ohm
LD201
LEBB-S14H
R216
100ohm
1u
C222
(10V,K,X5R)
VBAT
LD200
LEBB-S14H
KEY BACKLIGHT
(10V,K,X5R)
2SC5585
Q200
R223
10K
Figure 3-11 Key LED interface
This handset has 6 LEDs that illuminates blue color.
Control signal is controlled by EGold-voice with PWM and handset has 3 methods, ON, OFF and
Dimming.
- 37 -
3. TECHNICAL BRIEF
3.12 Vibrator Interface
VIBRATOR
1SS302-T5L_F_H
C302
27p
(50V,J,NP0)
CN300
1
D300
VBAT
VBAT
2
C305
R305
27p
10
R306
(1608)
Q300
2SC5585
VIBRATOR
100K
R308
1K
Figure 3-12 Vibrator interface
This handset has vibrator operation. Control signal is controlled by EGold-voice with PWM.
- 38 -
3. TECHNICAL BRIEF
3.13 Memory Interface
VBAT
(NOT MOUNTED)
2V8_VMEM_S
U300
BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT
C300
NA
MEMORY
C301
NA
U301
G2
E3
H3
F4
F5
H6
E6
G7
H2
F3
G3
H4
G6
F6
H7
F7
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
G4
R310
0
G5
2V8_VMEM_S
VCCF
VCCS
2V8_VMEM
2V8_VMEM
R311
NA
R315
NA
2V8_VIO
C316
0.1u
_OE
_WE
_LB
_UB
_CE1F
_CE1S
CE2S
RY__BY
WP_ACC
_RSTF
G8
VSS1
E2
VSS2
C8
D8
E7
F8
H5
RFU0
RFU1
RFU2
RFU3
RFU4
_OE
_WR
ADD00
BHE_N
CS0n
CS1n
0
TP300
F2
A5
A3
B3
F1
G1
B5
C4
A4
B4
R314
C315
0.1u
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
R313 100K
2V8_VMEM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
S71GL032A40BAW0F
E1
A0
D1
A1
C1
A2
B1
A3
D2
A4
C2
A5
B2
A6
A2
A7
A6
A8
C6
A9
D6
A10
A7
A11
B7
A12
C7
A13
D7
A14
B8
A15
E8
A16
D3
A17
C3
A18
B6
A19
C5
A20
R312 100K
1
2
3
_RY_BY
Figure 3-13 Memory interface
In E-GOLDvoice, the 16bits demultiplex X-bus interface is used for memory device support. NOR
Flash memory is supported. (The NAND Flash memory is not supported). The page mode can be
supported for flash memories.
Up to 8MBytes of external RAM and/or ROM can be connected to the MCU via its external bus
interface.
Up to 3 external CS signals can be generated to save external glue logic.
Access to very slow memories is supported via a special ‘Ready’ function.
The system MCU clock is set to run with 26Mhz.
- 39 -
3. TECHNICAL BRIEF
1V5_VRF0
2V85_VSIM
2V8_VIO
VRF1
1u
1u
C109
1u
1u
C108
C110
1u
C106
C112
22K
220n
R101
C114
VBAT
VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13
J13
K15
F15
B11
K10
M11
J10
G12
K12
G13
G15
G14
J12
J14
IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP
VSS9
VSS8
VSS6
VSS5
VSS4
VSS2
VSS1
VDD_SIM
VDD_RTC
VDDP_IO
VDDP_MEM
VDD_PLL
VDD_MAIN2
VDD_MAIN1
6.8K
C111
1u
BAT100
C113
1u
VDD_LBUF
VDD_LANA
VDD_LRF2V5
VDD_LRF1V5
VDD_LMEM
VDD_LSIM
VDD_LIO
VDD_LD1
VDD_LRTC
2V0_VRTC
2V8_VIO
2V8_VMEM
L102
18nH
M8
F10
K7
K8
J8
B9
B8
R7
R6
F6
L4
G10
J7
G9
2V85_VSIM
R100
C107
2V0_VRTC
1u
2V5_VANA
VD1
(1608)
C101
2.2u
VD1
3V2_VBUF
2V8_VMEM
3.14 Power Block Interface
C115
(1608)
2.2u
REXT
D12
(16V,K,X5R)
A9
XOX
A8
XO
Figure 3-14-1 Power Block interface
The E-GOLDvoice integrated power management unit (PMU) supports direct connection to battery
(DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage
regulators. The input of these linear voltage regulators is the battery voltage. The external memory and
SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal
generated supply voltages.
The integrated power management also provides the control state machine for system start up,
including start up with discharged batteries, trickle charging and system reset control. After system
start up several methods are implemented for active and idle power saving.
- 40 -
3. TECHNICAL BRIEF
Name
Output Voltage(V) Output Current (mA)
Comment
LRTC
2.0
4
Used for the real time and digital PMU supply
LD1
1.2/1.5
150
Used for the core supplies (MCU and DSP via switch)
LIO
1.8/2.85
30
Used for the I/O pad supply and, for example, the display
LRFXO
2.5
10
Used for the crystal oscillator supply
LMEM
2.5
100
Used for the external memory supply, voltage can be
configured during startup
LANA
2.5
100
Used for analog (audio and baseband processing) and
headset driver
LSIM
1.8/2.85
30
Used of the SIM card supply
LBUF
2.6/2.8/3.0/3.2
300
Used for the loudspeaker and earpiece driver
LRFRX
2.5
100
Used for the RF RX part
LRFTRX
1.5
120
Used for the RF TX/TX part
Figure 3-14-2 EGold Voice PMU
LDO output voltage selection
• LD1, LIO, LSIM, LBUF output voltage programmable by software.
• LMEM output voltage is selectable by pin configuration upon startup.
Active and idle power saving options:
• The flexible clock switching options allow minimizing the power consumption during the operation
phases of the E-GOLDvoice.
• Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and
switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is
switched off and the controller RAM is switched to a power saving mode.
Start-up and Reset Control State Machine Features
• Power up upon battery insertion, push button, alarm, charger connection.
• Detection of battery exchange or re-insertion.
• Complete start-up sequence management.
• System turn-on, system turn-off operation management including emergency (under-voltage) and
programmed shutdown functions.
• Internal reset of the baseband, including silent reset.
• Tri-state function of the baseband module.
• Standby mode controlled by VCXO_EN provided by SCCU module.
- 41 -
27K
2.7K
NO RADIO
RADIO_DETECT
RADIO
R339
27K
RADIO_DETECT
RADIO_EN
0
NA
C334
R343
100K
1
2
3
(10V,K,X5R)
C341
1u
VBAT
1
2
3
4
5
U302
SI4702-B16
BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT
C342
1u
2V8_RADIO
R334
10K
NC1
FMIP
RFGND
GND1
_RST
2V8_RADIO
U304
FM_RST
FM_SCL
FM_SDA
FM_RST
C331 100p
NA
FM_INT
RADIO_AMP_SHDN
TP301
FM_INT
_SEN
SCLK
SDIO
RCLK
VIO
6
7
8
9
10
R325
4.7K
FM_ANT
R328
R336
RADIO_AMP_SHDN (FOR FM RADIO)
PGND
NC2
GPIO1
GPIO2
GPIO3
VA
21
20
19
18
17
16
4.7K
15
14
13
12
11
47
R338
FM_32K
0.1u
0.1u
EPPA1
FOR RADIO
AUXOP_FMR
RADIO_SPK_R
C335
22n
C332
C333
C329
1u 2V8_RADIO
2V8_RADIO
2V8_RADIO
GND3
LOUT
ROUT
GND2
VD
0.1u
2V8_VIO
R337
- 42 C339
RADIO
20K
20K
R342
NA
C340
0.1u
5
4
3
2
C338
0.1u
NC1
IN1
COM1
NO1
VCC
GND
NC2
IN2
COM2
NO2
6
7
8
9
10
U305
NLAS5223BMNR2G
R335
100K
1
2V8_VIO
RADIO_AMP_SHDN
R329
R330
C330
1u
2V8_RADIO
VIN2
VIN1
VDD
VOUT2
VOUT1
U303 LM4809LD
39K
R345
100K
NA
R340
R333
R327
R331
AUXOP_FML
RADIO_SPK_L
3
9
6
8
HEADSET_RADIO_SEL
FOR RADIO
39K
2
BYPASS GND
4
_SHDN BGND
5
1
7
R326
0
0
240K
R344
330K
R341
2V8_VIO
EPPA1
RADIO_SPK_R
RADIO_SPK_L
3. TECHNICAL BRIEF
3.15 FM Radio Interface
3. TECHNICAL BRIEF
3.15.1 FM Tunner
The Si4702 patented digital low-IF architecture reduces external components and eliminates the need
for factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the
worldwide FM broadcast band (76 to 108 MHz). An automatic gain control (AGC) circuit controls the
gain of the LNA to optimize sensitivity and rejection of strong interferers.
For two-wire operation, a transfer begins with the START condition. The control word is latched
internally on rising SCLK edges and is eight bits in length, comprised of a seven bit device address
equal to 0010000b and a read/write bit (write = 0 and read = 1). The device acknowledges the address
by setting SDIO low on the next falling SCLK edge. For write operations, the device acknowledge Is
followed by an eight bit data word latched internally on rising edges of SCLK.
The device always acknowledges the data by setting SDIO low on the next falling SCLK edge. An
internal address counter automatically increments to allow continuous data byte writes, starting with
the upper byte of register 02h, followed by the lower byte of register 02h, and onward until the lower
byte of the last register is reached. The internal address counter then automatically wraps around to
the upper byte of register 00h and proceeds from there until continuous writes cease. Data transfer
ceases with the STOP command. After every STOP Command, The internal address counter is reset.
For read operations, the device acknowledge is followed by an eight bit data word shifted out on falling
SCLK edges. An internal address counter automatically increments to allow continuous data byte
reads, starting with the upper byte of register 0Ah, followed by the lower byte of register 0Ah, and
onward until the lower byte of the last register is reached. The internal address counter then
automatically wraps around to the upper byte of register 00h and proceeds from there until continuous
reads cease. After each byte of data is read, the controller IC should return an acknowledge if an
additional byte of data will be requested. Data transfer ceases with the STOP command. After every
STOP command, the internal address counter is reset.
3.15.2 Headphone Amplifier
The MAX4411 fixed-gain, stereo headphone driver features Maxim’s patented DirectDrive architecture,
eliminating the large output-coupling capacitors required By conventional single-supply headphone
drivers. The device consists of two 80mW Class AB headphone drivers, internal feedback network
(fixed -1.5V/V gain), undervoltage lockout (UVLO)/shutdown control, charge pump, and
comprehensive click-and-pop suppression circuitry.
- 43 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Trouble
SW400
FL400
FL401
U400
U102
X101
REFERENCE
PART Description
U400
PAM (Power Amp. Module)
X101
DCXO (26MHz)
FL400
ASM (Antenna Switch Module)
SW400
Mobile Switch
FL401
RX SAW Filter
- 44 -
4. TROUBLE SHOOTING
RF Trouble
TEST POINT
Antenna Matching component
Antenna.Contact Point
SW400
TP400
TP401
TP402
TP403
TP404
TP405
CIRCUIT DIAGRAM
R400
NA
R401
L400
Antenna Matching component
0
R403
L401
Coupling Capacitor
- 45 -
G2
RF
G1
ANT
SW400
RF500
Mobile SW
1p
2.2nH
C400
0
C410
22p
22nH
4. TROUBLE SHOOTING
CHECKING FLOW
START
NG
Check
Antenna PAD&
Intenna Contact
Change Antenna
NG
Check
Matching component
Resolder component
OK
NG
Check
Mobile SW
Change SW400
OK
Download
And
Calibration
NG
Change PCB
- 46 -
4. TROUBLE SHOOTING
RX Trouble
TEST POINT
CHECKING FLOW
START
Setup Test Equipment
Cell Power :-74d Bm
GSM850 CH190
PCS CH660
SW400
FL400
Check point.
DCXO(X101)
FL401
U400
Check point
mobile SW &
ASM & SAW
Filter(SW400,F
L400,FL401)
U102
X101
Re-Download S/W &
CAL
- 47 -
4. TROUBLE SHOOTING
RX Trouble
(1) Checking VCTCXO Circuit
TEST POINT
CHECKING FLOW
Is the waveform
of Pin3 similar to
DCXO(X101)
Waveform?
SW400
Yes
FL400
DCXO Circuit is OK.
See next page to check
PLL Circuit.
FL401
U400
U102
X101
CIRCUIT
Waveform
4
HOT1 1
GND2
Pin 2
X101
NX3225SA
3 HOT2
2 GND1
26MHz
Waveform
( NX3225SA(W-188-34-7)
Pin 1
2V8_VIO
R107
NA
- 48 -
No
Replace
X101
4. TROUBLE SHOOTING
RX Trouble
TEST POINT
CHECKING FLOW
Check Pin 1, 2 of
SW400
with RF Cable
SW400
Signal is
OK ?
Replace
Mobile SW
(SW400)
Yes
FL400
Pin 6
Pin 4
N
o
Check Pin 4,6 of
FL400 ?
FL401
N
o
Replace ASM
(FL400)
U400
Yes
Check Pin 6,7 and 8,9 of
FL401 ?
U102
N
o
Replace SAW
Filter (FL401)
Yes
Mobile SW & ASM is OK.
See next page
* FL401 6,7 and 8,9 output are
balanced
- 49 -
4. TROUBLE SHOOTING
4.2 TX Trouble
TEST POINT
CHECKING FLOW
Setup Test Equipment
Cell Power : - 74dBm
GSM850 CH190
PCS CH661
Check point
DCXO(X101)
SW400
FL400
Check point
ULC2(U102)Outp
ut Signal
FL401
U400
Check point
PAM(U400)
Control Signal
Check
ASM & Mobile
S/W & SAW
(FL400,SW400
,FL401)
U102
X101
Re-Download S/W & RF
CAL
- 50 -
4. TROUBLE SHOOTING
TX Trouble
CIRCUIT
(50V,J,NP0)
(10V,Z,Y5V)
(50V,J,NP0)
(50V,J,NP0)
VBAT
(16V,K,X7R)
U400
C401
39p
R402
1K
TX_RAMP
TEST POINT
VBAT
R404
R405
DCS_PCS_OUT
0
0
VAPC
LB RF Input
15
R406
11
0
C411
NA
19
C412
NA
EGSM_OUT
2
DCS_PCS_IN
U400
SKY77318
EGSM_IN
R407
4
GSM_OUT
0
ENABLE
RSVD_GND
(50V,J,NP0) (16V,K,X7R)
P_GND
BS
18
TXON_PA
1
R408
NA
R409
NA
BS
C413
27p
C414
27p
16
14
13
12
10
9
8
7
5
R410
0
HB RF Input
DCS_PCS_OUT
C408
0.01u
C409
NA
3
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
21
C407
27p
6
C406
18p
VCC1A
C405
33p
(2012)
VCC1B
C402
10u
20
C404
0.01u
VBATT
C403
12p
17
L402
NA
C416
NA
C415
NA
U102
Waveform
CHECKING FLOW
Check Control
Signals
Signals are
Normal ?
Yes
Paon & BS
ASM
PAM Control
Signal is OK.
See next page to
check
ASM & Mobile SW
Circuit.
Vapc
- 51 -
N
o
Check
ULC2(U102)
4. TROUBLE SHOOTING
TX Trouble
TEST POINT
CIRCUIT
TP400
TP401
TP402
TP403
TP404
TP405
R400
NA
R401
C400
0
1p
L400
2.2nH
SW400
L401
SW400
RF500
FL401
G2
RF
G1
ANT
U400
0
R403
FL400
22nH
C410
22p
U102
X101
FL400
9
3
7
VC1
VC2
C417
27p
LMSP2PAA-575TEMP
1
GSM1800_1900TX
6
GSM1800_1900RX
VC_GSM850_900TX
VC_GSM1800_1900TX
IN
5
2
GND1 GSM850_900TX
8
4
GND2 GSM850_900RX
10
GND3
C418
27p
Mode
GSM900 TX
DCS1800 TX
GSM800 RX
DCS1800 RX
VC1
H(2.7V)
L
L
L
VC2
L
H(2.7V)
L
L
- 52 -
4. TROUBLE SHOOTING
RX Trouble
TEST POINT
CHECKING FLOW
Check Pin 1, 2 of
SW400
with RF Cable
Signal is
OK ?
SW400
No
Replace Mobile
SW (SW400)
No
Check ULC2
(U102)
No
Replace ASM
(FL400)
Yes
FL400
Pin 1
Pin 7
Pin 2
FL401
U400
Pin 3
Check Pin 1,2
Yes
Control
Signal is
OK ?
Yes
U102
Pin 3,7
Signal is
normal ?
Yes
Mobile SW & ASM is
OK.
Check Antenna.
- 53 -
4. TROUBLE SHOOTING
4.3 Power On Trouble
TEST POINT
Check Points
C107
-Battery Voltage( Need to over 3.35V)
C111
-Power-On Key detection (PWRON signal)
C101
-Outputs of LDOs from EGV
LDO
VOLTAGE
PART
V_BUF
3.2V
C101
V_MEM
2.8V
C109
V_IO
2.8V
C107
V_SIM
2.85V
C108
VRF0
1.5V
C110
V_ANA
2.5V
C113
C109
C110
EGV
IC
C106
26Mhz
1V5_VRF0
VRF1
1u
1u
C109
1u
1u
C108
C110
1u
C106
C112
- 54 -
VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13
22K
220n
R101
C114
G13
G15
G14
J12
J14
J13
K15
F15
B11
K10
M11
J10
G12
K12
VBAT
IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP
VSS2
VSS1
VDD_SIM
VDD_RTC
VDDP_IO
VDDP_MEM
VDD_PLL
VDD_MAIN2
VDD_MAIN1
6.8K
C111
1u
BAT100
C113
1u
VDD_LBUF
VDD_LANA
VDD_LRF2V5
VDD_LRF1V5
VDD_LMEM
VDD_LSIM
VDD_LIO
VDD_LD1
VDD_LRTC
2V0_VRTC
2V8_VIO
2V8_VMEM
L102
18nH
B9
B8
R7
R6
F6
L4
G10
J7
G9
2V85_VSIM
R100
C107
2V0_VRTC
1u
2V5_VANA
VD1
(1608)
C101
2.2u
VD1
3V2_VBUF
2V8_VMEM
2V8_VIO
2V85_VSIM
CIRCUIT
C115
(1608)
2.2u
REXT
D12
A9
XOX
A8
XO
(16V,K,X5R)
4. TROUBLE SHOOTING
Power On Trouble
CHECKING FLOW
START
Check Battery Voltage
> 3.35V
NO
Charge or Change Battery
YES
Push power-on key
And check the level change
of PWRKEY
NO
Check the contact of power key
Or dome-switch
YES
Check the voltage of
The LDO outputs at U102
NO
Replace U102
YES
THE PHONE WILL
POWER ON.
- 55 -
LDO
VOLTAGE
PART
V_BUF
3.2V
C101
V_MEM
2.8V
C109
V_IO
2.8V
C107
V_SIM
2.85V
C108
VRF0
1.5V
C110
V_ANA
2.5V
C113
4. TROUBLE SHOOTING
4.4. SIM Card Trouble
TEST POINT
R302/C310
J300.PIN1
C331/C332
CIRCUIT DIAGRAM
2V85_VSIM
0
2V85_VSIM
SIM_DATA
R303
R302
4.7K
2V85_VSIM
J300
4
GND
VCC
5
VPP
RST
6
CLK
I_O
8
GND2 GND1
1
2
3
7
SIM_RST
SIM_CLK
C311
0.1u
C310
22p
- 56 -
C312
22p
4. TROUBLE SHOOTING
Checking Flow
START
NO
Change the SIM Card. Our phone
supports only 3V SIM card.
Does the SIM cards
supports 3V ?
YES
R302/C310/
C311/C312
Check soldering
status of J300 and
Other component
NG
Resolder J300 or
other component
OK
J300.PIN1 = 2.85V
NG
Check J300.PIN1
OK
Re-download SW
Check Operation
OK
Change board
- 57 -
Change board
4. TROUBLE SHOOTING
4.5. Vibrator Trouble
TEST POINT
Q300.PIN3
R306
R308
R305
CIRCUIT DIAGRAM
1SS302-T5L_F_H
C302
27p
(50V,J,NP0)
CN300
1
D300
VBAT
VBAT
2
C305
R305
27p
10
R306
Q300
2SC5585
VIBRATOR
100K
R308
1K
- 58 -
(1608)
4. TROUBLE SHOOTING
Checking Flow
START
Enter the engineering mode,
and set vibrator on.
R306=2.8V
R308=0.7V
Check Voltage Level of
R306/R308
NG
Change PCB
OK
Q300.PIN3=0V
R305=0V
Check Voltage Level of
Q300.PIN3 and R305
OK
Replace Vibrator
- 59 -
NG
Change Q300
4. TROUBLE SHOOTING
4.6. Keypad Trouble
TEST POINT
R215
R201
R214
R211
R212
R203
R209
R204
R213
CIRCUIT DIAGRAM
2V0_VRTC
KEY MATRIX
END
SW200
END_KEY
1
SW201
2
SW202
3
SW203
SW204
LEFT
SW205
MENU
R201
KEY_OUT1
680
C205
NA
SW206
4
SW207
7
SW212
5
SW208
8
SW213
6
SW209
9
SW214
UP
SW210
SEL
R203
KEY_OUT2
680
C206
NA
SW211
RIGHT
SW215
SEND
R204
KEY_OUT3
680
C207
NA
SW216
*
SW2170
SW218
#
SW219
DOWN
R209
KEY_OUT4
680
C215
NA
C216
NA
C217
NA
R211 680
KEY_IN0
R212 680
KEY_IN1
R213 680
KEY_IN2
R214 680
KEY_IN3
R215 680
KEY_IN4
- 60 -
C218
NA
C219
NA
C220
NA
4. TROUBLE SHOOTING
Checking Flow
START
NG
Check Metal Doom
Change Metal Doom
OK
R201/R203/R204
R209/R211/R212
R213/R214/R215
Check soldering status
Of component
OK
Change PCB
- 61 -
NG
Resolder component
4. TROUBLE SHOOTING
4.7 RTC Trouble
CIRCUIT
Check Points
- 32.768KHz is right clock
- The power of RTC is right.
N7
SWITCH_ON
P6
OSC32K
R5
F32K
B4
CLKOUT
PWRON
32KOUT
32KIN
CHG_STATUS
X100
2
1u
1
BAT100
22K
R101
18p
C105
C114
G13
G15
G14
J12
J14
IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP
VDD_LD1
G12
VDD_LRTC
K12
18p
C104
32.768KHz
220n
MC-146_12_5PF
- 62 -
6.8K
VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13
32KOUT
3
C112
32KIN
R100
4
4. TROUBLE SHOOTING
CHECKING FLOW
START
Is the frequency
about 32Khz?
Replace X100 and try again.
YES
Is VRTC
about 2.0V?
Replace BAT100
YES
RTC will work properly
- 63 -
4. TROUBLE SHOOTING
4.8. Key backlight Trouble
TEST POINT
D203
D200
Q200.PIN3
R204
D20 4
D201
R203
Q200.PIN2
D205
D202
CIRCUIT DIAGRAM
KEY_BACKLIGHT
R222
1K
2SC5585
Q200
R223
10K
- 64 -
1u
C223
R221
100ohm
LD205
LEBB-S14H
R220
100ohm
LD204
LEBB-S14H
R219
100ohm
LD203
LEBB-S14H
R218
100ohm
LD202
LEBB-S14H
R217
100ohm
LD201
LEBB-S14H
R216
100ohm
1u
C222
(10V,K,X5R)
VBAT
LD200
LEBB-S14H
KEY BACKLIGHT
(10V,K,X5R)
4. TROUBLE SHOOTING
Checking Flow
START
R222=2.8V
Check Voltage Level
Of R222
NO
Change PCB
Replace component
YES
NG
R222=0.7V
Check Voltage Level
Of R222 and Q200.PIN2
NO
Check component
R222 and Q200
YES
LD200~LD205
R216~R221
Check LED
component
YES
Change PCB
- 65 -
NO
Replace component
4. TROUBLE SHOOTING
4.9. LCD Trouble
TEST POINT
CN200
R207R205
R206R208
C221
CIRCUIT DIAGRAM
2V8_VIO
CN200
1
2
MTPG
LCD_RESET
SSC0_CLK
R205
R207
5
47
7
MLED2
C208
NA
4
47
MLED
C209
27p
C210
27p
MTPD
3
6
R206
47
8
R208
47
CS3
SSC0_MTSR
9
10
MLED1
11
13
R210
100K
12
14
15
IMSA-9671S-13Y902
(ENQY0013801)
- 66 -
LCD_ID
C221
1u
C211
27p
C212
27p
C213
NA
C214
NA
4. TROUBLE SHOOTING
Checking Flow
START
NO
Backlight is OK?
Change PCB
YES
Check Operation
After LCD changes
OK
Change LCD
NG
C221=2.8V
Control Signal=
Refer to next page
Check Control
Signal and Power
Including soldering status
NG
Replace component
Or change PCB
OK
Check soldering
status of CN200
OK
Change PCB
- 67 -
NG
Replace CN200
4. TROUBLE SHOOTING
WAVEFORM
SS0_SCK
LCD_CS
]SS0_MTSR pattern is out randomly when clock is fluctiatied.
, clock frequency is 13MHz and LCD_RESET is High(2.8V).
- 68 -
4. TROUBLE SHOOTING
4.10. Microphone Trouble
TEST POINT
Microphone component
R300
MIC.P
CIRCUIT DIAGRAM
VMIC
MAIN_MIC
R300
1K
R301
C303
39p
2.2K
R304
VINNORP
C306
C304
10u
0.1u
OB4-15L42-C33L
100ohm
C308
C307
0.1u
39p
R307
C309
0.1u
MIC300
VINNORN
39p
C314
2.2K
39p
R309
C313
100ohm
- 69 -
2
1
4. TROUBLE SHOOTING
Checking Flow
Make a call
R300.VMIC=2.5V
NO
Check voltage level
of R300
Replace PCB
YES
NG
Check component
status around MIC
Re-solder or
replace the Component
OK
Check status of MIC
NG
Re-solder or
replace Microphone
OK
Check the voltage Level
of MIC_P
MIC_P= about 1.2~1.5V DC
with a few tens mV
OK
Replace PCB
- 70 -
NG
Change Microphone
4. TROUBLE SHOOTING
4.11. Receiver Trouble
TEST POINT
L101
C103
L100
C102
REC.N
REC.P
CIRCUIT DIAGRAM
RECEIVER
L100
22nH
L101
22nH
REC_P
C100
39p
CN100
1
2
11*07*3T receiver
REC_N
(SURY0013001)
C102
39p
- 71 -
C103
39p
4. TROUBLE SHOOTING
Checking Flow
Press any Key
Check L100/L101
C102/103
Check component
status
NG
Re-solder or
replace the Component
YES
L100&L101 bias will
Fluctiate signal above
1.2V
Check L100 &
L101
NG
Re-solder or
replace the Component
OK
Check Receiver
OK
Replace PCB
- 72 -
NG
replace Receiver
4. TROUBLE SHOOTING
4.12 Speaker Trouble
TEST POINT
Check Points
- Speaker spring contact
- Audio amp soldering
L103
L104
CN101íS 1PIN
CN101íS 2PIN
C120
CN200
AMP IC
C117
R111
C118
CIRCUIT
SPEAKER
SPEAKER AMPLIFIER
R102
C116
R103
NA
VBAT
82K
NA
C118
0.1u
R105
U100
A3
20K
SPK_P
A1
C3
R106
20K
100K
R110
0.22u
LOUD_SPK_EN
82K
0.1u
C1
INM
OUTA
_SD
VM
BYPASS
VP
L103
27nH CN101
1
L104
27nH
2
A2
B2
16pi 3.4T speaker
(SUSY0025801)
B3
C120
1 uF
(2012)
C121
C119
R108
20K
RADIO_SPK_L
NCP2890AFCT2G
C2
OUTB
INP
(10V,K)
Gain : Rf/Rin
- 73 -
D100
C122 C123
0.1u 0.1u
diode
R104
diode
0.1u
VM_P
C117
B1
SPK_N
D101
4. TROUBLE SHOOTING
Checking Flow
Start
Check the voltage level
of U100 = Vbat?
No
Check
The battery
Yes
Check the Signal,
C117,C118
No
Check
U102
Yes
Check the Level of
U100.C3 = Low ?
No
Check
U102
Yes
Check the Signal,
L102,L103
No
Re-solder
L102,L103
No
Re-Assemble
or Re-place
Speaker
Yes
Check the Contact
Of CN101
Yes
Try again
or Change the Board
- 74 -
4. TROUBLE SHOOTING
4.13 Headphone Trouble
TEST POINT
Check Points
-18pin IO connector
-Passive Parts slodering Status
C321
CN301
C322
FB300
FB302 FB301
CIRCUIT DIAGRAM
1.5K
R316
VMIC
C317
R318
AUXIN
C318
NA
C320
0.1u
C321
2V8_VIO
39p
AUXIP
EAR_MIC
I/O CONNECTOR
2.2K
C319
10u
0.1u
R321
100K
VCHARGE
FOR RADIO
FB300
1800
FB301
FB302
10u
10u
1800
1800
HS_DET
2V8_VIO
39p
39p
RPWRON
R324
100K
C326
C323
C324
C325
NA
R323 100K
R322
CN301
2V8_VIO
2V8_VIO
AUXOP_FML
AUXOP_FMR
TXD
RXD
FM_ANT
VBAT
DSR
C328
56p
C327
10u
(2012)
(10V,Z,Y5V)
(50V,J,NP0)
L300
270nH
1608
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
FOR RADIO
2 : AUDIO
4 : EAR_L
5 : EAR_R
6 : TXD
7 : RXD
8 : JACK_D
9,10 : BATT
11 : R/ON
12,13 : CHG
20
22
HSEJ-18S04-25R
VBAT
BATT_TEMP
R332
C336
3p
0
3
2
1
CN302
C337
18p
(50V,J,NP0)
(50V,C,NP0)
(TOL:0.25P)
- 75 -
C322
10p
4. TROUBLE SHOOTING
CHECKING FLOW
START
Does the audio
profile of the phone
change to the
earphone mode?
No
No
Re-solder CN301 or Change
another Ear- Mic set and Try again
Check the voltage Level
CN301.8 = Low?
Yes
Replace U100 or Change Board
Yes
Mic
Earphone
Go to MIC
Trouble section
Acoustic
Check the signal Level
at AUX_MIC.
Is it about 1.2~1.5V DC
with a few tens mV AC?
No
Re-solder causal
component
(CN301)
Does waveform at
U102.EPPA1
fluctuate?
Yes
No
Replace U100 or
Change the board
Yes
Change another Ear-Mic set and Try again
Does waveform at
CN301.4 and CN301.5
fluctuate?
No
Re-solder causal
component
(CN302,C322 etc.)
Change another Ear-Mic set and Try again
- 76 -
4. TROUBLE SHOOTING
4.14 Charging Trouble
TEST POINT
R124
Check Points
-Connection of TA (check TA voltage 5.2V)
-Charging Current Path component voltage
drop
-Battery voltage
-Charging IC
Charger
IC
U101
VBAT
VCHARGE
=5.2V
C126
C125
CN301
CIRCUIT
CHARGING IC
2V8_VIO
VBAT VCHARGE
VCHARGE
R118
NA
R119
1.8K
U101
1
CHARGE_DETECT
2
R121
CHG_STATUS
NA
C126
(10V,K,X5R)
1u
C127
0.015u
VIN
VBAT
_FAULT
VSEN_TEMP
10
C125
1u
9
R120
NA
(10V,K,X5R)
3
4
_STATUS
IREF
TIME
V2P8
5
GND
11
PGND
EN
8
R122
CHG_EN_TEST
R123
6
NA
CHG_EN
C128
R124
R125
1u
160K
100K
ISL9201IRZ-T
(1%)
- 77 -
0
7
4. TROUBLE SHOOTING
Checking Flow
START
I/O Connector(CN301)
Is well-soldered ?
NO
Resolder the CN300
Pin 12,13 : VCHARGE
YES
Is The Voltage of C126
5.2V ?
NO
The TA is out of order
Change the TA
YES
LOW
The Voltage of C128
Is 2.8V
Replace the
U101
YES
Check the voltage of R124
High or Low?
NO
Check the U102
YES
Battery is charged?
NO
YES
Charging is
properly operating
- 78 -
The battery may have
problems.
Change the battery.
4. TROUBLE SHOOTING
4.15. FM Radio Trouble
TEST POINT
R332
R338/R337/R336
U304.P 1
U304.P4
R327 R331
U302
U303
R329/R330
C332/C333
- 79 -
27K
2.7K
RADIO
RADIO_DETECT
NO RADIO
R339
27K
RADIO_DETECT
0
RADIO_EN
R328
NA
C334
R343
100K
1
2
3
(10V,K,X5R)
C341
1u
VBAT
1
2
3
4
5
U302
SI4702-B16
BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT
C342
1u
2V8_RADIO
R334
10K
NC1
FMIP
RFGND
GND1
_RST
2V8_RADIO
U304
FM_RST
FM_SCL
FM_SDA
FM_RST
C331 100p
NA
FM_INT
RADIO_AMP_SHDN
TP301
FM_INT
_SEN
SCLK
SDIO
RCLK
VIO
6
7
8
9
10
R325
4.7K
FM_ANT
R336
RADIO_AMP_SHDN (FOR FM RADIO)
PGND
NC2
GPIO1
GPIO2
GPIO3
VA
21
20
19
18
17
16
4.7K
15
14
13
12
11
47
R338
FM_32K
0.1u
0.1u
EPPA1
FOR RADIO
AUXOP_FMR
RADIO_SPK_R
C335
22n
C332
C333
C329
1u 2V8_RADIO
2V8_RADIO
2V8_RADIO
GND3
LOUT
ROUT
GND2
VD
0.1u
2V8_VIO
R337
- 80 C339
RADIO
20K
20K
R342
NA
C340
0.1u
5
4
3
2
C338
0.1u
NC1
IN1
COM1
NO1
VCC
GND
NC2
IN2
COM2
NO2
6
7
8
9
10
U305
NLAS5223BMNR2G
R335
100K
1
2V8_VIO
RADIO_AMP_SHDN
R329
R330
C330
1u
2V8_RADIO
VIN2
VIN1
VDD
VOUT2
VOUT1
U303 LM4809LD
39K
R345
100K
NA
R340
R333
R331
R327
AUXOP_FML
RADIO_SPK_L
3
9
6
8
HEADSET_RADIO_SEL
FOR RADIO
39K
2
BYPASS GND
4
_SHDN BGND
5
1
7
R326
0
0
240K
R344
330K
R341
2V8_VIO
EPPA1
RADIO_SPK_R
RADIO_SPK_L
4. TROUBLE SHOOTING
CIRCUIT DIAGRAM
4. TROUBLE SHOOTING
Checking Flow
Connector Headset and
Turn on Radio and
tuned channel
U304.PIN1 = High
U304.PIN4=2.8V
Check LDO
Power
NO
Change U304
YES
R336/R337/338
Check I2C signal and 32K clock
Check
Control Signal
NG
Change PCB
OK
R329/R330
C332/C333
Check
Audio Output
Of Transceiver
NG
Change U302
OK
R327/R331
Check
Audio Output
Of Amplifier
OK
Change PCB
- 81 -
NG
Change U303
5. DOWNLOAD
5. DOWNLOAD
5.1 Download Setup
Configure system like figure 5-1.
Figure 9-1. Download Setup
- 82 -
5. DOWNLOAD
5.2 Download Process
5.2.1. Download step[1]
: Start or Stop download
: Selected configuration DLL file
: File name donwloading
File(F) → Exit(X) : End program
Setting(S) → Configuration : configuration download condition DLL, SW files and etc.
About(H) → MultiGSM : Provide version information
First, select Setting Menu.
- 83 -
5. DOWNLOAD
5.2.2. Download step[2]
: Select a appropriated DLL file
- You must select KG270_xxxxxx.DLL file.
: Select configuration file
You must select cmd.m0 file
: Select download speed
You must 460800. System supports maximum 460800bps.
: Select port
select start and end port be operated
- 84 -
5. DOWNLOAD
5.2.3. Download step[3]
: Select files downloaded
KG270 have 4 files, *.eep, *.fls, *.dffs and *.cust.
But You must not select *.eep file.
- 85 -
5. DOWNLOAD
5.2.4. Download step[4]
: Start download and stop download next step.
If configuration is finished, then push start button and then button is changed to STOP.
Turn on power of multi download and connector phones.
If download is started, then push start button else program will download repeatedly.
- 86 -
5. DOWNLOAD
5.2.5. Download step[5]
: This region appears donwload status.
If download is finished, PASS or FAIL.message is showed.
- 87 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
- 88 -
7. CIRCUIT DIAGRAM
1
2
3
5
4
7
6
8
9
10
12
11
13
14
15
16
A
A
RECEIVER
VBAT
UART PORT
GND
RX
TX
NC1
ON_SW ON_SW
D
VBAT VBAT
NC2
PWR
URXD NC3
NC4
UTXD
DSR
RTS
CTS
1
2
3
4
5
6
7
8
9
10
11
12
C2
D5
F4
E4
D4
G4
D2
H4
C1
F1
F2
ADD00
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
RXD
TXD
RPWRON
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
1u
1V5_VRF0
1u
1u
C109
C110
1u
C106
C112
4
A3
20K
SPK_P
0.1u
C118
A1
R105
C3
20K
R106
20K
LOUD_SPK_EN
68K
AUXIP
AUXIN
VINNORP
VINNORN
EPPA1
REC_P
REC_N
B2
B1
B3
A2
A4
A3
P5
M7
N7
P6
R5
B4
R116
1.8K
U101
1
VIN
2
R121
CHG_STATUS
NA
C126
_FAULT
4
1u
C127
0.015u
BHE_N
_WR
VBAT
VSEN_TEMP
10
C125
1u
9
R120
NA
(10V,K,X5R)
3
(10V,K,X5R)
_STATUS
IREF
TIME
V2P8
5
GND
11
PGND
EN
8
R122
0
R123
NA
CHG_EN_TEST
7
6
C
CHG_EN
C128
R124
R125
1u
160K
100K
ISL9201IRZ-T
CS3
CS1n
CS0n
(1%)
ADD21
ADD20
ADD19
ADD18
ADD17
ADD16
ADD15
ADD14
ADD13
ADD12
ADD11
D
VBAT_4
H14
VBAT_3
H15
VBAT_2
F12
VBAT_1
H13
E_FUSE
0.1u
47n
1u
E
C133
GND1
F
VBAT VCHARGE
R118
NA
R119
Date
11/16
Designer
VBAT2
E
VRF2
VBAT
VBAT1
D101
2V8_VIO
Section
VBAT
C122 C123
0.1u 0.1u
(10V,K)
VCHARGE
_OE
CS100
D100
0
CHARGE_DETECT
BHE_N
_WR
C120
CHARGING IC
BS
FM_32K (FOR FM RADIO)
VC2
VC1
TXON_PA
N5
M6
E3
E2
R3
M5
K3
P4
G1
E1
H1
D1
F3
L3
K4
J4
H3
J3
H2
G2
16pi 3.4T speaker
(SUSY0025801)
B3
C124
1000p
PWRON
32KOUT
32KIN
CHG_STATUS
B7
A5
A6
B6
A7
D
Gain : Rf/Rin
HEADSET_RADIO_SEL (FOR FM RADIO)
VIBRATOR
KEY_BACKLIGHT
W_LED_DRV
RADIO_EN
(FOR FM RADIO)
FM_RST
(FOR FM RADIO)
_RESET
27nH
B2
C121
R112
47K
VP
27nH CN101
1
L104
2
1 uF
VMIC
SPK_N
SPK_P
P12
P11
R12
P15
R13
M14
M12
N15
VM
BYPASS
L103
A2
(2012)
R110
R111
100K
100K
BATT_TEMP
TX_RAMP
_SD
R109
LCD_ID
P13
C1
82K
0.1u
R108
C119
OUTA
B1
(FOR FM RADIO)
RADIO_SPK_L
INM
0.22u
RADIO_DETECT
R107
NA
NCP2890AFCT2G
C2
OUTB
INP
diode
U100
R104
diode
0.1u
VM_P
HOT1 1
26MHz
GND2
3 HOT2
2 GND1
C117
VRF1
C129
E
OE_N
ADV_N
BHE_N
WR_N
RD_N
CS3_N
CS1_N
CS0_N
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
SPK_N
2V8_VIO
VD1
C130
CHARGE_DETECT
35
34
33
32
31
30
29
28
J13
K15
F15
B11
K10
M11
J10
G12
K12
T_OUT8
T_OUT4
T_OUT3
T_OUT2
T_OUT0
SC100
27
26
25
24
23
22
21
20
19
220n
22K
VSS9
VSS8
VSS6
VSS5
VSS4
VSS2
VSS1
VDD_SIM
VDD_RTC
VDDP_IO
VDDP_MEM
VDD_PLL
VDD_MAIN2
VDD_MAIN1
PMB7880
U102
1V5_VRF0
1
2
3
4
5
6
7
8
9
T2IN
VIB_CONTROL
BACK_LIGHT
W_LED_DRV
CC00IO
RSTOUT_N
RESET_N
SAFE_RES
SWITCH_ON
OSC32K
F32K
CLKOUT
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
H12
CDT
J9
CS
GND
RX
TX
UFLS
R4
P1
P2
N2
L1
M2
K1
J2
P3
R2
M1
N1
L2
K2
J1
M4
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
C
UA100
3G
2.5G
MON100
(FOR 2.8V VMEM SELECTION)
G4
TDO
TDI
TMS
TCK
TRST_N
TRIG_OUT
TRIG_IN
NMI_N (FOR CHARGING IC)
MON1
MON2
NA
X101
NX3225SA
( NX3225SA(W-188-34-7)
DEFAULT_BANDSEL
VBAT
82K
4700p
G3
P8
M10
P9
R9
K9
B5
C5
F7
N6
N9
R103
NA
C132
R117
NA
TDO
TDI
TMS
TCK
TRSTn
TRIG_OUT
TRIG_IN
CHG_EN
R115
100K
4700p
EXTRSTn
TRIG_IN
TRIG_OUT
2V0_VRTC
C131
TDO
VMIC
MICP2
MICN2
MICP1
MICN1
EPPA1
EPP1
EPN1
R8
CCIO
M9
CCVZ_N
P7
CCLK
R10
CCRST
N8
CCIN
SIM_DATA
FM_INT
SIM_CLK
SIM_RST
LOUD_SPK_EN
DCS_RXP
DCS_RXN
GSM_RXP
GSM_RXN
K14
LOUD2
L15
LOUD1
H9
SCL
H10
SDA
(FOR FM RADIO)
DCS_PCS_OUT
GSM_OUT
N10
M9
R14
M0
R11
M7
P10
M2
PAOUT1
VDD_TRX
VDD_LO
VDD_DIG
VDD_RX
VDD_VCO
VDD_LRF_XO
VSS_RF1
VSS_RF2
VSS_RF3
VSS_RF4
VSS_RF5
VSS_RF6
VSS_RF7
VSS_RF8
VSS_RF9
VSS_RF10
VSS_RF11
VSS_RF12
VSS_RF13
E_FUSE
NC1
NC2
NC3
NC4
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
R102
C116
C11
A11
D10
F13
F14
A10
A15
A12
B14
B13
B12
B10
C14
C10
D11
D14
E12
E13
E14
G3
R15
J15
A1
R1
G2
(30uA)
(VOLTAGE SENSING)
(30uA)
(90uA)
SPEAKER
SPEAKER AMPLIFIER
(16V,K,X5R)
D12
E15
RX34
D15
RX34X
C15
RX12
B15
RX12X
M7,9 : ~0.96V
J6
SSC0_CLK
K6
SSC0_MRST
G6
SSC0_MTSR (FOR LCD SPI INTERFACE)
H6
DISP_REST
FM_SCL
FM_SDA
C115
(1608)
2.2u
REXT
A9
XOX
A8
XO
M0,2 : ~1.92V
G7
RXD
H7
TXD
H8
RTS_N
G8
CTS_N
(FOR CHARGING IC)
G1
(FOR FM RADIO)
(FOR FM RADIO)
C
VBAT
A13
TX2
A14
TX1
VSS_EPLS
VSS_MS1
VSS_MS2
VSS_MS3
VSS_MS4
VSS_MS5
VSS_MS6
VSS_MS7
CN102
R114
NA
DSR
SSC0_CLK
CHG_EN_TEST
SSC0_MTSR
LCD_RESET
(NOT MOUNTED)
(FOR SW DEBUGGING / NOT MOUNTED)
TRSTn
TDI
TMS
TCK
F
RXD
TXD
HS_DET
DSR
KP0
KP1
KP2
KP3
KP4
KP5
KP6
KP7
KP8
KP9
L12
K13
M15
L13
L14
N14
P14
N11
2V8_VMEM
2V8_VIO
R113
NA
(R110 will be changed to NA
for mass production)
RXD
TXD
VDD_LBUF
VDD_LANA
VDD_LRF2V5
VDD_LRF1V5
VDD_LMEM
VDD_LSIM
VDD_LIO
VDD_LD1
VDD_LRTC
M8
F10
K7
K8
J8
B9
B8
R7
R6
F6
L4
G10
J7
G9
KEY_OUT1
KEY_OUT2
KEY_OUT3
KEY_OUT4
KEY_IN0
KEY_IN1
KEY_IN2
KEY_IN3
KEY_IN4
ON BOARD ARM9 JTAG & ETM INTERFACE
E
C8
D6
D7
C7
D9
C6
C9
D8
F9
F8
C111
1u
BAT100
C113
1u
L102
18nH
R101
NA
D
B
C103
39p
C114
R199
NA
G13
G15
G14
J12
J14
R198
NA
IREF
VREFP
AGND
W_LED_FBN
W_LED_FBP
R197
0
6.8K
1u
1u
VD1
R196
2V0_VRTC
2V8_VIO
2V8_VMEM
18p
C105
C
2
11*07*3T receiver
2V0_VRTC
R100
2V85_VSIM
18p
C104
32.768KHz
R199
CN100
1
(SURY0013001)
C108
(1608)
KG270
MG160a
MC-146_12_5PF
R198
22nH
22nH
C100
39p
C102
39p
C107
2
R197
VRF1
REC_N
KG278, MG160b, KG275
2V5_VANA
1
32KOUT
R196
L100
L101
REC_P
2.2u
3
2V8_VMEM
VD1
MODEL
X100
4
32KIN
C101
B
2V8_VIO
3V2_VBUF
32.768KHZ CRYSTAL
2V85_VSIM
3
GND2
2006
Sign & Name
SANG-YOEN.LEE
Sheet/
MODEL
GB3_RADIO
SPFY0144601
Sheets
1/4
10
11
12
13
14
15
16
17
18
Checked
DRAWING
F
NAME
Approved
Iss.
1
2
3
4
5
6
7
Notice No.
Date
Name
LG Electronics Inc.
DRAWING
NO.
BB
VER-1.1
9
8
LG(42)-A-5505-10:01
LG Electronics Inc.
- 89 -
7. CIRCUIT DIAGRAM
1
2
3
4
7
6
5
8
9
10
A
2V0_VRTC
A
KEY MATRIX
CHARGE PUMP
VBAT
END
SW200
U200
5
END_KEY
8
MLED
1
SW201
2
SW202
3
SW203
SW204
LEFT
11
W_LED_DRV
SW205
AAT3157ITP-T1
10
C1+
IN
C1C2+
1u
C2-
EN_SET
R202
100K
C202
27p
4
D1
D2
D3
NC
GND
6
1
2
3
12
C203
27p
680
SW206
SW207
4
SW208
5
SW209
6
ID
SII
HIGH
1.9V
SHARP
LOW
0V
GP
MLED1
MLED2
KEY_OUT1
C205
NA
MAKER
C201
CP
MENU
R201
C200
1u
9
7
Voltage
150Kohm pull up
0.9V
C204
27p
SW210
UP
B
SEL
2V8_VIO
R203
KEY_OUT2
680
C206
NA
CN200
SW211
SW212
7
SW213
8
SW214
9
RIGHT
1
SW215
2
SEND
KEY_OUT3
LCD_RESET
680
C207
NA
SSC0_CLK
SW216
SW218
SW2170
*
SW219
#
R205
R207
4
47
5
47
7
DOWN
MLED
C208
NA
KEY_OUT4
680
C215
NA
C217
NA
C216
NA
C218
NA
C219
NA
C209
27p
C220
NA
6
R206
47
8
R208
47
CS3
SSC0_MTSR
9
10
MLED1
11
MLED2
R209
MTPD
3
MTPG
R204
C210
27p
13
R210
100K
R211 680
12
14
15
LCD_ID
C211
27p
C212
27p
C213
NA
C214
NA
C221
1u
IMSA-9671S-13Y902
(ENQY0013801)
KEY_IN0
C
R212 680
KEY_IN1
R213 680
KEY_IN2
R214 680
KEY_IN3
R215 680
KEY_IN4
VBAT
KEY BACKLIGHT
D
R222
1K
1u
C223
R220
100ohm
R221
100ohm
LD205
LEBB-S14H
R219
100ohm
LD204
LEBB-S14H
LD203
LEBB-S14H
R217
100ohm
R218
100ohm
LD202
LEBB-S14H
LD201
LEBB-S14H
1u
C222
KEY_BACKLIGHT
LD200
LEBB-S14H
(10V,K,X5R)
R216
100ohm
D
(10V,K,X5R)
2SC5585
Q200
R223
10K
E
Section
Date
Designer
11/16
2006
Sign & Name
MODEL
GB3_RADIO
HYUN-OK.LEE
Sheet/
Sheets
2/4
Checked
DRAWING
NAME
AUDIO,LCD,KEY
Approved
Iss.
1
2
3
4
Notice No.
Date
Name
DRAWING
LG Electronics Inc.
NO.
REV-1.1
5
LGIC(42)-A-5505-10:01
LG Electronics Inc.
- 90 -
7. CIRCUIT DIAGRAM
1
2
3
4
5
6
7
8
9
10
11
12
14
13
15
16
A
A
VIBRATOR
SIM_CONNECTOR
U300
BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT
R310
0
G5
2V8_VMEM_S
VCCS
1SS302-T5L_F_H
D300
R304
(1608)
0.1u
VIBRATOR
C312
22p
1K
OB4-15L42-C33L
C308
C307
0.1u
Q300
2SC5585
2
1
39p
R307
C309
0.1u
MIC300
VINNORN
100ohm
R309
2.2K
2V8_VMEM
39p
C311
0.1u
B
100ohm
R306
C310
22p
C306
VINNORP
SIM_RST
SIM_CLK
39p
VCCF
J300
C304
10u
C303
39p
2.2K
C305
R305
27p
10
1
4
VCC
GND
5
2
VPP
RST
6
3
I_O
CLK
8
7
GND2 GND1
SIM_DATA
R301
2
C314
G4
C
2V8_VMEM
TP300
NA
R315
NA
_OE
_WE
_LB
_UB
_CE1F
_CE1S
CE2S
RY__BY
WP_ACC
_RSTF
G8
VSS1
E2
VSS2
C8
D8
E7
F8
H5
C316
0.1u
RFU0
RFU1
RFU2
RFU3
RFU4
_OE
_WR
ADD00
BHE_N
CS0n
CS1n
0
R311
2V8_VIO
F2
A5
A3
B3
F1
G1
B5
C4
A4
B4
R313 100K
C315
0.1u
2V85_VSIM
1K
C313
C
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
CN300
1
R314
2V8_VMEM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
C302
27p
(50V,J,NP0)
2V85_VSIM
4.7K
G2
E3
H3
F4
F5
H6
E6
G7
H2
F3
G3
H4
G6
F6
H7
F7
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
2V85_VSIM
S71GL032A40BAW0F
E1
A0
D1
A1
C1
A2
B1
A3
D2
A4
C2
A5
B2
A6
A2
A7
A6
A8
C6
A9
D6
A10
A7
A11
B7
A12
C7
A13
D7
A14
B8
A15
E8
A16
D3
A17
C3
A18
B6
A19
C5
A20
0
U301
100K
MEMORY
C301
NA
R302
C300
NA
B
VMIC
MAIN_MIC
VBAT
VBAT
R300
R312 100K
1
2
3
R308
(NOT MOUNTED)
2V8_VMEM_S
R303
VBAT
_RY_BY
VMIC
REMOTE POWER ON
D
1.5K
R316
C317
R317
R319
RPWRON
RPWRON
END_KEY
47
0
PWRON
R318
AUXIN
C318
NA
C320
0.1u
C321
E
2V8_VIO
39p
AUXIP
EAR_MIC
I/O CONNECTOR
2.2K
C319
10u
0.1u
R320
100K
NA
TP301
FM_INT
R325
1
2
3
4
5
C331 100p
NA
C334
FM_RST
NC1
FMIP
RFGND
GND1
_RST
U302
SI4702-B16
6
7
8
9
10
100K
R323 100K
39p
39p
2V8_VIO
DSR
C327
10u
(2012)
C329
1u 2V8_RADIO
39K
(10V,Z,Y5V)
U303 LM4809LD
7
GND3
LOUT
ROUT
GND2
VD
15
14
13
12
11
C332
C333
C328
56p
(50V,J,NP0)
C322
10p
1608
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
FOR RADIO
2 : AUDIO
4 : EAR_L
5 : EAR_R
6 : TXD
7 : RXD
8 : JACK_D
F
9,10 : BATT
11 : R/ON
12,13 : CHG
20
22
C330
1u
0.1u
0.1u
R329
R330
20K
20K
1
5
C335
22n
VDD
VOUT1
VOUT2
0
6
R331
0
HSEJ-18S04-25R
RADIO_SPK_L
3
9
R332
BATT_TEMP
C336
3p
2V8_RADIO
0
3
2
1
CN302
C337
18p
39K
C338
0.1u
R335
100K
R334
10K
C
RADIO_SPK_R
VIN2
2
BYPASS GND
4
_SHDN BGND
RADIO_AMP_SHDN
8
R327
VBAT
VIN1
R333
(50V,J,NP0)
(50V,C,NP0)
(TOL:0.25P)
0.1u
2V8_RADIO
1800
1800
2V8_RADIO
_SEN
SCLK
SDIO
RCLK
VIO
FM_RST
FB301
FB302
R324
100K
2V8_RADIO
21
20
19
18
17
16
0
10u
10u
1800
RPWRON
PGND
NC2
GPIO1
GPIO2
GPIO3
VA
R328
FM_ANT
C323
C324
FOR RADIO
FB300
HS_DET
R326
C
VCHARGE
C326
2V8_VIO
E
L300
270nH
CN301
AUXOP_FML
AUXOP_FMR
TXD
RXD
RADIO
FM_ANT
VBAT
2V8_VIO
C325
F
RADIO_AMP_SHDN (FOR FM RADIO)
FM_INT
RADIO_AMP_SHDN
R322
NA
2V8_VIO
R321
D
D
C339
4.7K
4.7K
R337
R336
D
2V8_VIO
FM_SCL
FM_SDA
R338
FM_32K
47
C340
0.1u
RADIO_DETECT
U305
NLAS5223BMNR2G
1
R339
27K
2V8_RADIO
VBAT
RADIO_SPK_R
U304
E
1
2
3
RADIO_EN
BH28FB1WHFV
5
STBY
NC
6
GND BGND
4
VIN
VOUT
RADIO
R342
NA
8
IN2
4
AUXOP_FML
R341
R340
NA
FOR RADIO
EPPA1
NC2
6
NC1
E
330K
7
IN1
5
EPPA1
RADIO_SPK_L
9
R344
GND
Section
Date
Sign & Name
Designer
11/16
2006
SANG-YEON.LEE
Sheet/
240K
C342
1u
C341
1u
RADIO_DETECT
COM2
COM1
FOR RADIO
R343
100K
NO2
NO1
3
AUXOP_FMR
2V8_VIO
10
VCC
2
HEADSET_RADIO_SEL
MODEL
Sheets
GB3_RADIO
SPFY0144601
3/4
R345
100K
(10V,K,X5R)
27K
Checked
2006
NO RADIO
2.7K
DRAWING
F
NAME
Approved
RADIO,MEMORY,AUDIO,I/O
2006
Iss.
1
2
3
4
5
6
7
Notice No.
Date
Name
LG Electronics Inc.
DRAWING
NO.
VER-1.1
9
8
LG(42)-A-5505-10:01
LG Electronics Inc.
- 91 -
7. CIRCUIT DIAGRAM
1
2
TP400
TP401
TP402
3
TP403
TP404
4
5
6
7
8
9
10
TP405
R400
NA
R401
0
1p
AA
22nH
C401
39p
0
R403
R402
L401
1K
L400
2.2nH
C400
TX_RAMP
A
(50V,J,NP0)
(50V,J,NP0)
(10V,Z,Y5V)
(50V,J,NP0)
(16V,K,X7R)
G2
VBAT
VBAT
R404
DCS_PCS_OUT
0
L402
NA
VAPC
15
C410
22p
R406
11
0
C411
NA
19
C412
NA
3
7
VC1
VC2
C417
27p
5
8
10
C418
27p
LMSP2PAA-575TEMP
2
3
(50V,J,NP0) (16V,K,X7R)
R407
4
GSM_OUT
0
ENABLE
P_GND
0
1
GSM1800_1900TX
6
GSM1800_1900RX
VC_GSM850_900TX
VC_GSM1800_1900TX
IN
EGSM_IN
BS
18
TXON_PA
1
R408
NA
R409
NA
BS
C413
27p
C414
27p
16
14
13
12
10
9
8
7
5
FL400
DCS_PCS_IN
U400
SKY77318
RSVD_GND
R410
9
6
DCS_PCS_OUT
EGSM_OUT
C408
0.01u
C409
NA
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
21
C407
27p
VCC1A
C406
18p
C405
33p
(2012)
VCC1B
C402
10u
17
C404
0.01u
20
C403
12p
VBATT
B
C
R405
0
RF
G1
ANT
SW400
RF500
C416
NA
C415
NA
C
2
GND1 GSM850_900TX
4
GND2 GSM850_900RX
GND3
C419
O2_2
6
O2_1
7
O1_2
8
O1_1
9
C420
1 I1
FL401
DEFAULT_BANDSEL
G4
G3
G1
4 I2
TP406
GSM_RXN
L403
18nH
5 10
G2
3
2
3p
C421
3p
GSM_RXP
3p
DCS_RXN
B9308
L404
5.1nH
PART_NO SFSB0001401
D
D
IN CASE OF GSM850/PCS1900
CHANGE THIS DUAL SAW FILTER
TO PART_NO SFSB0001301
C422
3p
DCS_RXP
Section
Designer
Checked
E
Approved
Date
11/16
2006
Sign & Name
KEE-OUN.PARK
2006
1
2
3
4
5
6
Sheet/Sheets
GB3_RADIO
4/4
DRAWING
NAME
RF
DRAWING
NO.
VER-1.1
2006
LG Electronics Inc.
LGIC(42)-A-5505-10:01
MODEL
7
LG Electronics Inc.
- 92 -
8. PCB LAYOUT
- 93 -
8. PCB LAYOUT
- 94 -
9. ENGINEERING MODE
9. ENGINEERING MODE
9.1 About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions
provided by a handset.
9.2 Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch
back to non-engineering mode operation.
9.3 Key Operation
Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key
will switch back to the original test menu.
9.4 Engineering Mode Menu Tree
ENGINEERING MODE
1. BB TEST
2. Model Version
3. Eng Mode
4. Call Timer
5. Factory Reset
6. MF Test
- 95 -
9. ENGINEERING MODE
BB TEST
1. Backlight
1. Backlight On
2. Backlight Off
3. Backlight Value
2. LCD
1. Red
1. LCD Color
2. Green
3. Blue
2. Contrast
4. Black
5. White
6. Auto LCD
3. Battery Info
4. Vibrator
1. Vibrator On
2. Vibrator Off
1. Audio Test
5. Audio
2. Close
*
6. FM Radio
* FM Radio function is not supported
- 96 -
9. ENGINEERING MODE
9.4.1 BB Test
9.4.1.1 Backlight
➀ backlight on : LCD backlight is off.
➁ backlight off : LCD backlight is on.
➂ backlight value : LCD backlight brightness is controlled by 20% from 100 to 0.
9.4.1.2 LCD
➀ LCD color : This menu includes 5 color menu and automatic color change.
5 color menu is Red, Green, Blue, Black and White.
➁ LCD contrast : This menu displays a contrast value and LCD maker.
9.4.1.3 Battery Info
This menu displays the information of battery, as example battery voltage level and temperature.
In line 2, battery voltage level is displayed with average and instant value.
In line 3. battery temperature value is displayed, but this value is ADC value.
In line 4. Icon number of battery voltage is displayed.
9.4.1.4 Vibrator
This menu can control vibrator on and off operation.
9.4.1.5 Audio
This menu can control MIDI operation
- 97 -
9. ENGINEERING MODE
Model Version
9.4.2 Model Version
This menu displays the Model software version.
Eng Mode
1. Serving Cell
2. Neighbour Cells
3. Reset Information
- 98 -
9. ENGINEERING MODE
9.4.3 Eng Mode
9.4.3.1 Serving Cell
This Menu dispays the the informations of Serving Cell environment.
For example, ARFCN, RF Level etc.
ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while Idle
mode
RxLev : RX level of Serving Cell while Idle mode
C1 : C1 Value of Serving Cell, This value will be used to decide cell reselection.
C2 : C2 Value of Serving Cell, This value will be used to decide cell reselection.
BPM : Paging period of Serving Cell
ARFCND : Absolut Radio Frequency Channel Number (Frequency Number) of Serving Cell while
Dedicated mode
RxLf : Full RX level of Serving Cell
RxLs : Sub RX level of Serving Cell
RxQf : Full RX qual of Serving Cell
RxQs : Sub RX qual of Serving Cell
DSC : Downlink Signal Counter
RLL : Radio Link Loss Counter
Chtyp : Channel type of Serving Cell
Chmod : Channel Mode of Serving Cell
DTX : Discontinuous Transmission mode of Serving Cell
MCC : Mobile Country Code of Serving Cell
MNC : Mobile Country Code of Serving Cell
LAC : Location Area Code of Serving Cell
CID : Cell ID of Serving Cell
BSIC : Base Tranceiver Station Identity Code of Serving Cell
TxPwrMax : MS_TXPWR_MAX_CCH value of Serving Cell
RxMin : RXLEV_ACCESS_MIN value of Serving Cell
C2vld : C2_VALID value of Serving Cell
CRoff : CELL_RESELECT_OFFSET value of Serving Cell
TMPoff : TEMPORARY_OFFSET value of Serving Cell
PTime : PENALTY_TIME value of Serving Cell
RF# : Number of frequencies in MA(Mobile Allocation)
T3212 : Periodic Location Update Timer
TxPwrLev : Current Tx power of MS
ACC : Access Control Class
Band : Current Band Information
TA : Current Timing Advance
Cipher : Cipher mode of Serving Cell
CBQ : Cell Bar Quality flag of Serving Cell
CBA : Cell Bar Access flag of Serving Cell
- 99 -
9. ENGINEERING MODE
9.4.3.2 Neighbour Cells
This menu displays the informations of Neighbour Cells.
ARFCN : Absolut Radio Frequency Channel Number (Frequency Number) of Neighbour Cell
RxLev : Rx Level of Neighbour Cell
C1 : C1 Value of Neighbour Cell, This value will be used to decide cell reselection.
C2 : C2 Value of Neighbour Cell, This value will be used to decide cell reselection.
MCC : Mobile Country Code of Neighbour Cell
MNC : Mobile Network Code of Neighbour Cell
LAC : Location Area Code of Neighbour Cell
CID : Cell ID of Neighbour Cell
BSIC : Base Tranceiver Station Identity Code of Neighbour Cell
9.4.3.3 Reset Information
This menu displays the information of reset point in source code, call stack.
- 100 -
9. ENGINEERING MODE
Call Timer
9.4.4 Call Timer
This menu displays the time of all calls, including the received calls.
Factory Reset
9.4.5 Factory Reset
This menu is to format data block in the flash memory and this procedure set up the default value in
data block.
- 101 -
9. ENGINEERING MODE
MF TEST
1. All auto Test
2. Backlight
3. Audio
4. Vibrator
5. LCD
6. Key Pad
*
7. Mic Speaker
*
8. FM radio
* function is not supported
- 102 -
9. ENGINEERING MODE
9.4.6 MF TEST
This manufacturing mode is designed to do the baseband test automatically.
Selecting this menu will process the test automatically, and phone displays the previous menu after
completing the test.
9.4.6.1 All auto Test
LCD, Backlight, Vibrator, Buzzer, Key Pad
9.4.6.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
9.4.6.3 Audio
This menu is to test the volume of Melody. It rings in the following sequence.
Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
9.4.6.4 Vibrator
Vibrator is on for about 1.5 seconds.
9.4.6.5 LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
9.4.6.6 Key Pad
When a pop-up message shows ‘Press Any Key’, you may press any keys.
If the key is working properly, name of the key is displayed on the screen.
- 103 -
10. CALIBRATION
10. CALIBRATION
10.1 Test Equipment Setup
4.000V 0.0000A
10.2 Calibration Steps
10.2.1 Tune on the phone
10.2.2 Execute “HK_28.exe”
- 104 -
10. CALIBRATION
10.2.3 Click “SETTING” Memu
KG278
10.2.4 Setup “Ezlooks” menu such as the following fugure
- 105 -
10. CALIBRATION
10.2.5 Setup “Line System” menu such as the following fugure
KG278
Adjust the number of times.
10.2.6 Setup Logic operation such as the following figure
KG278
Operation Mode
1. By-Pass: not control by GPIB
2. Normal : control by GPIB
Setup UART Port
PWR : Power Supply
CELL :Call-Test Equipment
- 106 -
10. CALIBRATION
10.2.7 Select “MODEL”
10.2.8 Click “START” for RF calibration
KG278
10.2.9 RF Calibration finish
- 107 -
10. CALIBRATION
10.2.10 Calibration data will be saved to the following folder
- 108 -
11. STAND ALONE TEST
11. STAND ALONE TEST
11.1 Test Program Setting
11.1.1 Set COM Port
11.1.2 Check PC Baud rate(115200)
11.1.3 Confirm EEPROM & Delta file prefix name
11.1.4 Click “V24AT#ON” and then “Update Info” for communicating Phone
and Test Program
Not Connected
- 109 -
11. STAND ALONE TEST
Connected
11.1.5 For the purpose of the Standalone Test, Change the Phone to “ptest
mode” and then Click the “Reset” bar.
11.1.6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test
setup is finished.
Change "ptest mode"
- 110 -
11. STAND ALONE TEST
11.2 Tx Test
11.2.1 Click “Non signaling mode” bar and then confirm “OK” test in the
command line
11.2.2 Put the number of TX Channel in the ARFCN
11.2.3 Select “TX” in the RF mode menu and “PCL” in the PA Level menu
11.2.4 Finally, Click “Write All” bar and try the efficiency test of Phone
- 111 -
11. STAND ALONE TEST
11.3 RX Test
11.3.1 Put the number of RX Channel in the ARFCN
11.3.2 Select “RX” in the RF mode menu
11.3.3 Finally, Click “Write All” bar and try the efficiency test of Phone
- 112 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
22
20
21
15
7
18
14
12
13
17
10
19
11
1
16
9
3
4
8
2
5
23
6
- 113 -
- 114 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts
<Mechanic component>
Level
Location
No.
1
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
Specification
Color
GSM,BAR/FILP
TGSM0050103
Black
2
AAAY00
ADDITION
AAAY0203337
Black
2
APEY00
PHONE
APEY0429703
Black
3
ACGK00
COVER ASSY,FRONT
ACGK0085205
Black
4
MCJK00
COVER,FRONT
MCJK0069001
MOLD, PC LUPOY SC-1004A, , , , ,
4
MPBG00
PAD,LCD
MPBG0058101
4
MPBM00
PAD,RECEIVER
4
MTAB00
4
Remark
Black
7
COMPLEX, (empty), , , , ,
Without
Color
14
MPBM0016401
COMPLEX, (empty), , , , ,
Without
Color
15
TAPE,PROTECTION
MTAB0168901
COMPLEX, (empty), , , , ,
Without
Color
20
MTAD00
TAPE,WINDOW
MTAD0065701
COMPLEX, (empty), , , , ,
Without
Color
21
4
MWAC00
WINDOW,LCD
MWAC0077002
CUTTING, PMMA MR 200, , , , ,
Black
22
4
SURY00
RECEIVER
SURY0013001
PIN ,109 dB,32 ohm,11*7 ,3T ,; , , , , , ,CONTACT ,
3
ACGM00
COVER ASSY,REAR
ACGM0086801
4
ENZY00
CONNECTOR,ETC
ENZY0019901
3 PIN,3 mm,STRAIGHT , ,
4
MCCZ00
CAP
MCCZ0024001
MOLD, Urethane Rubber S185A, , , , ,
Black
4
4
MCJN00
COVER,REAR
MCJN0065001
MOLD, PC LUPOY SC-1004A, , , , ,
Black
8
4
MLAB00
LABEL,A/S
MLAB0000601
HUMIDITY STICKER
Without
Color
2
4
MPBN00
PAD,SPEAKER
MPBN0039901
COMPLEX, (empty), , , , ,
Without
Color
16
3
GMEY00
SCREW MACHINE,BIND
GMEY0002001
1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7
3
MBJA00
BUTTON,DIAL
MBJA0023209
COMPLEX, (empty), , , , ,
Black
12
3
MCCF00
CAP,MOBILE SWITCH
MCCF0042301
MOLD, Urethane Rubber S185A, , , , ,
Black
5
3
MLAK00
LABEL,MODEL
MLAK0006901
5
ADCA00
DOME ASSY,METAL
ADCA0063901
Without
Color
10
5
MLAZ00
LABEL
MLAZ0038301
PID Label 4 Array
Without
Color
6
SC100
CAN,SHIELD
MCBA0016401
PRESS, NS, 0.2, , , ,
Without
Color
18
Black
- 115 -
3
23
19
12. EXPLODED VIEW & REPLACEMENT PART LIST
<Main component>
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Level
Location
No.
Description
Part Number
4
SJMY00
VIBRATOR,MOTOR
SJMY0007903
3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,
VIBRATOR,MOTOR
SJMY0007904
3 V,.1 A,4*8 ,height 5.8mm ,; ,3V , , ,11000 , , , ,
Specification
Color
Remark
9
4
SNGF00
ANTENNA,GSM,FIXED
SNGF0022402
3.0 ,-2.0 dBd,, ,internal, GSM900/1800 ,; ,DUAL ,-2.0 ,50
,3.0
11
4
SUSY00
SPEAKER
SUSY0025801
PIN ,8 ohm,89 dB,16 mm, ,; , , , , , , ,CONTACT
1
3
SAFY00
PCB ASSY,MAIN
SAFY0193036
4
SAFB00
PCB ASSY,MAIN,INSERT
SAFB0061605
5
SUMY00
MICROPHONE
SUMY0003802
FPCB ,-42 dB,4*1.5 ,
5
SVLM00
LCD MODULE
SVLM0024402
MAIN ,128*128 ,35.78*39.7*2.7 ,65k ,CSTN ,TM ,S6B33BG
,1.52" Serial IF Only for CI
4
SAFF00
PCB ASSY,MAIN,SMT
SAFF0114336
5
SAFC
PCB ASSY,MAIN,SMT
BOTTOM
SAFC0086602
6
BAT100
BATTERY,CELL,LITHIUM
SBCL0001901
3.3 V,0.025 mAh,COIN ,Capacitor type Backup Batt. Pb-Free
,; ,3.3 ,0.025mAh ,COIN
6
C100
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C101
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C104
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C105
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C106
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C107
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C108
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C109
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C110
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C111
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C112
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C113
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C114
CAP,CHIP,MAKER
ECZH0001216
220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C115
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C117
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C118
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C119
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C120
CAP,CERAMIC,CHIP
ECCH0002101
1 uF,10V ,K ,B ,TC ,2012 ,R/TP
17
- 116 -
13
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C121
CAP,CERAMIC,CHIP
ECCH0002004
0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP
6
C122
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C123
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C124
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C125
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C126
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C127
CAP,CERAMIC,CHIP
ECCH0000157
15 nF,16V,K,X7R,HD,1005,R/TP
6
C128
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C129
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C130
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C131
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C132
CAP,CHIP,MAKER
ECZH0001106
4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP
6
C133
CAP,CHIP,MAKER
ECZH0001106
4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP
6
C200
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C201
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C202
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C203
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C204
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C209
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C210
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C211
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C212
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C221
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C222
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C223
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C302
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C303
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C304
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C305
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C306
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C307
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C308
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C309
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C310
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
Description
Part Number
Specification
- 117 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C311
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C312
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C313
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C314
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C315
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C316
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C317
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C319
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C320
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C321
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C322
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C323
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C324
CAP,CERAMIC,CHIP
ECCH0006501
10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP
6
C325
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C326
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C327
CAP,CERAMIC,CHIP
ECCH0003002
10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP
6
C328
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C329
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C330
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C331
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C332
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C333
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C335
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C336
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C337
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C338
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C339
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C340
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C341
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C342
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C400
CAP,CHIP,MAKER
ECZH0000802
1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C401
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C402
CAP,CERAMIC,CHIP
ECCH0003002
10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP
6
C403
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Specification
- 118 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C404
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C405
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C406
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
6
C407
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C408
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C410
CAP,CERAMIC,CHIP
ECCH0009505
22 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
6
C413
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C414
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C417
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C418
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C419
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C420
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C421
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
C422
CAP,CERAMIC,CHIP
ECCH0000104
3 pF,50V,C,NP0,TC,1005,R/TP
6
CN200
CONNECTOR,FFC/FPC
ENQY0013801
13 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC ,STRAIGHT
,TOP ,SMD ,R/TP ,[empty] ,
6
CN301
CONNECTOR,I/O
ENRY0006401
18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
6
D300
DIODE,SWITCHING
EDSY0005301
SC-70 ,80 V,0.1 A,R/TP ,
6
FB300
FILTER,BEAD,CHIP
SFBH0008105
1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6
FB301
FILTER,BEAD,CHIP
SFBH0008105
1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6
FB302
FILTER,BEAD,CHIP
SFBH0008105
1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6
FL400
FILTER,SEPERATOR
SFAY0010101
850.1900 ,900.1800 ,2.0 dB,2.0 dB,2.0 dB,2.0 dB,ETC
,Dual Band ASM, 2.5x2.5x1.2
6
FL401
FILTER,SAW,DUAL
SFSB0001401
942.5 MHz,35 MHz,2.1 dB,20 dB,1842.5 MHz,75 MHz,2.3
dB,12 dB,2.0*1.6*0.68 ,SMD
,925M~960M,1805M~1880M,10p,B,150_82,150_15,EGSM
+DCS Rx ,; ,942.5, 1842.5 ,2.0*1.6*0.68 ,SMD ,R/TP
6
J300
CONN,SOCKET
ENSY0018101
6 PIN,ETC , ,2.54 mm,H=1.5
6
L102
INDUCTOR,CHIP
ELCH0001032
18 nH,J ,1005 ,R/TP ,PBFREE
6
L103
INDUCTOR,CHIP
ELCH0004715
27 nH,J ,1005 ,R/TP ,
6
L104
INDUCTOR,CHIP
ELCH0004715
27 nH,J ,1005 ,R/TP ,
6
L300
INDUCTOR,CHIP
ELCH0001556
270 nH,J ,1608 ,R/TP ,
6
L400
INDUCTOR,CHIP
ELCH0004721
2.2 nH,S ,1005 ,R/TP ,
6
L401
INDUCTOR,CHIP
ELCH0001413
22 nH,J ,1005 ,R/TP ,PBFREE
6
L403
INDUCTOR,CHIP
ELCH0001032
18 nH,J ,1005 ,R/TP ,PBFREE
6
L404
INDUCTOR,CHIP
ELCH0003814
5.1 nH,S ,1005 ,R/TP ,5.1nH,1005
6
Q200
TR,BJT,NPN
EQBN0007101
EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
Description
Part Number
Specification
- 119 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
Q300
TR,BJT,NPN
EQBN0007101
EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
6
R100
RES,CHIP,MAKER
ERHZ0000506
6800 ohm,1/16W ,J ,1005 ,R/TP
6
R101
RES,CHIP,MAKER
ERHZ0000244
22 Kohm,1/16W ,F ,1005 ,R/TP
6
R102
RES,CHIP
ERHY0000278
82K ohm,1/16W,J,1005,R/TP
6
R104
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R105
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R106
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R108
RES,CHIP
ERHY0000278
82K ohm,1/16W,J,1005,R/TP
6
R109
RES,CHIP,MAKER
ERHZ0000507
68 Kohm,1/16W ,J ,1005 ,R/TP
6
R110
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R111
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R112
RES,CHIP,MAKER
ERHZ0000287
47 Kohm,1/16W ,F ,1005 ,R/TP
6
R115
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R116
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R119
RES,CHIP
ERHY0003401
1800 ohm,1/16W ,J ,1005 ,R/TP
6
R122
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R124
RES,CHIP
ERHY0008402
160 Kohm,1/16W ,F ,1005 ,R/TP
6
R125
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R197
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R202
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R205
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R206
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R207
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R208
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R210
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R222
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R223
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R300
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R301
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R302
RES,CHIP,MAKER
ERHZ0000485
4700 ohm,1/16W ,J ,1005 ,R/TP
6
R303
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R304
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R305
RES,CHIP,MAKER
ERHZ0000702
10 ohm,1/10W ,J ,1608 ,R/TP
6
R306
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Specification
- 120 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R307
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R308
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R309
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R310
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R312
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R313
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R314
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R316
RES,CHIP,MAKER
ERHZ0000529
1.5 Kohm,1/16W ,J ,1005 ,R/TP
6
R317
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R318
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R319
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R320
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R321
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R323
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R324
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R326
RES,CHIP,MAKER
ERHZ0000476
39 Kohm,1/16W ,J ,1005 ,R/TP
6
R327
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R328
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R329
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R330
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R331
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R332
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R333
RES,CHIP,MAKER
ERHZ0000476
39 Kohm,1/16W ,J ,1005 ,R/TP
6
R334
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R335
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R336
RES,CHIP,MAKER
ERHZ0000485
4700 ohm,1/16W ,J ,1005 ,R/TP
6
R337
RES,CHIP,MAKER
ERHZ0000485
4700 ohm,1/16W ,J ,1005 ,R/TP
6
R338
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R339
RES,CHIP,MAKER
ERHZ0000454
27 Kohm,1/16W ,J ,1005 ,R/TP
6
R341
RES,CHIP,MAKER
ERHZ0000467
330 Kohm,1/16W ,J ,1005 ,R/TP
6
R343
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R344
RES,CHIP,MAKER
ERHZ0000450
240 Kohm,1/16W ,J ,1005 ,R/TP
6
R345
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R401
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Specification
- 121 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R402
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R403
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R404
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R405
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R406
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R407
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R410
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
SW400
CONN,RF SWITCH
ENWY0004501
,SMD , dB,H=3.6, Straight type
6
U100
IC
EUSY0176402
Flip-Chip CSP ,9 PIN,R/TP ,Audio Power Amplifier
6
U101
IC
EUSY0328601
DFN ,10 PIN,R/TP ,Li-ion charger IC, 1A, 10Pin, 3x3, DFN
6
U102
IC
EUSY0317401
BGA ,189 PIN,R/TP ,E-Gold voice
6
U200
IC
EUSY0238702
TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154
Low cost version)
6
U301
IC
EUSY0328001
BGA ,56 PIN,R/TP ,32Mb/4Mb , 200 nm, MirroBit
6
U302
IC
EUSY0320801
QFN ,20 PIN,R/TP ,FM Tuner Chip, 3*3*0.57, Pb Free
6
U303
IC
EUSY0142501
LLP ,8 PIN,R/TP ,Dual 105mW Headphone Amplifier
6
U304
IC
EUSY0223002
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT
CONTROL / 2.8V
6
U305
IC
EUSY0300101
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog
Switch, PB-Free
6
U400
PAM
SMPY0014001
35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band
6
X100
X-TAL
EXXY0004602
.032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD
,6.9*1.4*1.3 ,
6
X101
X-TAL
EXXY0018404
26 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppm at 30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , , ,SMD
,R/TP
5
SAFD
PCB ASSY,MAIN,SMT TOP
SAFD0085602
6
C102
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C103
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
L100
INDUCTOR,CHIP
ELCH0004711
22 nH,J ,1005 ,R/TP ,
6
L101
INDUCTOR,CHIP
ELCH0004711
22 nH,J ,1005 ,R/TP ,
6
LD200
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD201
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD202
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD203
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD204
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD205
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
R201
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Specification
- 122 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R203
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R204
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R209
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R211
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R212
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R213
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R214
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R215
RES,CHIP,MAKER
ERHZ0000505
680 ohm,1/16W ,J ,1005 ,R/TP
6
R216
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R217
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R218
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R219
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R220
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R221
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
SPFY00
PCB,MAIN
SPFY0144601
FR-4 ,.0.8mm,BUILD-UP 4 ,KG270/KG278 Main PCB
Description
Part Number
Specification
- 123 -
Color
Remark
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.3 Accessory
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Level
Location
No.
3
MCJA00
COVER,BATTERY
MCJA0040301
MOLD, PC LUPOY SC-1004A, , , , ,
3
SBPL00
BATTERY PACK,LI-ION
SBPL0089503
3.7 V,750 mAh,1 CELL,PRISMATIC ,WLT, BATT, Europe
Label, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC ,43x34x46 ,
,ALLTEL SILVER ,Innerpack ,Europe Label
BATTERY PACK,LI-ION
SBPL0088203
3.7 V,750 mAh,1 CELL,PRISMATIC ,GB3 BATT(CMW
standard batt), Europe, Pb-Free ,; ,3.7 ,750 ,0.2C
,PRISMATIC ,43x34x46 , ,ALLTEL SILVER ,Innerpack
,Europe Label
Description
Part Number
Specification
3
SGEY00
EAR PHONE/EAR MIKE SET
SGEY0003209
; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty]
,BLACK,EARPHONE HOUSING:SILVER ,18P MMI
CONNECTOR ,MONO18P(5P)LOW COST
3
SSAD00
ADAPTOR,AC-DC
SSAD0024901
100-240V ,5060 Hz,5.1 V,.7 A,CB/GOST ,AC-DC
ADAPTOR ,; ,100Vac~350Vac ,5.1V (+0.15, -0.2) ,700mA
,5060 , ,WALL 2P ,I/O CONNECTOR ,
ADAPTOR,AC-DC
SSAD0024902
100-240V ,5060 Hz,5.2 V,0.7 A,CB/GOST ,AC-DC
ADAPTOR ,; ,100Vac~350Vac ,5.2±0.3V ,700mA ,5060 ,
,WALL 2P ,I/O CONNECTOR ,
- 124 -
Color
Remark
Black
6
Note
Note