Download LG U250 User's Manual
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Service Manual Service Manual U250/KU250 Model : U250/KU250 Date: June, 2007 / Issue 1.0 Table Of Contents 1. INTRODUCTION .............................. 5 1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 2. PERFORMANCE...............................7 2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radio Performance ..................................8 2.4 Current Consumption.............................14 2.5 RSSI BAR ..............................................14 2.6 Battery BAR ...........................................15 2.7 Sound Pressure Level............................16 2.8 Charging ................................................16 4.16 Receiver Path ....................................107 4.17 Headset path......................................109 4.18 Speaker phone path...........................111 4.19 Main microphone ...............................113 4.20 Headset microphone..........................115 4.21 Vibrator ..............................................117 5. DOWNLOAD..................................119 5.1 U250/KU250 DOWNLOAD ..................119 5.1.1 Introduction ...................................119 5.1.2 Downloading Procedure ...............119 5.1.3 Troubleshooting Download Errors 129 5.1.4 Caution .........................................133 3. TECHNICAL BRIEF ........................17 6. BLOCK DIAGRAM ........................134 3.1 General Description ...............................17 3.2 GSM Mode.............................................19 3.3 UMTS Mode...........................................23 3.4 LO generation and distribution circuits...25 3.5 Off-chip RF Components .......................25 3.6 Digital Baseband(DBB/MSM6245).........34 3.7 Block Diagram(MSM6245).....................36 3.8 Subsystem(MSM6245) ..........................37 3.9 Power Block ...........................................45 3.10 External memory interface ...................50 3.11 H/W Sub System..................................52 3.12 Main Features ......................................68 6.1 GSM & UMTS RF Block.......................134 6.2 Interface Diagram ................................136 7. Circuit Diagram ............................143 8. pcb layout .....................................147 9. Calibration & RF Auto Test Program (Hot Kimchi)..................149 9.1 Configuration of HOT KIMCHI .............149 9.2 How to use HOT KIMCHI.....................152 10. Factory Test Mode .....................154 4. TROUBLE SHOOTING ...................73 4.1 RF Component.......................................73 4.2 SIGNAL PATH_UMTS RF .....................75 4.3 SIGNAL PATH_GSM RF .......................76 4.4 Checking VC-TCXO Block .....................77 4.5 Checking Front-End Module Block ........79 4.6 Checking UMTS Block ...........................81 4.7 Checking GSM Block .............................86 4.8 Checking Bluetooth Block ......................92 4.9 Power ON Troubleshooting....................94 4.10 Charger Troubleshooting .....................96 4.11 USB Troubleshooting...........................99 4.12 SIM Detect Troubleshooting ..............100 4.13 Camera Troubleshooting ...................102 4.14 Keypad Backlight Troubleshooting ....105 4.15 Main LCD Troubleshooting ................106 -3- 10.1. Test Program Setting ........................154 10.2. WCDMA Test Mode ..........................155 10.3. GSM Test Mode................................156 11. EXPLODED VIEW & REPLACEMENT PART LIST ..... 157 11.1 EXPLODED VIEW ............................ 157 11.2 Replacement Parts <Mechanic component>.................... 159 <Main component> ........................... 161 11.3 Accessory ......................................... 174 -4- 1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that resultfrom such unauthorized use. B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done. C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service. D. Maintenance Limitations Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty. -5- 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H. Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign. • Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. • Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used. • When returning system boards or parts like EEPROM to the factory, use the protective package as described. -6- 2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Shape Size Specification GSM900/1800/1900 and WCDMA2100 - Bar type Handset 110.9 X 46.7 X 15.6 mm Weight Under 83 g (with 950mAh Battery) Power 3.7 V normal, 950 mAh Li-Ion Talk Time Over 200 min (WCDMA, Tx=12 dBm, Voice) (with 950mAh) Over 180 min (GSM, Max Tx Power, Voice) Standby Time Over 350 Hrs (WCDMA, DRX=1.28) (with 950mAh) Over 450 Hrs (GSM, Paging period=9) Antenna LCD LCD Backlight Internal type Main 1.76” TFT, QCIF, 262K White LED Back Light Camera 1.3 Mega pixel + VGA Video Call Camera Vibrator Yes ( Cylinder Type) LED Indicator No MIC Yes Receiver Yes Earphone Jack Yes (18 pin) Connectivity Bluetooth, USB External Memory Yes(Micro SD) I/O Connect 18 Pin -7- 2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Min Typ. Max Unit TA Power Available power 100 220 240 Vac * CLA : 12 ~ 24 V(DC) 2.3 Radio Performance 1) Transmitter - GSM Mode No Item GSM 100k~1GHz DCS & PCS MS allocated Channel 1G~12.75GHz -39dBm 1G~[A]MHz -33dBm [A]M~[B]MHz -39dBm [B]M~12.75GHz -33dBm -33dBm Conducted 1 9k ~ 1GHz -39dBm Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm Emission 880M~915MHz -62dBm 880M~915MHz -62dBm 915M~1GHz -60dBm 915M~1GHz -60dBm 1G~[A]MHz -50dBm 1G~[A]MHz -50dBm [A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm [B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm Idle Mode * In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910 -8- 2. PERFORMANCE No Item GSM 30M ~ 1GHz DCS & PCS MS allocated Channel 1G ~ 4GHz -36dBm 1G~[A]MHz -30dBm [A]M~[B]MHz -36dBm [B]M~4GHz -30dBm -30dBm Radiated 2 30M~1GHz -36dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz -57dBm 1G~[A]MHz -47dBm 1G~[A]MHz -47dBm [A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm [B]M~4GHz -47dBm [B]M~4GHz -47dBm Idle Mode 3 Frequency Error 4 Phase Error ±0.1ppm ±0.1ppm ±5(RMS) ±5(RMS) ±20(PEAK) ±20(PEAK) 3dB below reference sensitivity 3dB below reference sensitivity 5 Frequency Error RA250 : ±200Hz RA250: ±250Hz Under Multipath and HT100 : ±100Hz HT100: ±250Hz Interference Condition TU50 : ±100Hz TU50: ±150Hz TU3 : ±150Hz TU1.5: ±200Hz Due to modulation 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB 200kHz -30dB 200kHz -30dB 250kHz -33dB 250kHz -33dB 400kHz -60dB 400kHz -60dB 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB 3000 ~ 6000kHz -71dB ≥6000kHz -73dB ≥6000kHz -77dB 400kHz -19dB 400kHz -22dB 600kHz -21dB 600kHz -24dB 1200kHz -21dB 1200kHz -24dB 1800kHz -24dB 1800kHz -27dB Output RF 6 Spectrum Due to Switching transient * In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910 -9- 2. PERFORMANCE No Item GSM DCS & PCS Frequency offset 800kHz Intermodulation product should 7 Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance 8 9 Transmitter Output Power Burst timing Level (dBm) (dB) Level (dBm) (dB) 5 33 ±3 0 30 ±3 6 31 ±3 1 28 ±3 7 29 ±3 2 26 ±3 8 27 ±3 3 24 ±3 9 25 ±3 4 22 ±3 10 23 ±3 5 20 ±3 11 21 ±3 6 18 ±3 12 19 ±3 7 16 ±3 13 17 ±3 8 14 ±3 14 15 ±3 9 12 ±4 15 13 ±3 10 10 ±4 16 11 ±5 11 8 ±4 17 9 ±5 12 6 ±4 18 7 ±5 13 4 ±4 19 5 ±5 14 2 ±5 15 0 ±5 Mask IN - 10 - Mask IN 2. PERFORMANCE 2) Transmitter - WCDMA Mode No Item Specification 1 Maximum Output Power Class 3 : +24dBm(+1/-3dB) 2 Frequency Error ±0.1ppm 3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) 4 Inner Loop Power control in uplink cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4.5 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4.5 Group (10 equel command group) +1 5 Minimum Output Power +8/+12 +16/+24 -50dBm(3.84MHz) Qin/Qout : PCCH quality levels 6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB 7 Transmit OFF Power 8 Transmit ON/OFF Time Mask -56dBm(3.84MHz) ±25us PRACH,CPCH,uplinlk compressed mode ±25us Power varies according to the data rate 9 Change of TFC DTX : DPCH off (minimize interference between UE) 10 Power setting in uplink compressed ±3dB(after 14slots transmission gap) 11 Occupied Bandwidth(OBW) 5MHz(99%) -35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k -35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M 12 Spectrum emission Mask -39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M -49dBc@∆f=8.5~12.5MHz,1M - 11 - 2. PERFORMANCE No Item Specification 33dB@5MHz, ACP>-50dBm 13 Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K 14 (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc 15 Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm) 16 Error Vector Magnitude (EVM) (@12.2K, 1DPDCH+1DPCCH) -15dB@SF=4.768Kbps, Multi-code 17 Transmit OFF Power transmission 3)Receiver - GSM Mode No Item GSM DCS & PCS 1 Sensitivity (TCH/FS Class II) -105dBm -105dBm C/Ic=7dB Storage -30 ~ +85 Co-Channel Rejection 2 (TCH/FS Class II, RBER, TU high/FH) 3 4 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB Wanted Signal :-98dBm 1st Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-44dBm 2nd interferer:-45dBm interferer:-44dBm Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm (TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency Intermodulation Rejection 5 - 12 - 2. PERFORMANCE 4) Receiver - WCDMA Mode No 1 Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB 3 Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4 In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and 5 Out-band Blocking 2230~2255MHz UE@+20dBm output power(Class3) -15dBm/3.84MHz@f=1~2025 and 2255~12500MHz UE@+20dBm output power(Class3) -44dBm CW 6 Spurious Response UE@+20dBm output power(Class3) -46dBm CW@10MHz 7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz UE@+20dBm output power(Class3) -57dBm@f=9KHz~1GHz, 100K BW 8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW -60dBm@f=1920MHz~1980MHz, 3.84M BW -60dBm@f=2110MHz~2170MHz, 3.84M BW - 13 - 2. PERFORMANCE 2.4 Current Consumption 1) U250/KU250 Current Consumption WCDMA GSM Stand by Voice Call VT Under 2.80 mA Under 290 mA Under 410mA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 2.12 mA Under 320 mA Paging=9 period (Max Tx Power) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change WCDMA GSM BAR 4 → 3 -85 ± 2 dBm -90 ± 2 dBm BAR 3 → 2 -95 ± 2 dBm -95 ± 2 dBm BAR 2 → 1 -106 ± 2 dBm -100 ± 2 dBm BAR 1 → 0 -111 ± 2 dBm -106 ± 2 dBm - 14 - 2. PERFORMANCE 2.6 Battery BAR Indication Standby Bar 4 Over 3.83 ± 0.05V Bar 4 → 3 3.82 ± 0.05V Bar 3 → 2 3.73 ± 0.05V Bar 2 → 1 3.68 ± 0.05V Bar 1 → Empty 3.58 ± 0.05V Low Voltage, 3.58± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk) Warning message+ Blinking [Interval : 3min(Stand-by) / 1min(Talk)] Power Off 3.20 ± 0.05V - 15 - 2. PERFORMANCE 2.7 Sound Pressure Level No 1 Test Item Sending Loudness Rating (SLR) 2 Receiving Loudness Rating (RLR) 3 4 5 Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) 6 Idle Noise-Receiving (INR) 7 Sending Loudness Rating (SLR) 8 Receiving Loudness Rating (RLR) 9 10 11 Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) 12 Idle Noise-Receiving (INR) MS Headset Nor Specification 8 ±3 dB -4 ± 3 dB -15 ± 3 dB 17 dB 40 dB -64 dBm0p Under -47 dBPA Under -36 dBPA 8±3dB -1 ±3 dB Max Min Min Max Nor Max -12 ±3 dB 25 dB 40 dB -55 dBm0p Under -45 dBPA Under -40 dBPA Max Under -62 dBm Nor Max Min Min Max Nor Max TDMA Noise -. GSM : Power Level : 5 DCS/PCS : Power Level : 0 (Cell Power : -90 ~ -105 dBm) MS and Headset 13 -. Acoustic (Max Vol.) MS/Headset SLR : 8 ± 3dB MS/Headset RLR : -15 ± 3dB/-12 (SLR/RLR : Mid-value setting) 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 700 mA • Normal Battery Capacity : 950 mAh • Charging Time : Max 3 hours (except for trickle charging time) • Full charging indication current (charging icon stop current) : 80 mA • Cut-off voltage : 3.20 V - 16 - 3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quadband GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF. UMTS (2100) GSM (900, 1800, 1900) Bluetooth 1. RTR6275 for GSM Tx and WCDMA Tx 2. RTR6275 for GSM Rx and WCDMA Rx 3. Bluetooth RF module 4. PM6650 for power management [Fig 1.1] Block diagram of RF part 1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture. - 17 - 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC. For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver. In the GSM receive paths, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency. 1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope phase signal at RF; 2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier from a DAC within the MSM U250/KU250 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators. The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions. - 18 - 3. TECHNICAL BRIEF 3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows: • GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters. RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required. GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX [Table 1.1] Antenna Switch Module Control logic 2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details. - 19 - 3. TECHNICAL BRIEF The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module. The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range. The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs). - 20 - 3. TECHNICAL BRIEF [Fig 1.2] RTR6275 RX feature - 21 - 3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.3. 6pF 51Ω 91Ω 12pF 100 Ω 91Ω 39 Ω 100 Ω [Fig 1.3] GSM Transmitter matching The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band - 22 - 3. TECHNICAL BRIEF 3.3 UMTS Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating. 3.3.2 Transmitter The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface. The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator. UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications. - 23 - 3. TECHNICAL BRIEF WCDMA_2100_TX WCDMA_2100_RX [Figure 1.4] RTR6275 IC functional block diagram - 24 - 3. TECHNICAL BRIEF 3.4 LO generation and distribution circuits The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF. Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS 2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS 2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error 3.5 Off-chip RF Components 3.5.1 WCDMA PAM (U103: WS2512-TR1G) The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) . This detector voltage can be used for transmitter calibration and monitor to meet RF system WCDMA Rev_1.0 C154 1.5p Rev.D +VPWR +VPWR C155 4.7u L404 1.8nH FL104 9 L123 1nH Rev_1.0 C162 8 GND4 RFOUT C157 10nH L122 NA RFIN GND1 IN 3 U103 VCC1 FL102 5 EFCH1950TDF1 O1 G3 1 G2 G1 2 1 2 3 2 3.3p VCONT VREF 4 PA_R0 5 1 TR100 KRX102U U102 PA_ON CP0402A1950DNTR 3 Rev.B 4 51R119 2 20dB C165 1p 7 GND3 6 GND2 11 BGND 5 OUT 50OHM 4 C164 0.5p IN 1 1 2 COUP RX TX ACMD-7602 3 PGND ANT 4 C159 15p WS2512_TR1G 10 VCC2 4 3 0.5p L125 C158 15p VREG_TCXO_2.85V PWR_DET R120 R121 47 130 7dB C192 100p R122 130 [Figure 1.5] WCDMA PAM, Duplexer, Coupler - 25 - C170 0.1u 3. TECHNICAL BRIEF 3.5.2 VCTCXO (X100 : DSA321SCE-19.2M) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC. TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line. The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 •ÏF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers. 3.5.3 Front-End Module (U500 : D5011) This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]). Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively. GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX [Table 1.2] Front End Module control logic - 26 - 3. TECHNICAL BRIEF 3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M) • Input power management - Valid external supply attachment and removal detection - Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources - Supports lithium-ion main batteries - Trickle, constant current, constant voltage, and pulsed charging of the main battery - Supports coin cell backup battery (including charging) - Battery voltage detectors with programmable thresholds - VDD collapse protection - Charger current regulation and real-time monitoring for over-current protection - Charger transistor protection by power limit control - Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is optional - Voltage, current, and power control loops - Automated recovery from sudden momentary power loss • Output voltage regulation - One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG - Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA (or second MSMC) supply voltages - Supports dynamic voltage scaling (DVS) for MSMC and PA - Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits. - All regulators can be individually enabled/disabled for power savings - Low power mode available on MSMA and MSMP regulators - All regulated outputs are derived from a common bandgap reference-close tracking • Integrated handset-level housekeeping functions reduces external parts count, size, cost - Analog multiplexer selects from 8 internal and up to 18 external inputs - Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution - Adjusted multiplexer output is buffered and routed to an MSM device ADC - Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock - Crystal oscillator detector and automated switch-over upon lost oscillation - Real time clock for tracking time and generating associated alarms - On-chip adjustments minimize crystal oscillator frequency errors - Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal - TCXO buffer control for optimal QPH/catnap timing - Three-stage over-temperature protection (smart thermal control) - 27 - 3. TECHNICAL BRIEF • Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments - Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 Ω speakers with volume controlled 500 mW) • IC-level interfaces - MSM device-compatible 3-line SBI for efficient initialization, status, and control - Supports the MSM device’s interrupt processing with an internal interrupt manager - Many functions monitored and reported through real-time and interrupt status signals - Dedicated circuits for controlled power-on sequencing, including the MSM device’s reset signal - Several events continuously monitored for triggering power-on/power-off sequences - Supports and orchestrates soft resets - USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals RUIM level translators enable MSM device interfacing with external modules • Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an LED driver, and a reference voltage buffer. • Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief [Figure 1.6] MSM6245 Interface - 28 - 3. TECHNICAL BRIEF [Figure1.7] PM6650 Block Diagram - 29 - 3. TECHNICAL BRIEF 3.5.5 GSM PAM (U101 : SKY77318) GSM_PA_RA The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability GaAs HBT technology. With 50Ω and output, no external matching or bias components are required. The module incorporates two highly-integrated GaAs power amplifier die with a BiCMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the GPRS operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a lowprofile overmolded land-grid array on laminate. L406 8.86dB Rev.1.0 C136 0.01u C139 68p 91 R111 91 R110 ENABLE RSVD_GND P_GND 2 6 U101 EGSM_IN SKY77318 BS 3 7.5dB 4 5 O1 G3 IN G2 G1 4 R113 18 100ohm GSM_PA_EN C149 15p 1 3 R112 1 GSM_TX 2 EFCH897MTDB1 R117 100ohm GSM_PA_BAND C153 15p GSM_PA_BAND LOW HIGH [Figure 1. 8] GSM PAM Schematic - 30 - MODE GSM DCS/PCS 39 R115 21 FL101 DCS_PCS_IN 100ohm 19 EGSM_OUT DCS_PCS_TX R114 11 DCS_PCS_OUT VCC1A 17 VAPC 15 R108 51 20 C138 NA 2.7nH C134 0.01u C438 100p GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1 C137 NA C121 33u 16 14 13 12 10 9 8 7 5 C441 5.6p C123 0.01u L111 5.6nH NA R107 100ohm L116 10nH VCC1B L403 1.5nH VBATT C124 100p L115 18nH EGSM +VPWR 100ohm Rev.D 3. TECHNICAL BRIEF 3.5.6 UMTS Duplexer(FL104:ACMD-7602) A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; • Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB • Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance: • Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB. • Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 58dB. • Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled. • Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). • Power handling. high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance. - 31 - 3. TECHNICAL BRIEF 3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1) • Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: • Out-of-band rejection or attenuation levels, usually specified to meet these conditions: - FFar out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. - Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage. - Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input. Table 1.3 WCDMA Rx SAW Filter Specification - 32 - 3. TECHNICAL BRIEF 3.5.8 Bluetooth (M100 : LBRQ-2B43A) The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250. MSM6245 Bluetooth baseband [Figure1.9] Bluetooth system architecture - 33 - 3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6245) 3.6.1 General Description A. Features(MSM6245) • Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE • Support for WCDMA (UMTS) uplink data rate up to 384 kbps • High-performance ARM926EJ-S running at up to 225 MHz • ARM Jazelle Java hardware acceleration for faster Java-based games and other applets • QDSP4000 high-performance DSP cores • Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals • Qcamera™ with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors • Direct interface to digital camera module with video front end (VFE) image processing • True 3D graphics for advanced wireless gaming • SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Q-fuse. Only trusted boot is supported • Audio that is on par with portable music players • Vocoder support (AMR, FR, EFR, HR) • Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology • SD/SDIO hardware support - 34 - 3. TECHNICAL BRIEF USB PM6650 -2M Bluetooth RF Module SPK/RCV VCTCXO GSM Block MIC GSM PAM GSM TX SAW GSM900 Tx GSM1800/1900 Tx GSM900 Rx GSM VCO MAIN LCD GSM1800 Rx GSM1900 Rx MSM6245 Front End Module WCDMA Block 1.3M CAM VGA CAM RTR6275 COUPLER WCDMA PAM WCDMA TX SAW U-SIM HDET WCDMA2100 Tx Duplexer WCDMA2100 Rx WCDMA VCO WCDMA RX SAW NAND, SDRAM FLASH KEYPAD AntSW Logic Figure 1.10 Simplified Block Diagram - 35 - 3. TECHNICAL BRIEF 3.7 Block Diagram(MSM6245) NAND Flash 512Mbit SDRAM 512Mbit MSM6245 UMTS, WCDMA Modem QDSP 4000 Open GL ES 3D, 2D BT 1.2 processor PLL VIDEO ARM 926ejs With Jazelle QDSP 4000 I/O Conn UART2 / RUIM1 UART1 MP3, AAC, EVRC, QCELP AMR, CMX, MIDI USB AUDIO Keypad I/F CONNECTIVITY PM6650 US B Figure 1.11 Simplified Block Diagram of MSM6245 - 36 - UART3 / PMIC SBI MPEG-4 H.263, H.264 GSM/GPRS/EDGE processor DUAL MEMORY BUS GRAPHICS VGA camera EBI 2 JTAG Camera 1.3M EBI 1 CAMERA PROCESSING (Default 8bit Interface) LCD (1.76inch) GPIO RF SBI Rx ADC Tx DAC USIM 3. TECHNICAL BRIEF 3.8 Subsystem(MSM6245) 3.8.1. ARM Microprocessor Subsystem The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices. 3.8.2. WCDMA R99 features The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features: ■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions: ❏ The downlink supports the following specifications: - Up to four physical channels, including the broadcast channel (BCH), if present - Up to three dedicated physical channels (DPCHs) - Spreading factor (SF) range support from 4 to 256 - The following transmit diversity modes are supported: ❏ Space time transmit diversity (STTD) ❏ Time-switched transmit diversity (TSTD) ❏ Closed-loop feedback transmit diversity (CLTD) ■ The uplink supports the following specifications: ❏ The uplink provides the following UE support: - One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary - A maximum data rate of 384 kbps ❏ Full SF range support from 4 to 256 ■ SMS (CS and PS) ■ PS data rate - 384 kbps DL / 384 kbps UL ■ CS data rate - 64 kbps DL / 64 kbps UL ■ AMR (all rates) - 37 - 3. TECHNICAL BRIEF 3.8.3. GSM features The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature. ■ Voice features ❏ FR ❏ EFR ❏ AMR ❏ HR ❏ A5/1, A5/2, and A5/3 ciphering ■ Circuit-switched data features ❏ 9.6k ❏ 14.4k ❏ Fax ❏ Transparent and non-transparent modes for CS data and fax ❏ No sub-rates are supported. 3.8.4. GPRS features ■ Packet switched data (GPRS) ❏ DTM (Simple Class A) operation ❏ Multi-slot class 12 data services ❏ CS schemes: CS1, CS2, CS3, and CS4 ❏ GEA1, GEA2, and GEA3 ciphering ■ Maximum of four Rx timeslots per frame 3.8.5. EDGE features ■ EDGE E2 power class for 8 PSK ■ DTM (simple Class A), multi-slot class 12 ■ Downlink coding schemes - CS 1-4, MCS 1-9 ■ Uplink coding schemes - CS 1-4, MCS 1-9 ■ BEP reporting ■ SRB loopback and test mode B ■ 8-bit, 11-bit RACH ■ PBCCH support ■ 1 phase/2 phase access procedures ■ Link adaptation and IR ■ NACC, extended UL TBF. - 38 - 3. TECHNICAL BRIEF 3.8.6. MSM6245 device audio processing features ■ Integrated wideband stereo CODEC ❏ 16-bit DAC with typical 88 dB dynamic range ❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path ■ VR- Voice mail + voice memo ■ Acoustic echo cancellation ■ Audio AGC ■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8 (G2) ■ Internal vocoder supporting AMR, FR, EFR, and HR 3.8.7. MSM6245 microprocessor subsystem ■ Industry standard ARM926EJ-S embedded microprocessor subsystem ❏ 16 kB instruction and 16 kB data cache ❏ Instruction set compatible with ARM7TDMI® ❏ ARM version 5TEJ instructions ❏ Higher performance 5 stage pipeline, Harvard cached architecture ❏ Higher internal CPU clock rate with on-chip cache ■ Java hardware acceleration ■ Enhanced memory support ❏ 75 MHz and 90 MHz bus clock for SDRAM ❏ 32-bit SDRAM ❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels ❏ 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2 ❏ NAND FLASH memory interface - 8/16-bit data I/O width NAND flash support - 1- or 4-bit ECC - 512-byte/2KB page-size support - 2 chip selects supported for NAND Flash ❏ Boot from NAND ❏ Low-power SDRAM (LP-SDRAM) interface ■ Internal watchdog and sleep timers 3.8.8. Supported interface features ■ USB On-the-Go core supports both slave and host functionality ■ Three universal asynchronous receiver transmitter (UART) serial ports ■ USIM controller (via UART) ■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards ■ Parallel LCD interface ■ General-purpose I/O pins ■ External keypad interface - 39 - 3. TECHNICAL BRIEF 3.8.9. Supported multimedia features ■ Provide additional general purpose MIPS by using: ❏ Two QDSP4000s ❏ Dedicated hardware accelerators and compression engines ■ Improve Java, BREW, and game performance ❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine ■ Enable various accessories via USB host connectivity. ❏ Integrated USB host controller functionality ■ Enable compelling visual and audio applications. QcameraTM ■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP ■ 30 fps QCIF viewfinder QtvTM ■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services. ■ Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus, Windows® Media Audio v9, RealAudio® v8 ■ Integrated stereo wideband codec for music/digital clips ■ CMX ■ Video codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10 Video telephony services: QvideophoneTM ■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps ■ Video codecs supported: MPEG-4 and H.263 ■ Audio codecs supported: AMR-NB. QcamcorderTM ■ Real time mobile video encoder ■ Video codecs supported: MPEG-4, H.263.H.264 ■ Audio codecs supported: AMR-NB ■ Recording performance: 15 fps @ QCIF, 192 kbps CMXTM (MIDI and still image, animation, text, LED/vibrate support) ■ 72 simultaneous polyphonic tones ■ 44 kHz sampling rate ■ 512 kB wave table ■ Support of universal file formats ❏ Standard MIDI Format (SMF) ❏ SP-MIDI ❏ SMAF Audio playback (MA-2, MA-3, MA-5) ❏ XMF/OLS ❏ MFi (requires Docomo license) - 40 - 3. TECHNICAL BRIEF ■ PNG decoder ■ Pitch bend range support ■ LED/vibrate support ■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) ■ MLZ decoder ■ Integrated PNG/SAF A.T. Table 1-1 Summary of MSM6245 device features Note: 1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS issues when running Bluetooth and video telephony concurrently with any other memory configuration. 16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updated accrdingly in the next revision. - 41 - 3. TECHNICAL BRIEF Table 1-2 Description of RF configurations - 42 - 3. TECHNICAL BRIEF 3.8.10. Stereo Wideband CODEC The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems. 3.8.11. Vocoder Subsystem The MSM6245 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6245 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality. 3.8.12. ARM Microprocessor subsystem The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices. 3.8.13. Mode Select and JTAG Interfaces The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture. - 43 - 3. TECHNICAL BRIEF 3.8.14. General-Purpose Input/Output Interface The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases. 3.8.15. UART The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins. 3.8.16. USB The MSM6245 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. MSM6245 supports the 3-wire functionality. - 44 - 3. TECHNICAL BRIEF 3.9 Power Block 3.9.1. General MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are : 3.9.2. PM6650 The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence. - 45 - 3. TECHNICAL BRIEF Figure 1.12 PM6650 Functional Block Diagram - 46 - 3. TECHNICAL BRIEF 3.9.3. Charging control A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 4.2V~3.82V 100~70 (%) 3.81V~3.74V 69~45 (%) 3.73V~3.69V 44~20 (%) 3.68V~3.59V 19~3 (%) 3.58V~3.20V 2~0 (%) Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition) - 47 - 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA. Parameter Min Typ Max Unit Trickle Current 60 80 100 mA - 48 - 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current. • Charging Method : CC & CV (Constant Current & Constant Voltage) • Maximum Charging Voltage : 4.2V • Maximum Charging Current : 600mA • Nominal Battery Capacity : 950mAh • Charger Voltage : 5.1V • Charging time : Max 3h (Except time trickle charging) • Full charge indication current (icon stop current) : 100mA • Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V • Low battery alarm interval : Idle - 3 min, Dedicated - 1min • Cut-off voltage : 3.20V - 49 - 3. TECHNICAL BRIEF 3.10 External memory interface The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc. • EBI1 Features - 16 bit static and dynamic memory interface - 32 bit dynamic memory interface - 24 bits of address for static memory devices which can support up to 32MBytes on each chip select - Synchronous burst memories supported (burst NOR, burst PSRAM) - Synchronous DRAM memories supported - Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses - Pseudo SRAM (PSRAM) memory support • EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices (UB_N & LB_N signals). - Support for 8 bit/16bit wide NAND flash. - Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit). • 512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit) Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH HYC0UEH0MF3P hynix 60 ns 60 ns SDRAM HYC0UEH0MF3P hynix 7 ns 7 ns Table#1. External memory interface - 50 - 3. TECHNICAL BRIEF EBI1 EBI2 ADDRESS[14:0] NAND_CS* DATA[31:0] NAND_RE* NAND_WE* WE* SDRAM CS* 512Mb CAS* NAND_CLE NAND NAND_WP* 512Mb RAS* NAND_ALE (64MB) CLK_EN NAND_READY CLK DATA[7:0] MSM6245 DQM[3:0] Figure 1.14 Simplified Block Diagram of Memory Interface - 51 - 3. TECHNICAL BRIEF 3.11 H/W Sub System 3.11.1. RF Interface A. RTR6275(WCDMA_Tx, GSM_Tx/Rx) MSM6245 controls RF part(RTR6275) using these signals. • SBST : SSBI I/F signals for control Sub-chipset • PA_ON1 : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF • TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier • DAC_REF : Reference input to the MSM Tx data DACs XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93 L25 H6 F18 H18 RCV_EN_N Close to MSM LCD_IF_MODE_1 H13 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0 A12 B12 A13 B13 F12 TX_QM TX_QP TX_IM TX_IP DAC_REF R213 C246 2K TCXO_EN PA_ON 33nF TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 W23 V23 RF V25 W25 AA25 Y25 AB25 AC25 RX_QM RX_QP RX_IM RX_IP D17 GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20 PA_R0 H15 D16 F15 D15 A17 H16 K19 N21 G4 SPK_AMP_EN J8 H12 TX_ON B4 T23 T19 D11 ANT_SEL1 ANT_SEL0 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19 GSM_PA_BAND GSM_PA_EN BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA Figure 1.15 Schematic of RF Interface of MSM6245 - 52 - TX_AGC_ADJ TRK_LO_ADJ 3. TECHNICAL BRIEF B. the others • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA(2100) TX Power Amp Enable • ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) • GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp • GSM_PA_RAMP : Power Amp Gain Control of APC_IC • GSM_PA_EN : Power Amp Gain Control Enable of APC_IC - 53 - 3. TECHNICAL BRIEF 3.11.2. MSM Sub System 3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx VREG_UIM 2.85V USIM CLK USIM Reset MSM6245 USIM CLK PM6650 USIM Data USIM Reset USIM USIM Data Figure 1.16 SIM Interface 3.11.2.2. UART Interface UART signals are connected to MSM GPIO through IO connector with 115200 bps speed. GPIO_Map Name Note GPIO_96 UART_RXD Data_Rx GPIO_95 UART_TXD Data_Tx Table. UART Interface - 54 - 3. TECHNICAL BRIEF 3.11.2.3. USB The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6245. Name Note USB_DAT Data to/from MSM USB_SE0 Data to/from MSM USB_OE_N Out-Put Enable of Transceiver USB_VBUS USB_Power From Host(PC) USB_D+ USB Data+ to Host USB_D- USB Data- to Host 12 USB_OE_N 15 16 17 18 19 20 21 VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M GP1_DRV_N( 2.2K C336 4.7u 1608 22 MMC_CMD MMC_DATA MMC_CLK USB_DAT USB_SE0 USB_OE_N PM_INT_N PS_HOLD 14 USB_CTL_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_DR309 USIM_CLK USIM_RST_N USIM_DATA 13 LCD DRV N MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31 L14 H14 M16 USB_DAT_VP USB_SE0_VM USB_OE_TP_N N25 N23 N26 UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42 L23 M19 M21 F4 E4 G6 UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88 Table. USB Signal Interface Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side) - 55 - 3. TECHNICAL BRIEF 3.11.3 HKADC(House Keeping ADC) The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure 1.18 MSM6245 HKADC Block diagram Channel Signal Note HKADC0 AMUX_OUT RF PAM Temperature Check HKADC1 VBATT_SENSE Battery voltage level HKADC2 NC NC HKADC3 NC NC HKADC4 PCB_Rev_ADC PCB Version Check HKADC5 Battery_THERM Battery Temperature Check Table. HKADC channel table - 56 - 3. TECHNICAL BRIEF 3.11.4. Key Pad There are 23 main key buttons in Figure. Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650). COL0 COL1 ROW(0) COL2 COL3 COL4 - CLR MENU ROW(1) 1 2 3 LEFT UP ROW(2) 4 5 6 OK RIGHT ROW(3) 7 8 9 SEND SEARCH ROW(4) * 0 # DOWN BACK Table. Key Matrix Mapping Table VREG_MSMP_2.7V 100K 1 3 5 7 100K RA400 R423 2 4 6 8 KEY MAP CLR MENU LEFT UP OK RIGHT SND SEARCH DN BACK KEY_ROW(0) 400 401 402 1 2 3 403 404 405 4 5 6 406 407 408 7 8 9 HOT400 409 HOT401 HOT4 0 KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) HOT3 KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) Figure 1.19 Main Keypad Circuit END END PM_ON_SW_N Figure 1.20 END Keypad Circuit - 57 - 3. TECHNICAL BRIEF 3.11.5 Camera Interface U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal. CAMERA PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 32 31 30 29 28 27 26 25 MEGA CAMERA CONNECTOR 22 23 24 1 2 3 4 5 D0 D1 D2 D3 D4 D5 D6 D7 REV_1.0 CN403 R436 0 20 19 18 12 11 10 9 7 PCLK VSYNC HSYNC STANDBY SCK SDA RESETB MCLK CAM_PCLK CAM_VSYNC_OUT CAM_HSYNC_OUT MEGA_CAM_PWR_DOWN I2C_SCL I2C_SDA MEGA_CAM_RESET_N CAM_MCLK DGND1 DGND2 DGND3 AGND1 AGND2 DVDD VDDIO AVDD CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7) 8 15 21 6 17 13 14 16 R437 20 C414 C415 C448 C413 C449 0.1u 10p NA 10p NA 0.1uF 1u C411 C412 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V REV_1.0 COMMON_CAM_MCLK INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 9 ICVE21184E150R500FR CAM_DATA(3) CAM_DATA(4) CAM_DATA(5) CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) 8 7 6 1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 10 G1 4 INOUT_B1 INOUT_A2 5 3 INOUT_A1 FL406 9 8 7 6 CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) 10 2 G2 1 G2 ICVE21184E150R500FR CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) FL407 ICVE21184E150R500FR 2 3 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 9 CAM_DATA_OUT(6) CAM_DATA_OUT(7) CAM_VSYNC_OUT CAM_HSYNC_OUT 8 7 6 10 G1 4 INOUT_A1 G2 1 CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC FL408 VT_CAMERA_CONNECTOR VGA_CAM_RESET_N I2C_SCL I2C_SDA GND7 P20 P19 P18 P17 P16 P15 P14 P13 P12 P11 6 7 8 9 10 CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) GND3 P6 P7 P8 P9 P10 GND1 GND2 GND6 GND5 CN404 15 14 13 12 11 EVL14K02200 P1 P2 P3 P4 P5 CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_DATA_OUT(7) CAM_DATA_OUT(6) VA430 CAM_PCLK CAM_DATA_OUT(0) 1 2 3 4 5 GND4 VREG_CAM_DVDD_1.5V COMMON_CAM_MCLK REV_1.0 GND8 NA 20 19 18 17 16 C424 VREG_CAM_AVDD_2.8V CAM_DATA_OUT(5) Figure 1.21 Camera Socket Type Connector - 58 - 3. TECHNICAL BRIEF The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245. No Name Port Note 1 CAM_DATA_OUT(3) O Data 2 CAM_DATA_OUT(4) O Data 3 CAM_DATA_OUT(5) O Data 4 CAM_DATA_OUT(6) O Data 5 CAM_DATA_OUT(7) O Data 6 GND GND 7 MCLK I 8 GND GND 9 MEGA_CAM_RESET_N I 10 I2C_SDA O Camera reset signal I2C Data 11 I2C_SCL O I2C Clock 12 MEGA_CAM_PWR_DN I Camera power down GND Master Clock(24.576M) GND 13 VREG_CAM_DVDD_1.8V I DVDD 14 VREG_CAM_AVDD_2.8V I VDDIO 15 GND 16 GND VREG_CAM_AVDD_2.8V I AVDD 17 GND GND GND 18 CAM_HSYNC_OUT O GND Horizontal Sync 19 CAM_VSYNC_OUT O Vertical Sync 20 CAM_PCLK O Pixel Clock (49.152M) 21 GND 22 GND GND CAM_DATA_OUT(0) O Data 23 CAM_DATA_OUT(1) O Data 24 CAM_DATA_OUT(2) O Data Table. Interface between MEGA Camera Module and MAIN PCB (in camera module) - 59 - 3. TECHNICAL BRIEF The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245. No Name Port 1 VREG_CAM_DVDD_1.8V I DVDD 2 CAM_MCLK I Master Clock(24.576M) 3 GND 4 CAM_PCLK O Clock for Camera Data Out(12.288M) 5 CAM_DATA(0) O Data 6 CAM_DATA(1) O Data 7 CAM_DATA(2) O Data 8 CAM_DATA(3) O Data 9 CAM_DATA(4) O Data 10 CAM_DATA(5) O Data 11 CAM_DATA(6) O Data 12 CAM_DATA(7) O Data 13 CAM_VSYNC O Vertical Sync 14 CAM_HSYNC O Horizontal Sync 15 GND 16 I2C_SDA I I2C Data 17 I2C_SCL I I2C Clock 18 VGA_CAM_RESET_N I Camera reset signal 19 VREG_AVDD_2.8V I Camera I/O Power 20 VREG_AVDD_2.8V I Camera I/O Power GND GN D Note GND GND Table. Interface between VGA Camera Module and MAIN PCB (in camera module) - 60 - 3. TECHNICAL BRIEF 3.11.6 Keypad Light There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from PM6650. KEY_BACK_LIGHT LED(8EA) +VPWR LD400 LEBB-S14H LD403 LEBB-S14H LD406 LEBB-S14H R411 100ohm R414 100ohm R417 LD404 LEBB-S14H LD407 LEBB-S14H 100ohm R418 R415 LD402 LEBB-S14H LD405 LEBB-S14H R413 100ohm LD408 LEBB-S14H R416 100ohm 100ohm 100ohm REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT Figure 1.22 Schematic of KEY back light circuit (KEY side) - 61 - R419 100ohm 3. TECHNICAL BRIEF 3.11.7. LCD Module (NM176CN1 : Tovis) - The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors. - LCD Driver IC: NT3916 (NOVATEK). - 16 bit CPU interface Parallel 3.11.8. Display & LCD FPC Interface LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD module is controlled by 16-bit EBI2 in MSM6245. LCD CONNECTOR CN400 ICVE21184E150R500FR G1 INOUT_A4 INOUT_B4 5 28 27 10 29 7 6 7 6 INOUT_B1 INOUT_A1 INOUT_B2 INOUT_A2 INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 G2 INOUT_A3 INOUT_B3 8 8 LCD_CS_N LCD_ADS EBI2_WE_N EBI2_OE_N FL401 26 9 7 6 24 3 4 FL400 INOUT_B1 INOUT_A1 INOUT_B2 INOUT_A2 INOUT_B3 INOUT_A3 INOUT_B4 INOUT_A4 G2 23 10 22 21 20 EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) 2 ICVE21184E150R500FR 8 25 1 G1 3 4 30 INOUT_A2 INOUT_B2 9 10 32 31 2 INOUT_A1 INOUT_B1 1 EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) 2 3 4 G1 33 1 5 34 G2 LCD_RESET_N LCD_IF_MODE_0 LCD_IF_MODE_1 LCD_VSYNC 5 9 ICVE21184E150R500FR 35 FL402 ICVE21184E150R500FR 19 1 17 2 16 3 15 4 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 13 12 EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11) 9 8 7 6 FL403 10 G1 14 INOUT_A1 G2 18 11 10 ICVE21184E150R500FR 9 1 2 6 3 5 4 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 3 2 10 G1 4 INOUT_A1 EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15) 9 8 7 6 G2 8 7 FL405 LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR - 62 - INSTPAR 0.1u C409 Figure 1.23 Interface between LCD Module and MAIN PCB. PLW0501H-LF D402 VA409 EVL14K02200 VA410 EVL14K02200 1 3. TECHNICAL BRIEF 3.11.8.1. Audio Signal Processing & Interface Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier. (+16.5dB) Figure 1.24 Audio Interface Detailed Diagram(MSM6245) - 63 - 3. TECHNICAL BRIEF 36 RCVRCV+ MSM6245 CODEC pins Near to MSM 47p C201 MIC2N MIC2P MIC1N MIC1P HPH_R HPH_L C200 47p 22n C210 MSM pin W18 (CODEC VSS) AE20 AA20 AF20 C211 AF21 AE19 AF19 AC20 AC19 AC21 AA19 AC22 AA18 T15 AF18 AE18 W17 AA17 AC17 Place near C212 0.1u 10% LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP AC18 22n C204 10p AF22 LINE_N LINE_P MICBIAS C203 C202 220n 220n R202 AUDIO F25 SDCC_DAT1_GPIO99 M25 SDCC_DAT2_GPIO100 M26 Figure 1.25 Audio part schematics I/O CONNECTOR 2.2K VREG_MSMP_2.7V MICBIAS R400 R401 R402 5.1K C400 0.1u R403 VREG_MSMP_2.7V CN401 HSEJ-18S04-25R 3 VIN+ VCC GND 2 U400 NCS2200SQ2T2G 10K R404 100K 1 OUT VIN- R405 HOOK_KEY 4 1M 51K 5 MIC2N MIC2P C401 HPH_L HPH_R C402 33u 33u R406 100ohm R407 100ohm USB_D+ USB_D- EAR_SENSE_N VBATT Figure 1.26 Audio part schematics - 64 - 21 19 1 2 3 4 5 6 7 8 9 3. TECHNICAL BRIEF AUDIO SELECT_SPK&RCV U401 NLAS5223BMNR2G 1 C410 0.01u 10 VCC NO2 NO1 COM2 2 SPK- 3 SPK_RCV- COM1 10 RCV_EN_N IN2 10 7 IN1 NC2 NC1 GND 5 R421 6 RCV+ EVL14K02200 EVL14K02200 VA414 R422 SPK_RCV+ 8 4 RCV- SPK+ 9 VA412 +VPWR REV_B MIC MICBIAS C417 47p C416 10u REV_B : SUMY0010301 --> SUMY0003802 R424 2.2K MIC400 OB4-15L42-C33L 39p 39p 2.2K C420 C421 R425 INSTPAR C418 0.1u C419 0.1u D404 INSTPAR PSD05-LF D403 PSD05-LF 1 2 REV_B : EDTY0008606 --> EDTY0008601 Figure 1.27 Audio part schematics - 65 - MIC1P MIC1N 3. TECHNICAL BRIEF Audio AMP NCP2890DMR2 C422 C423 C4275600p 1K 1K C4265600p LINE_N LINE_P R427 R429 0.1u 0.1u R428 5.6K 2 20K _SD OUTB BYPASSU402 3 INP 4 INM R430 5.6K 8 SPK- 7 VM 6 VP OUTA +VPWR 5 SPK+ C428 1u R431 20K C425 10u C431 NA 1000p 1000p REV_C : 20K --> 3K R426 L401 100nH RCVN L402 100nH RCVP SPK_RCVSPK_RCV+ REV_E : For Antenna Radiation Audio part schematics - 66 - C429 C430 1 SPK_AMP_EN 3. TECHNICAL BRIEF 3.11.8.2. Audio Mode There are three audio modes (Voice call, speaker phone, MIDI/MP3). MODE Voice Call Speaker phone Device Description Receiver Mode Receiver Voice Call Loud Mode Speaker Phone Headset Headset Voice Call Loud Mode Speaker Phone Loud Mode Speaker MIDI Bell Headset Headset MIDI Bell Loud Mode Speaker MP3 Headset Headset MP3 MIDI MP3 Table. Audio Mode Audio & Sound Main Component There are 6 main components in U250/KU250. Component Design No. Maker Part No. Note 1 MSM6245 U201 MSM6245 Base-Band Modem 2 Audio amp U402 NCP2890DMR2 1W Audio Amp 3 Analog Switch U401 NLAS5223BMNR2G Dual Analog Switch 4 Speaker/Receiver EMS1810TP Speaker/Receiver 5 MIC OB4-15L42-C33L -42 dB microphone 6 Ear jack RMBLGG080STSB Ear jack MIC400 Table. Audio main component list - 67 - 3. TECHNICAL BRIEF 3.12 Main Features 1. LG-U250/KU250 Main features - Bar Type - WCDMA(2100) + GSM Tri-Band (900/1800/1900) - Color LCD (Main:262K TFT, 1.76”) - Dual Camera (1.3Mega + VGA(0.3M)) - 1810 speaker/receiver - Stereo Headset - Speaker phone (in GSM and WCDMA) - MP3/AAC decoder and play - MPEG4 encoder/decoder and play/save - JPEG en/decoder - Supports Bluetooth, USB - 950 mAh (Li-Ion) - 68 - 3. TECHNICAL BRIEF 2. U250/KU250 Main Component Logic /Audio RF Bluetoot h Logic Main board (Bottom) Main board (Top) - 69 - 3. TECHNICAL BRIEF RF SW100 U101 U500 FL101 U100 FL104 U103 X100 Reference Description Reference Description SW100 Ant. Switch module FL104 W2100 Duplex U500 Front End module U103 WCDMA PAM U101 GSM PAM X100 VCTCXO FL101 GSM SAW U100 RTR6275 BT module - 70 - 3. TECHNICAL BRIEF Logic / Audio BAT300 U303 CN403 CN401 U402 Reference Description Reference Description BAT300 Backup Battery CN401 MMI connector (18pin) U303 1.3M Cam. LDO CN403 1.3M Cam. Connector U402 Audio AMP - 71 - 3. TECHNICAL BRIEF Logic CN400 U300 U201 U301 J300 S300 Reference Description Reference Description U201 MSM6245_A U300 PMIC U301 Memory MCP J300 U-SIM socket CN400 Main To LCD Connector S300 T-FLASH socket - 72 - 4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component LGMC - 73 - 4. TROUBLE SHOOTING Block Diagram Block Ref. Name Part Name Function UMTS - 74 - Comment 4. TROUBLE SHOOTING 4.2 SIGNAL PATH_UMTS RF Common Tx/Rx UMTX 2100 Tx/Rx UMTX 2100 Tx UMTX 2100 Rx Tx I/Q LO RX I/Q - 75 - 4. TROUBLE SHOOTING 4.3 SIGNAL PATH_GSM RF Common Tx/Rx GSM900 Tx DCS/PCS Tx EGSM900 RX PCS Rx DCS RX Tx I/Q LO RX I/Q - 76 - 4. TROUBLE SHOOTING 4.4 Checking VC-TCXO Block The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and BB part. TCXO X100 DSA321SCE-19.2M NC3 7 NC4 8 NC2 NC1 6 5 VREG_TCXO_2.85V 3 OUTPUT GND 2 100ohm VCONT 1 TRK_LO_ADJ 0.01u 0.1u C182 1000p 19.2MHz C181 R124 VREG_BT_2.85V 4 VCC C183 TP1 TP4 R128 C185 100K 100p C186 TCXO_PM 1000p VCC C187 1000p TP2 C188 5 0.01u 2 RTR6275_TCXO U104 TC7SH04FU 4 3 GND TP3 Schematic of the VC-TCXO Block TP3 TP4 TP2 TP1 Test Point of the VC-TCXO Block - 77 - TCXO_BT 4. TROUBLE SHOOTING T Check C312 of PMIC (U300) Check R213 of MSM (U201) - 78 - 4. TROUBLE SHOOTING 4.5 Checking Front-End Module Block TP1 11 19 15nH C117 10p Rev.B 7 8 10 12 13 15 17 20 21 23 VDD GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 ANT VREG_RF_SMPS Rev.C U500 Rev.D L108 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 D5011 5 6 1 2 3 4 9 16 GSM900_TX 14 GSM18001900_TX Schematic of the Front-End Module Block TP1 ANT_SEL0 ANT_SEL1 Test Point of the Front-End Module Block - 79 - 1K 1K 18 CTRL1 22 CTRL2 C110 33p C109 33p R100 R101 ANT_SEL0 ANT_SEL1 4. TROUBLE SHOOTING Logic Table of the FEM GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX TP1 VREG RF SMPS - 80 - 4. TROUBLE SHOOTING 4.6 Checking UMTS Block 4.6.1 Checking Tx level TP1 TP2 TP3 TP4 ANT101 ANT102 TP1 C450 22p 1p C437 C101 56p SW100 ANT G2 G1 KMS-507 C102 NA L101 NA RF L102 100nH TP2 U500 11 Rev.D WCDMA Rev_1.0 C154 1.5p Rev.D +VPWR 9 L123 1nH Rev_1.0 C162 8 GND4 RFOUT L122 NA C157 10nH RFIN GND1 IN 3 U103 VCC1 FL102 5 EFCH1950TDF1 O1 G3 1 G2 G1 2 1 2 3 2 3.3p 7 GND3 6 GND2 11 BGND VCONT VREF 4 PA_R0 5 TP4 1 TR100 KRX102U 5 2 U102 PA_ON 3 20dB C165 1p VREG_TCXO_2.85V CP0402A1950DNTR Rev.B 4 OUT 50OHM 4 51R119 C164 0.5p IN 1 ACMD-7602 1 2 COUP RX TX 3 PGND ANT 4 C159 15p C158 15p WS2512_TR1G 10 VCC2 FL104 4 3 0.5p L125 +VPWR C155 4.7u TP3 L404 1.8nH PWR_DET R121 130 R120 47 C192 100p R122 130 7dB For testing, Max power of UMT 2100 is needed. - 81 - C170 0.1u 4. TROUBLE SHOOTING - 82 - 4. TROUBLE SHOOTING 4.6.2 Checking UMTS PAM Control Block • PAM control signal 1. PWR_DET : UMTS Tx Power Detected value (Check R120) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V) 4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V) 5. PA_ON : Turns the PA on and off 6. PA_R0 : Control signals that step the active PA mode and bias VREG_TCXO_2.85 +VPWR PWR_DET - 83 - 4. TROUBLE SHOOTING 4.6.3 Checking RF Rx Level TP1 TP2 TP4 Vbias TP3 ANT101 ANT102 TP1 C450 22p 1p C437 C101 56p SW100 ANT G2 G1 KMS-507 C102 NA L101 NA RF L102 100nH R U500 D Vbias TP2 TP4 WCDMA Rev_1.0 +VPWR +VPWR C155 4.7u L404 1.8nH C158 15p 9 L123 1nH Rev_1.0 C162 8 GND4 RFOUT C157 10nH L122 NA RFIN O1 G3 IN L121 1nH 1 G2 G1 3 U103 VCC1 GND1 C156 100p FL102 5 EFCH1950TDF1 2 Rev.D 1 2 Rev.D L409 4.7nH C161 C444 2.2p 2.2p 3 C164 0.5p IN C165 1p 7 GND3 6 GND2 11 BGND VCONT VREF 4 PA_R0 5 VREG_TCXO_2.85V PWR_DET C192 100p R122 130 C170 0.1u 7dB L128 1.8nH C174 10p Rev.D L407 2.7nH - 84 - IN 4 G2 O2 FL103 G1 O1 EFCH2140TDE1 2 1 3 Rev.B 4 51R119 PA_ON CP0402A1950DNTR R120 47 1 L408 10nH U102 R121 130 5 TP3 TR100 KRX102U 5 20dB 2 4 50OHM OUT 2 3.3p 1 ACMD-7602 1 2 COUP RX TX 3 PGND ANT 4 C159 15p WS2512_TR1G 10 VCC2 FL104 4 3 0.5p L125 VDD_RX C154 1.5p Rev.D L411 4.7nH 3 L410 4.7nH C445 2.2p 4. TROUBLE SHOOTING - 85 - 4. TROUBLE SHOOTING 4.7 Checking GSM Block 1 2 - 86 - 3 4. TROUBLE SHOOTING 4.7.1 Checking RF Tx level TP1 TP3 TP2 4.7.2 Schematic of RF Tx level C101 56p SW100 ANT G1 RF KMS-507 C102 NA L102 100nH 11 1K 1K 18 CTRL1 22 CTRL2 C110 33p Rev.D L116 10nH C138 NA 15 TP2 11 19 TP3 21 VBATT DCS_PCS_OUT EGSM_OUT DCS_PCS_IN U101 RSVD_GND P_GND 2 C139 68p 20 C137 NA C134 0.01u C438 100p 6 C441 5.6p R107 100ohm L115 18nH C121 33u C123 0.01u VCC1A L403 1.5nH VCC1B C124 100p ANT_SEL0 ANT_SEL1 C109 33p GSM_PA_RAMP 16 GSM900_TX 14 GSM18001900_TX R100 R101 17 D5011 5 6 1 2 3 4 9 VAPC GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 EGSM_IN ENABLE SKY77318 GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1 7 8 10 12 13 15 17 20 21 23 VDD 16 14 13 12 10 9 8 7 5 19 15nH C117 10p Rev.C U500 Rev.D L108 ANT TP1 G2 - 87 - BS 3 4 18 1 4. TROUBLE SHOOTING 4.7.3 Checking RF Tx level - 88 - 4. TROUBLE SHOOTING 4.7.4 Checking PAM Block TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3. GSM_PA_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V) TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V TP1 TP4 TP2 TP3 GSM_PA_RAMP TP4 Rev.D L116 10nH TP1 C134 0.01u C438 100p C138 NA C121 33u C123 0.01u R107 100ohm C136 0.01u 19 21 EGSM_OUT 2 6 DCS_PCS_OUT DCS_PCS_IN U101 EGSM_IN ENABLE RSVD_GND P_GND TP3 FL1 SKY77318 BS GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1 15 11 VCC1A 17 VAPC VBATT 20 C139 68p VCC1B L403 1.5nH 16 14 13 12 10 9 8 7 5 4 p EGSM +VPWR 3 4 R113 18 100ohm EFC R117 100ohm GSM_PA_BAND C153 15p TP2 Schematic of GSM PAM Block - 89 - GSM_PA_EN C149 15p 1 4. TROUBLE SHOOTING 4.7.5 Checking RF Rx Block TP1. DCS RX INPUT TP1 TP3 TP2. PCS RX INPUT TP3. GSM RX INPUT TP2 L102 100nH Rev.C Rev.C C439 5p C440 5p 7 8 10 12 13 15 17 20 21 23 VDD GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 5 6 1 2 3 4 9 TP1 DCS C105 NA 0.5p C190 C442 5.6p D5011 1K 1K 18 CTRL1 22 CTRL2 R100 R101 ANT_SEL0 ANT_SEL1 TP2 16 GSM900_TX 14 GSM18001900_TX C110 33p PCS C116 NA C109 33p C443 5.6p L405 Rev.D C124 100p L115 18nH L403 1.5nH L116 10nH GSM_PA_RAMP 19 ANT 11 U500 TP3 +VPWR C123 0.01u EGSM C121 33u Schematic of GSM900/DCS/PCS Rx Block - 90 - 2.7nH C120 NA L406 NA C191 L111 5.6nH 2.7nH 4. TROUBLE SHOOTING - 91 - 4. TROUBLE SHOOTING 4.8 Checking Bluetooth Block Test Point of the Bluetooth Block TP2 TP1. VREG_BT_2.85V TP2. VREG_MSMP_2.7V TP1 TP3. TCXO_BT TP3 TP4. BT ANT Output TP4 Test Point of the Bluetooth Block TP4 BLUETOOTH ACS2450HBAXX NC1 R118 FEED M100 9 C172 1u 3 C173 2.2u 2 R123 10 VREG_MSMP_2.7V 0 0.1uF 2.2u 100p C177 C180 C178 VCC_OUT VDD_INT 4 SBST 11 SBCK 12 SBDT SYNC_DET_TX_EN VDD_MSM RX_BB_TX_BB VDD_BAT XTAL_IN PGND4 20 PGND3 19 PGND2 18 PGND1 17 100p 14 C179 VREG_BT_2.85V CLK_REF ANT 1000p BT_SBST BT_SBCK BT_SBDT 5 BT_TX_RX_N 13 BT_DATA 7 1000p TCXO_BT C176 GND4 15 GND3 8 GND2 6 GND1 1 C171 BT_CLK 16 LBRQ-2B43A NC2 ANT103 NA TP2 0 C169 L126 NA TP3 TP1 Schematic of the Bluetooth Block - 92 - 4. TROUBLE SHOOTING Start TP1,TP2 Signals exits? NO Change the Main board YES TP3 Is clock ok? 19.2M NO Change the X100 YES NO TP4 Signals exits? Change the M100 YES Change the Main board - 93 - 4. TROUBLE SHOOTING 4.9 Power ON Troubleshooting Power On sequence of U250/KU250 is : PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up → VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V, VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and PS_HOLD assert to PMIC Start NO Change or charging the Battery voltage. higher than 3.20V? Battery YES NO Check the Key Dome Key press? YES NO VREG_MSMC_1.2V,VREG_MSMP_2.7V, VREG_MSME_1.8V, VREG_TCXO_2.85V, VREG_MSMA_2.6V power up? YES Change the Main board NO Is clock ok? R306 : 19.2M X300 : 32.768Khz Check the TXCO YES Change the Main board - 94 - 4. TROUBLE SHOOTING VREG_MSMC VREG_MSME VREG_MSMP X300 : 32.768Khz VREG_MSMA [U250/KU250 Main PCB BOTTOM] - 95 - R306 : 19.2Mhz 4. TROUBLE SHOOTING 4.10 Charger Troubleshooting CHARGER ICHARGEOUT SI3493DV-E3 Q301 R313 USB_VBUS 0.1 6 5 4 Q300 QST4 D3 D4 +VPWR C1 1 3 B C2 2 USB_CTL_N G D1 D2 S VBATT +5V_PWR BATT_FET_N 6 5 4 Q302 QST4 C1 1 C2 3 B 2 CHG_CTL_N ICHARGE Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT Charging Procedure - Connect TA or USB Cable - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone Check Point - Connection of TA or USB Cable - Charging current path - Battery Troubleshooting Procedure - Check the charger (TA or USB Cable) connector - Check the charging current Path - Check the battery - 96 - 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector NO Connection OK? Change I/O connector Yes NO Change TA (or USB Cable) Is the TA (or USB Cable) voltage 5.1V (or 5.0V)? Yes Is it charging properly After turning on Q301(or Q302) , Q302? Yes END NO Change the board [ Charger Troubleshooting Flow ] - 97 - 4. TROUBLE SHOOTING Q302 Q300 R313 Q301 [ Charging part ( Main PCB Front ) ] - 98 - 4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.11 USB Troubleshooting USB Initial sequence of U250/KU250 is : USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V → USB_DAT is triggered → USB work. Start Power is on? NO Go to power on trouble shooting YES Cable is inserted? NO Insert cable YES Q400 pin 4 is 5V? NO Check Q300 (pin 4) YES USB_D+ is 3.3V? NO Check VA401 YES Change the Main board - 99 - 4. TROUBLE SHOOTING 4.12 SIM Detect Troubleshooting USIM Initial sequence of U250/KU250 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work Start Re-insert the SIM card Work well? Yes End No VREG_UIM_2.85V is 2.85V? USIM_P_CLK is run? NO Check J300 YES Change SIM card Yes Work well? No Change the Main board - 100 - End 4. TROUBLE SHOOTING 2 R317 2 USIM_P_RST_N 3 USIM_P_CLK 7 USIM_P_DATA J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12 VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK Figure. USIM part schematics - 101 - EVLC18S02003 VA302 smd_1005h_5_r L302 56nH C353 GND3 GND4 33p EVLC18S02003 VA300 USIM_P_DATA VREG_USIM_2.85V 15K 0.1u 5 6 7 8 9 10 1 EVL14K02200 VA301 USIM 1 C352 3 5 6 smd_1005h_5_r 7 4. TROUBLE SHOOTING 4.13 Camera Troubleshooting Camera control signals are generated by MSM6245. 4.13.1 MEGA CAMERA Start Check the camera connector and reconnect the camera Yes Camera is OK? NO END NO Change the Main board Yes NO Check the CAM_MCLK Change the Main board Yes Change the camera Yes Camera is OK END NO Change the Main board - 102 - 4. TROUBLE SHOOTING 4.13.2 VGA CAMERA Start Check the camera connector and reconnect the camera Yes Camera is OK? NO END NO Change the Main board Yes NO Change the Main board Check the CAM_MCLK Yes Change the camera Yes Camera is OK END NO Change the Main board - 103 - 4. TROUBLE SHOOTING C350 C447 C347 U501 C348 U303 C349 CAMERA LDO +VPWR CAM_LDO_EN C447 1u PGND C347 1u U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND 9 +VPWR CAM_LDO_EN VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV REV_D - 104 - VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C348 1u C349 1u VREG_CAM_DVDD_1.5V C350 1u 4. TROUBLE SHOOTING 4.14 Keypad Backlight Troubleshooting Key Pad Back Light is on as below : Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On Start Key press NO Check battery +VPWR is above 3.2V? Yes Yes NO KYBD_BACKLIGHT is 0V ? Change the Main board Yes YES END Backlight LED ON? No Change the Main board +VPWR KEY_BACK_LIGHT LED(8EA) +VPWR LD400 LEBB-S14H LD403 LEBB-S14H LD406 LEBB-S14H R411 100ohm R414 100ohm R417 LD404 LEBB-S14H LD407 LEBB-S14H 100ohm R418 100ohm R415 LD402 LEBB-S14H LD405 LEBB-S14H R413 100ohm LD408 LEBB-S14H R416 100ohm 100ohm REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT Figure.Keypad backlight LED part - 105 - R419 100ohm 4. TROUBLE SHOOTING 4.15 Main LCD Troubleshooting Main LCD control signals are generated by MSM6245. The signal path is : MSM6245 → CN400 → LCD Module Start Press END key Key LED is on? NO GO to power on trouble shooting Yes Disconnect and reconnect The LCD connector LCD display OK? Yes END No Change the LCD module LCD display OK? Yes END No Change the Main board - 106 - 4. TROUBLE SHOOTING 4.16 Receiver Path MSM6245 EAR1ON/EAR1OP → R421,R422 → Analog Switch(U401) → Receiver Start Connect the phone to network Equipment and setup call Setup 1KHz tone out YES Can you hear the tone? END NO The sine wave appears at L401, L402? YES Change receiver NO The sine wave appears at R421, R422? YES Check the analog switch NO Change the Main board - 107 - 4. TROUBLE SHOOTING R421 R422 U401 - 108 - 4. TROUBLE SHOOTING 4.17 Headset path MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector) Start Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset. YES END Can you hear the tone? NO YES Sine wave appears at R407/R406? Change the Headset NO Change the Main board - 109 - 4. TROUBLE SHOOTING CN401 R406 C401 C402 C407 - 110 - 4. TROUBLE SHOOTING 4.18 Speaker phone path MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog Switch(U401) → Speaker Start Connect the phone to network equipment and setup call Setup 1KHz tone out YES END Can you hear the tone? NO Sine wave appears at NO Change the Main board R429/R427 and C423/C422 And R431/R426 ? YES SPK_AMP_EN is2.6V? NO Change the Main board YES The sine wave appears at SPK+, SPK- ? NO Change the Audio Amp YES The sine wave appears at SPK_RCV-,SPK_RCV+? YES Change speaker NO Change the Main board - 111 - 4. TROUBLE SHOOTING Analog Switch SPK+ Audio Amp - 112 - 4. TROUBLE SHOOTING 4.19 Main microphone MIC400 → MIC1P, MIC1N (MSM6245) Start Make a call MIC_BIAS(C416) is 1.8V NO Change main board YES Make sound to MIC Sine wave appears at C418/C419? NO Change the MIC YES Change the Main board YES NO Work well? - 113 - END 4. TROUBLE SHOOTING R424 C417 MIC400 - 114 - 4. TROUBLE SHOOTING 4.20 Headset microphone Headset → C210/C211 → MIC2P, MIC2N (MSM6245) Start Make a call OK Change the headset and retry END NO YES NO Change the MAIN board HOOK_KEY is detected? Yes NO MICBIAS is biased by 1.8V? Change the MAIN board Yes NO Sine wave appears at C210/C211 ? Yes Change the Main board - 115 - Change the headset or Main board and retry. 4. TROUBLE SHOOTING Ear_Sense_N MIC Input - 116 - 4. TROUBLE SHOOTING 4.21 Vibrator The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin). The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR. Start Operate the Vibrator Yes Work well? End NO Change vibrator or PM6650 +VPWR TP400 TP401 L400 56nH MOTOR_PWRD400 RB521S-30 - 117 - 4. TROUBLE SHOOTING MOTOR_PWR- +VPWR - 118 - 5. DOWNLOAD 5. DOWNLOAD 5.1 U250/KU250 DOWNLOAD 5.1.1 Introduction LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 9 handsets at the same time. 5.1.2 Downloading Procedure • Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select Preferences. ➢ Play a success sound It will be played a .wav file when the download has been completed. To enable this simply check the box. ➢ Always on Top Check if LGMDP always appears at the top of the window so that user can monitor it all the time. ➢ Automatically run Select Port When LGMDP starts When LGMDP starts, it will automatically select Select Port button to download new image file. - 119 - 5. DOWNLOAD 5.1.2.1 Connecting to PC • Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.) • The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. U250/KU250 - 120 - 5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse… button to select image files to be downloaded on the handset. 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the NV data and restore the backed up NV data automatically. U250/KU250 1) U250/KU250 U250/KU250 U250/KU250 2) U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 3) 5) U250/KU250 U250/KU250 U250/KU250 U250/KU250 4) 6) 7) 4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option. Erase_EFS: The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out. Keep All Contents Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected. 5) Additional Options: Display Information is defaultly not selected and user cannot choose. Override partition table is also also defaultly not selected and user cannot choose. 6) Clear: Clearing all directory paths of images in the dialog. 7) Start: Starting downloading the selected individual image. - 121 - 5. DOWNLOAD 5.1.2.2 Choosing image files • Select the image folder, where all the image files are located, by clicking on the Browse…. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 - 122 - 5. DOWNLOAD • Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work. (The file name shall be different from that of the file name in the snapshot.) U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 - 123 - 5. DOWNLOAD • If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse… button. U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 • Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options. Yes No - 124 - 5. DOWNLOAD 5.1.2.3 Downloading • This message box informs that a new file for NV backup will be created in the displayed NV_U250/KU250 file name in the LGMDP installation directory. • Backing up NV data and backed up NV data U250/KU250 will be stored in the LGMDP installation directory. • Erasing the existing directories and files U250/KU250 before the Module image is downloaded. • Downloading the AMSS modem image U250/KU250 - 125 - 5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the U250/KU250 Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection • Erasing the existing directories and files U250/KU250 before downloading the selected Media image - 126 - 5. DOWNLOAD • Downloading Media image in progress U250/KU250 • Downloading Module image in progress U250/KU250 • Downloading process has completed U250/KU250 successfully - 127 - 5. DOWNLOAD 5.1.2.4 Tools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. - 128 - 5. DOWNLOAD 5.1.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.1.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image. The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS modem, Media, and Module images can not be running in this mode.) - 129 - 5. DOWNLOAD • The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the Connect button to continue. U250/KU250 • Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode. U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 - 130 - 5. DOWNLOAD 5.1.3.2 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. U250/KU250 • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) U250/KU250 U250/KU250 - 131 - 5. DOWNLOAD • Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start. U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 - 132 - 5. DOWNLOAD 5.1.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format. D:\LGMDP\004400-01-429926\_COM14_ LGMDP folder name IMEI number Port number 4) Recommended that the Module and Media Image have to be downloaded at the same time. 5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area. - 133 - 6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & UMTS RF Block [Fig 2.1] U250/KU250 RF Functional Block Diagram - 134 - 6. BLOCK DIAGRAM [Table 2.1] RF Block Component - 135 - 6. BLOCK DIAGRAM 6.2 Interface Diagram 6.2.1 RTR6275 & MSM6245 Interface Diagram [Fig 2.2] RTR6275 & MSM6245 Interface Diagram - 136 - 6. BLOCK DIAGRAM 6.2.2 Memory Interface ADDRESS[14:0] [Fig 2.3] Memory Interface Diagram - 137 - 6. BLOCK DIAGRAM 6.2.3 USB,UART,SIM,JTAG Interface [Fig 2.4] USB, UART, SIM, JTAG Interface - 138 - 6. BLOCK DIAGRAM Main RF signal Control signal Control signal Description Comment UMTS PA_CTL signal PA_R0 UMTS Tx High/Low Power Control GSM PA_CTL signal GSM_PA_BAND DCS or PCS /GSM Mode Selection GSM_PA_EN Power Amp Gain Control Enable GSM_PA_RAMP Power Amp Gain Control UMTS, ANT_SEL 0,1 Ant Switch Module Mode Selection GSM900Tx/Rx, DCS Tx/Rx, PCS Tx/Rx - 139 - 6. BLOCK DIAGRAM 6.2.4 Placement *Top Side LGMC - 140 - 6. BLOCK DIAGRAM *Bottom Side LGMC - 141 - - 142 - 7. CIRCUIT DIAGRAM 1 3 2 4 5 14 ANT_SEL0 ANT101 ANT102 C450 22p G1 HIGH LOW GSM 850/GSM 900 TX/ WCDMA LOW HIGH LOW GSM 1800/GSM 1900 TX HIGH HIGH A RF KMS-507 C102 NA L101 NA G2 LOW GSM 850/ GSM 900 RX L102 100nH TX_IP C103 180p Rev.C Rev.C U500 5p Rev.C 5 6 1 2 3 4 9 C105 NA DCS 0.5p C190 C106 5p C440 DCS_PCS_TX GSM_TX 55 8.2p C107 6p C112 12p 51 TX_IP 50 TX_IN 53 TX_QP 52 TX_QN 43 LB_RF_OUT1 42 LB_RF_OUT2 B C113 180p TX_QM C118 12p 14 BS C128 C129 C130 C131 C132 22p 0.1u 22p 0.1u 22p C126 C127 22p 0.1u C Rev.B Rev.D VREG_RF_SMPS 2.7 5.1 L114 C122 22u 47nH C189 22p Rev.C L119 VREG_SYNTH_2.6V 47nH D VDD_RX C135 0.1u R109 10 R112 GSM_PA_EN C149 15p 1 3 2 EFCH897MTDB1 39 C144 22u 100ohm GSM_TX VREG_RF_SMPS 47nH C143 0.1u 5 R115 R113 18 C147 7.5dB 4 O1 G3 1 IN G2 G1 4 100ohm SKY77318 2.7 R434 R106 C141 29 91 R111 91 R110 WLNA_IN R433 C142 26 PWR_DET 5.1 R105 4 6 8 9 15 16 19 20 28 41 45 47 48 49 VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 L120 3 Rev.D R116 VREG_MSMP_2.7V E 100ohm R117 100ohm GSM_PA_BAND 16 14 13 12 10 9 8 7 5 E DCS_PCS_TX 2 EGSM_IN ENABLE RSVD_GND P_GND R108 R114 VBATT U101 RX_QP RX_QM FL101 DCS_PCS_IN GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1 21 6 20 19 DCS_PCS_OUT EGSM_OUT 22 CAL_INP 23 CAL_INN 8.86dB Rev.1.0 51 VAPC 11 2.7nH C136 0.01u RX_IP RX_IM 10 RX_QP 11 RX_QN 40 PWD_DET_IN 21 TEST 31 GCELL_INP 30 GCELL_INN 32 EGSM_INP 33 EGSM_INN C134 0.01u C139 68p 15 22p 36 GPCS_INP 37 GPCS_INN C438 100p C138 NA C137 NA D L406 RTR6275 38 DCS_INP 39 DCS_INN VCC1A C441 5.6p C119 R107 100ohm L116 10nH VCC1B L403 1.5nH 17 C124 100p L115 18nH EGSM +VPWR C121 33u C123 0.01u U100 SBDT 3 R_BIAS1 27 R_BIAS2 12 RX_IP 13 RX_IN R104 680 (1%) SSBDT_RTR L111 5.6nH 100ohm Rev.D 2.7nH 3300p C114 1000p C115 VTUNE-Connected directly to GND DAC_REF 100p GSM_PA_RAMP L405 C120 NA RTR6275_TCXO 5 VTUNE1 18 VTUNE2 VCONTROL C140 C443 5.6p C109 33p 54 DAC_REF 7 TCXO RF_ON VDDM C110 33p 56 TX_AGC_ADJ NA C191 17 16 GSM900_TX 14 GSM18001900_TX 24 TX_ON C116 NA PCS 22p ANT_SEL0 ANT_SEL1 22p R100 R101 22p 1K 1K 18 CTRL1 22 CTRL2 D5011 C GSM_PA_BAND C153 15p C150 1000p MODE LOW C152 0.01u C151 22p Rev.D GSM DCS/PCS HIGH GSM/EDGE WCDMA Rev_1.0 VDD_RX C154 1.5p Rev.D +VPWR +VPWR F C155 4.7u L404 1.8nH C158 15p FL104 GND4 RFOUT L122 NA O1 G3 C157 10nH IN VCC1 RFIN L121 1nH F 1 G2 G1 3 U103 GND1 C156 100p FL102 5 EFCH1950TDF1 2 Rev.D 1 2 Rev.D L409 4.7nH C161 C444 2.2p 2.2p 3 VCONT VREF 4 PA_R0 5 5 1 IN 1 U102 PA_ON CP0402A1950DNTR BLUETOOTH L411 4.7nH ACS2450HBAXX 3 L410 4.7nH C445 2.2p FEED M100 7dB C171 1000p 9 C172 1u 3 C173 2.2u 2 BT_CLK L128 1.8nH D C174 10p R123 10 VREG_MSMP_2.7V 0 NC3 7 NC4 8 NC2 NC1 2.2u 100p C178 100p 0.1uF C179 L407 2.7nH TCXO X100 DSA321SCE-19.2M C177 VREG_BT_2.85V 14 C180 Rev.D CLK_REF 4 SBST 11 SBCK 12 SBDT VCC_OUT VDD_INT NC2 ANT103 16 LBRQ-2B43A C170 0.1u C192 100p R122 130 ANT R120 47 0 SYNC_DET_TX_EN VDD_MSM RX_BB_TX_BB VDD_BAT XTAL_IN BT_SBST BT_SBCK BT_SBDT 5 BT_TX_RX_N D 13 BT_DATA 7 1000p C176 TCXO_BT GND4 15 GND3 8 GND2 6 GND1 1 3 VREG_TCXO_2.85V PWR_DET R121 130 C NC1 R118 L126 NA Rev.B 4 51R119 L408 10nH 4 G2 O2 FL103 G1 O1 EFCH2140TDE1 2 2 20dB TR100 KRX102U PGND4 20 PGND3 19 PGND2 18 PGND1 17 2 7 GND3 6 GND2 11 BGND C165 1p 5 50OHM C164 0.5p IN 1 3.3p 4 C Rev_1.0 8 OUT 0.5p L125 9 L123 1nH C162 COUP ACMD-7602 1 2 3 RX TX 4 C159 15p WS2512_TR1G 10 VCC2 PGND ANT TX_QP C108 180p C442 5.6p R103 12K (1%) 4 3 2 ENV_LNP 1 ENV_LNN ENV_OUT 46 HB_RF_OUT1 44 HB_RF_OUT2 25 GND 57 PGND GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 TX_IM GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 WLNA_OUT 7 8 10 12 13 15 17 20 21 23 VDD 34 WMIX_INP 35 WMIX_INN Rev.B B ANT 19 15nH C117 10p C439 11 Rev.D L108 VREG_RF_SMPS C104 180p NA 1p C437 C101 56p SW100 ANT ANT_SEL1 GSM 1800/GSM 1900 RX C169 A 16 15 6 5 VREG_TCXO_2.85V 3 OUTPUT GND 2 100ohm VCONT 1 R128 C185 R124 TRK_LO_ADJ E 0.01u C182 1000p 0.1u C181 19.2MHz VREG_BT_2.85V VCC C183 4 E Date Sign & Name Designer MAR. 07. 2007 KANG. H. S Sheet/ MODEL KU250 U250/KU250 Sheets 1/4 100K C186 100p TCXO_PM 1000p VCC C187 Section C188 1000p 5 0.01u 2 RTR6275_TCXO U104 F TC7SH04FU 4 Checked TCXO_BT RF DRAWING 3 GND Approved LG Electronics Inc. 1 2 4 5 6 7 8 DRAWING REV_1.2 NO. 9 LG Electronics Inc. LG(42)-A-5505-10:01 LGMC - 143 - 7. CIRCUIT DIAGRAM 1 2 3 4 6 5 7 8 10 9 12 11 13 14 16 15 RCVRCV+ HPH_R HPH_L MIC2N MIC2P MIC1N MIC1P MICBIAS BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20 2200p cap => place between D12(VDDA1) and F12(DAC_REF) H11 D5 J21 C231 2200p CAM_MCLK LCD_IF_MODE_0 A6 N19 W15 C232 1000p VGA_CAM_RESET_N AA15 AE13 LCD_LDO_EN LCD_RESET_N HOOK_KEY H9 B6 F8 C233 1000p C234 1000p C235 1000p C236 0.01u C237 1000p C239 1000p C238 1000p DAC_REF C242 0.1uF C240 0.1uF D Near to B18 (VDD_PLL) GPIOs VREG_MSMA_2.6V AA1 Y6 R211 L25 0 H6 C243 0.1u AF6 W23 AF11 RF AF23 AF24 TX_ON B4 T23 ANT_SEL1 ANT_SEL0 T19 D11 AF17 AA16 AE24 AA26 AE23 U26 Y26 U25 P23 B21 B18 A3 B15 B9 D12 (VDD_DAC_REF) VDD_PLL VDD_MDDI VDD_PAD4_0 K25 AE15 AE11 R25 VDD_PAD3_0 VDD_PAD3_1 VDD_PAD3_2 VDD_PAD3_3 R2 U2 M2 K2 F2 B5 B11 AE6 VDD_PAD2_0 VDD_PAD2_1 VDD_PAD2_2 VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 H1 W1 AC1 AF8 AF16 T26 G26 D26 A24 A14 A11 A5 AC23 VSS39 VSS41 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50 AA21 MSM6280 Reference Rev.B : AA21 -> NC AC23: VSS_DIG AA6 AC4 AE1 AE2 AE25 AE26 AF1 AF2 AF25 AF26 C W19 AC26 AD25 T16 W8 AC16 SPK_AMP_EN w18 (Analog VSS guard ring for CODEC) T11 AB26 R15 W18 W26 H16 R14 W16 A17 R13 V26 D15 P15 F15 C1 F NC P14 U19 P13 D16 N15 P12 H15 D19 P26 N14 PA_R0 N13 D13 VSSA1 VSSA2 VSSA3 VSSA4 VSSA5 VSSA6 VSSA7 VSSA8 VSSA9 VSSA10 VSSA11 VSSA12 VSSA13 VSSA14 VSSA15 VSSA16 N12 A21 U201-2 MSM6245_B M15 AC25 VSS_PAD3_0 VSS_PAD3_1 A15 VSS_PAD3_2 A9 VSS_PAD3_3 C26 E VSS_DIG_0 VSS_DIG_1 VSS_DIG_2 VSS_DIG_3 VSS_DIG_4 VSS_DIG_5 VSS_DIG_6 VSS_DIG_7 VSS_DIG_8 VSS_DIG_9 VSS_DIG_10 VSS_DIG_11 VSS_DIG_12 VSS_DIG B17 M14 AB25 RESERVED R26 RX_QM RX_QP RX_IM RX_IP Y25 C244 0.01u 10% (PLLOUT_TEST) VSS_PAD2_0 VSS_PAD2_1 VSS_PAD2_2 M13 AA25 AF15 M11 V23 V25 W25 VDD_PAD1_0 VDD_PAD1_1 VDD_PAD1_2 VDD_PAD1_3 VDD_PAD1_4 VSS_PAD1_0 VSS_PAD1_1 VSS_PAD1_2 VSS_PAD1_3 U1 VSS_PAD1_4 R1 M12 F12 F1 K1 M1 L11 L16 B13 K10 A13 H19 TX_QM TX_QP TX_IM TX_IP DAC_REF B12 TX_AGC_ADJ TRK_LO_ADJ H8 A12 R213 F6 2K TCXO_EN PA_ON B14 LCD_IF_MODE_1 B24 Close to MSM H18 G25 D25 RCV_EN_N F18 H10 F10 D9 GSM_PA_BAND GSM_PA_EN A8 B8 G23 BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA F23 E26 E25 H21 R19 for VSS_THERMAL D VDD_EF_USE MDDIH_STBN MDDIH_STBP MDDIH_DATN B20 MDDIH_DATP MDDIC_DATP A23 MDDIC_DATN B22 MDDIC_STBP B23 MDDIC_STBN R16 B19 A20 A19 P25 PA_POWER_CTL GSM_PA_DAC_REF A22 AD26 L19 J26 J25 K26 H23 G21 K23 E23 J19 C25 D21 B3 D22 L15 CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 RINGER_GPIO18 F16 F20 D20 I2C_SCL_GPIO27 K21 I2C_SDA_GPIO26 N16 U21 AE9 SBST SBDT L21 SBCK AF9 J23 W11 H26 AC10 MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31 AC11 AA11 D L14 T12 H14 W12 M16 AA12 USB_DAT_VP N23 USB_SE0_VM N25 USB_OE_TP_N AC12 N26 AF12 AE12 UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 M19 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42 AA13 L23 AE14 W13 AC13 M21 T13 UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88 AA14 AC14 A2_20_GPIO34 A2_19 A2_18 A2_17 A2_16 A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1 F4 AF13 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 E4 AC5 G6 AF3 C230 0.1uF F26 K19 UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 L26 UART1_DP_TX_DATA_GPIO95 D8 GPIO44 F7 GPIO39 F14 GPIO64 AC6 AE4 C229 0.1uF C228 0.01u C227 0.01u C226 0.01u TP200 WDOG monitoring H25 AUX_PCM_CLK_GRFC14_GPIO80 N21 AUX_PCM_DIN_GRFC13_GPIO14 G4 AUX_PCM_DOUT_GRFC12_GPIO103 J8 AUX_PCM_SYNC_GRFC11_GPIO102 H12 TX_ON_GRFC10 M23 AE5 P21 UART1_RFR_N_PA_POWER_CTL_M_GPIO98 P16 AF5 AA7 GPIO45 GPIO53 GPIO52 GPIO51 B7 GPIO50 F9 GPIO49 W9 AA8 AC7 TRST_N TCK TMS TDI TDO RTCK A7 AC8 AD2 GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 KEYSENSE0_N_GPIO62 LCD_ADS AA9 AE7 LCD_MAKER_ID LCD_VSYNC D17 A4 (ADS signal for LCD) W10 D2_15 D2_14 D2_13 D2_12 D2_11 D2_10 D2_9 D2_8 D2_7 D2_6 D2_5 D2_4 D2_3 D2_2 D2_1 D2_0 C221 0.1uF C AE3 A18 L12 C AC9 MSM6245_A D10 NAND & LCD AA10 KEYSENSE4_N_GPIO48 KEYSENSE3_N_GPIO47 KEYSENSE2_N_GPIO46 F OE2_N WE2_N AE10 LB2_N_A2_0 T14 NAND2_FLASH_READY_GPIO33 AF4 P19 KEYSENSE1_N_GPIO63 R21 EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) EBI2_DATA(7) EBI2_DATA(6) EBI2_DATA(5) EBI2_DATA(4) EBI2_DATA(3) EBI2_DATA(2) EBI2_DATA(1) EBI2_DATA(0) Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0 U201-1 UB2_N W14 XMEM2_CS_N0 AF7 D14 EBI2_DATA(0:15) AF10 R23 LCD_CS_N NAND_CLE NAND_CS_N EBI2_OE_N EBI2_WE_N NAND_ALE NAND_READY C225 0.01u C220 0.1uF C219 0.1uF C218 0.01u M26 T25 22n 22n C210 C211 AF20 AE20 AA20 AF22 AF21 AE19 AF19 AC20 AC21 AC19 AA19 AC22 AA18 T15 AF18 W17 AE18 AA17 LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP AC17 AB23 Y21 AC18 V19 W21 AA23 V21 AD1 AE22 AE21 BOOT_MODE BOOT_MODE2 BOOT_MODE3 HKAIN0 HKAIN1 HKAIN2 HKAIN3 HKAIN4 HKAIN5 Y23 U23 MODE2 MODE1 MODE0 T21 AE17 AA4 RESIN_N RESOUT_N RESOUT_N_EBI1 WDOG_EN F11 F13 B10 A16 B16 A10 D18 W6 V2 L2 M6 V8 U4 U8 AA2 XMEM2_CS_N1 AF14 LCD_CS_N_GPIO38 C223 1000p C217 0.01u M25 TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 AC15 C222 1000p C216 0.1uF F25 H13 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF C215 0.01u AE16 220n C203 LINE_N LINE_P R208 R209 VBAT_TEMP AMUX_OUT VBAT_SENSE R205 51K 51K R206 51K NA R202 R201 150K R204 51K RESIN_N RESOUT_N SLEEP_CLK TCXO_MSM R207 K8 G1 N4 Y4 AB1 P8 P11 P2 P6 P1 N1 N2 N6 N11 N8 M8 M4 51 WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93 C214 0.01u F21 E2 SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105 C213 0.01u D23 D2 MSM pin W18 (CODEC VSS) D4 D1 AB2 B C209 0.1uF Place near C212 0.1u 10% B26 J6 AB4 C206 10u AE8 P4 H4 G2 VREG_MSMA_2.6V C205 4.7u AC2 J2 J4 VREG_MSMP_2.7V (CAD : 10uF=>Input MSMA_2.6V) C204 10p B1 K6 VREG_MSME_1.8V B2 B25 L8 K4 J1 VREG_MSMC_1.25V W2 L6 150K : 680K : 2.13V 150K : 750K : 2.17V A26 V4 U6 150K : 300K : 1.73V 2012 10uF 6.3V +80/-20% Ceramic H2 R11 47p A25 E1 C201 C2 Y2 Y1 1 150K : 150K : 1.30V 150K : 470K : 1.97V 1005 0.1uF 16V +80/-20% VDD_DIG_0 VDD_DIG_1 VDD_DIG_2 VDD_DIG_3 VDD_DIG_4 VDD_DIG_5 VDD_DIG_6 VDD_DIG_7 VDD_DIG_8 VDD_DIG_9 VDD_DIG_10 VDD_DIG_11 VDD_DIG_12 W4 V6 1 A 150K : 100K : 1.04V PMIC_AUXIN[1] PMIC_AUXIN[2] - PA_THERM VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38 R4 1 8-bit, NAND, Normal 16-bit, NAND, Normal 8-bit, NAND, Trusted 16-bit, NAND, Trusted 150K : 47K : 0.62V 150K : 68K : 0.81V Near to MSM 47p A2 T2 T1 R6 TCXO USB_XTAL48_IN USB_XTAL48_OUT SLEEP_XTAL_IN SLEEP_XTAL_OUT R8 A1_22 A1_21 A1_20 A1_19 A1_18 A1_17 A1_16 A1_15 GPIO_74 GPIO_73 GPIO_72 GPIO_71 GPIO_70 GPIO_69 GPIO_68 GPIO_67 SDRAM1_D15 SDRAM1_D14 SDRAM1_D13 SDRAM1_D12 SDRAM1_D11 SDRAM1_D10 SDRAM1_D9 SDRAM1_D8 SDRAM1_D7 SDRAM1_D6 SDRAM1_D5 SDRAM1_D4 SDRAM1_D3 SDRAM1_D2 SDRAM1_D1 SDRAM1_D0 1 1 1 A1 E T4 AUDIO C200 C246 SDRAM T6 300K 33nF D T8 ROM1_CLK_SDRAM1_CLK XMEM1_CS_N2_SDRAM1_CS_N0 SDRAM1_CLK_EN ROM1_ADV_N_SDRAM1_RAS_N XMEM1_LWAIT_N_SDRAM1_CAS_N XMEM1_HWAIT_N WE1_N_SDRAM1_WE_N A1_25_SDRAM1_DQM3_GPIO75 A1_23_SDRAM1_DQM2_GPIO78 UB1_N_SDRAM1_DQM1 LB1_N_SDRAM1_DQM0 OE1_N XMEM1_CS_N0 SDRAM_DATA(31) SDRAM_DATA(30) SDRAM_DATA(29) SDRAM_DATA(28) SDRAM_DATA(27) SDRAM_DATA(26) SDRAM_DATA(25) SDRAM_DATA(24) SDRAM_DATA(23) SDRAM_DATA(22) SDRAM_DATA(21) SDRAM_DATA(20) SDRAM_DATA(19) SDRAM_DATA(18) SDRAM_DATA(17) SDRAM_DATA(16) SDRAM_DATA(15) SDRAM_DATA(14) SDRAM_DATA(13) SDRAM_DATA(12) SDRAM_DATA(11) SDRAM_DATA(10) SDRAM_DATA(9) SDRAM_DATA(8) SDRAM_DATA(7) SDRAM_DATA(6) SDRAM_DATA(5) SDRAM_DATA(4) SDRAM_DATA(3) SDRAM_DATA(2) SDRAM_DATA(1) SDRAM_DATA(0) L4 SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) SDRAM_ADDR(13) SDRAM_ADDR(14) C REV_B Change 32 bit L1 V1 A1_24_GPIO79 A1_1 A1_2 A1_3 A1_4 A1_5 A1_6 A1_7 A1_8 A1_9 A1_10 A1_11 A1_12 A1_13 A1_14 SDRAM_DATA(0:31) SDRAM_WE_N SDRAM_DQM(3) SDRAM_DQM(2) SDRAM_DQM(1) SDRAM_DQM(0) SDRAM_CLK SDRAM_CS_N(0) SDRAM_CLK_EN SDRAM_RAS_N SDRAM_CAS_N SDRAM_ADDR(0:14) B 1%R435 VREG_MSME_1.8V 220n CLOCK REV_B C202 RESET SDRAM 0 1 0 150K : 10K : 0.016V HKADC[0] - AMUX_OUT HKADC[1] - VBATT_SENSE HKADC[2] - HDET1 HKADC[3] - TTY_ADC_DET HKADC[4] - PCB_Rev_ADC HKADC[5] - VBATT_TEMP Native, ARM JTAG 0 0 1 HKADC(4):PCB_Rev_ADC ( Default Pull-Down) 0 BOOT_MODE3 BOOT_MODE2 BOOT_MODE1 HKADC 1% MODE0 0 R12 VREG_MSMP_2.7V ADC 0 36 A VREG_MSMP_2.7V VREG_MSMP_2.7V MODE MODE2 MODE1 E CAMERA USIM PMIC USB MicroSD R214 UART R215 2.2K 2.2K C247 0.1u 10% 1 2 3 4 5 6 Section Date Sign & Name Designer MAR.07.2007 Jaykay Place near MSM pin AD26 USB_D+ USB_DUSB_VBUS VBATT REMOTE_PWR_ON UART_TXD UART_RXD VREG_CAM_AVDD_2.8V (Check CAM_DATA PINOUT !!!!) TP402 TP403 TP404 TP405 TP406 12 11 10 9 8 7 6 5 4 3 2 1 CTS RTS Sheet/ MODEL U250/KU250 KU250 DSR UTXD URXD PWR VBAT VBAT Sheets 2/4 NC4 NC3 NC2 Checked ON_SW ON_SW NC1 TX RX GND UFLS TX RX GND DRAWING MSM NAME Approved 2.5G 3G UART I2C_SDA I2C_SCL F GSM_PA_RAMP GSM_PA_PWR_CTL_REF SSBDT_PM SSBDT_RTR MMC_CMD MMC_DATA MMC_CLK USB_DAT USB_SE0 USB_OE_N PM_INT_N PS_HOLD CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_VSYNC CAM_HSYNC CAM_PCLK CAM_LDO_EN MEGA_CAM_PWR_DOWN LCD_BL_CTRL MEGA_CAM_RESET_N EAR_SENSE_N KEYPAD USIM_CLK USIM_RST_N USIM_DATA MMC_CD UART_RXD (NAND_BOOT_ERR) UART_TXD KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) KEY_ROW(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0) E LG Electronics Inc. 7 8 DRAWING REV_1.0 NO. 9 LG(42)-A-5505-10:01 LG Electronics Inc. LGMC - 144 - 7. CIRCUIT DIAGRAM 6 7 8 9 10 11 12 VREG_TCXO_2.85V A HYC0UEH0MF3P-6SS0E VDD_MSM : 0.1uF VDD_ANA : 0.1uF VDD_RUIM : 0.1uF VDD_RF : 0.1uF VDD_WLAN : 0.1uF VDD_MAIN : 0.1uF VDD_SPKR : 0.1uF C305 C307 C308 C310 0.1u 4.7u 4.7u C304 C306 0.1u 0.1u C303 0.1u 0.1u 0.1u C301 C302 0.1u 1u C316 +VPWR +VPWR +VPWR 2.2u C311 1u 64 1u 59 53 51 52 R306 51 51K 50 R307 49 51K R308 48 47 TP308 45 44 43 SLEEP_CLK LCD_LDO_EN 1 USIM_P_RST_N VREG_MSMP_2.7V 2 D MC-146_7pF 32.768KHz REV_D 1608 C344 C358 22u REV_E Power Line --> Route carefully!!!!! Draw the Artwork_line thickly !!!!! --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR- 0.1u 4.7u 1608 C389 C340 2.2u E F 2 GND1 5 GND2 VREG_LCD_2.8V C345 1u C346 1u VREG_MSME_1.8V MEMORY 3 4 Artwork --> Place resistor and capacitor close to PM6650 !! U302 R1114D281D-TR-F 3 VDD VOUT 4 NC 6 CE PS_HOLD VREG_MSMA_2.6V X300 LCD LDO 1 4.7u SSBDT_PM 46 1608 C339 2.2u 4.7uH L301 smd_2520h1_6_r L300 4.7u C434 1000p 1608 C433 0.1u C343 C436 10u 4.7uH smd_2520h1_6_r 4.7uH VREG_RF_SMPS C341 L305 +VPWR C326 4.7u C333 smd_1608h_9_r TCXO_EN +VPWR TCXO_MSM +VPWR VREG_MSMP_2.7V 54 smd_1608h_9_r 55 +VPWR USIM_RST_N USIM_P_CLK USIM_CLK USIM_DATA VREG_USIM_2.85V VREG_MMC_3.0V REV_B MCP(512Mb NAND + 512Mb 1 piece SDRAM) R304 56 KYBD_BACKLIGHT PM_ON_SW_N MOTOR_PWRUSIM_P_DATA A2 A9 A10 R1 R2 R9 R10 470K C323 PM_INT_N TCXO_PM 58 57 VREG_RUIM VDD_RUIM 60 NBL414R-F9J BAT300 C338 XTAL_IN 121K 1% 12p SLEEP_CLK RUIM_RST(MPP6) R303 61 41 42 RUIM_M_RST(MPP5) 40 VREG_MMC VREG_MSME VSW_MSME VDD_MSME RUIM_CLK(MPP10) 39 38 37 35 36 RUIM_M_CLK(MPP9) VDD_MSMC C336 4.7u 1608 VSW_MSMC GP1_DRV_N(MPP7) 34 USB_D_M 33 USB_SE0 2.2K VREG_MSMC XTAL_OUT RUIM_M_IO(MPP11) SBDT USB_D_P C322 62 C337 VBACKUP USB_VBUS USB_DAT 0.1u 63 12p 66 65 VDD_WLAN VREG_WLAN CBL1PWR_N(MPP4) 68 69 70 71 72 67 VREG_RFRX2 VREG_RFRX1 VDD_RF AMUX_IN1(MPP1) AMUX_IN2(MPP2) CBL0PWR_N(MPP3) 73 76 75 74 SPKR_BYP VDD_SPKR SPKR_IN_P VREG_RFTX SPKR_OUT_P 77 79 78 SPKR_IN_M SPKR_OUT_M 80 82 83 84 81 VREG_SYNT REF_OUT(MPP8) VDD_MAIN GND_SLUG AMUX_OUT SBCK 31 32 20 21 SBST VREG_MSMP USB_CTL_N VDD_PA 19 VDD_ANA VSW_5V VREG_PA 18 TCXO_EN TCXO_OUT VDD_MSM USB_OE_N 30 16 17 28 R309 VREG_MSMP_2.7V 15 USB_ID VREG_5V 29 13 14 VREG_MSMA U300 PM6650-2M PON_RESET_N VREG_USB 27 12 USB_CTL_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_D- VCOIN PS_HOLD FLSH_DRV_N C435 22u DNU0 DNU1 DNU2 DNU3 DNU4 DNU5 DNU6 +VPWR AMUX_OUT C312 11 C REF_BYP REF_GND TCXO_IN BAT_FET_N 26 10 1u VREG_TCXO 85 0.1u 12p C324 C327 Check if it is LOW enable. MSM_INT_N VBAT KPDPWR_N 9 RESIN_N VREG_MSME_1.8V CHG_CTL_N LCD_DRV_N J7 H7 H8 B1 B2 B10 E5 F3 G1 G5 M3 M4 M7 N4 N7 N8 P1 P2 P3 P4 P5 P10 1608 REF_ISET ISNS_M VIB_DRV_N 0.1uF 8 ISNS_P KPD_DRV_N C321 0.1uF 6 7 USB_OE_N B5 VCC0 N5 VCC1 NC0 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 0.1uF B8 D1 H1 H10 P8 M1 4 5 ADC_BYP VCHG 25 0.1uF C320 10K 3 ICHARGE CHG_CTL_N ICHARGEOUT VBATT BATT_FET_N 23 0.1uF 0.1uF C319 R305 C332 VDD0 VDD1 VDD2 VDD3 VDD4 VDD5 C446 33u B VREG_MSMC_1.25V F DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 A 0.1u E L4 L5 L6 L7 K8 L8 K7 K5 K6 G7 J6 J5 H6 H5 J4 G3 G4 F4 E4 F5 H3 H4 E6 F7 F6 D5 E8 D6 D8 D7 C8 C7 2 +5V_PWR 22 SDRAM_DATA(0) SDRAM_DATA(1) SDRAM_DATA(2) SDRAM_DATA(3) SDRAM_DATA(4) SDRAM_DATA(5) SDRAM_DATA(6) SDRAM_DATA(7) SDRAM_DATA(8) SDRAM_DATA(9) SDRAM_DATA(10) SDRAM_DATA(11) SDRAM_DATA(12) SDRAM_DATA(13) SDRAM_DATA(14) SDRAM_DATA(15) SDRAM_DATA(16) SDRAM_DATA(17) SDRAM_DATA(18) SDRAM_DATA(19) SDRAM_DATA(20) SDRAM_DATA(21) SDRAM_DATA(22) SDRAM_DATA(23) SDRAM_DATA(24) SDRAM_DATA(25) SDRAM_DATA(26) SDRAM_DATA(27) SDRAM_DATA(28) SDRAM_DATA(29) SDRAM_DATA(30) SDRAM_DATA(31) B9 C1 H9 J1 P9 M2 1005 J8 DQM0 G6 DQM1 F8 DQM2 E7 DQM3 PMIC VPWR BYPASS VDD_MSME : 4.7uF REMOTE_PWR_ON C325 VSS0 VSS1 VSS2 VSS3 VSS4 VSS5 D SDRAM_DQM(0) SDRAM_DQM(1) SDRAM_DQM(2) SDRAM_DQM(3) SDRAM_DATA(0:31) VREG_MSME_1.8V 1 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 C331 K4 L1 L2 L3 C2 D2 E1 D3 E2 D4 K3 F2 F1 C330 SDRAM_ADDR(0:12) J10 K9 L9 M10 N9 C9 D10 E9 F10 G9 0.1uF SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) C VDDQ0 VDDQ1 VDDQ2 VDDQ3 VDDQ4 VDDQ5 VDDQ6 VDDQ7 VDDQ8 VDDQ9 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 0.1uF N1 N2 N3 M5 P7 M6 N6 M8 C328 EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) 0.1uF J3 BA0 K2 BA1 SDRAM_ADDR(13) SDRAM_ADDR(14) EBI2_DATA(0:7) C329 100K R302 RESOUT_N _WEN R_B ALE CLE _RE _WP 0.01u NAND_ALE NAND_CLE EBI2_OE_N 16 15 VDD_MSMC : 4.7uF REV_B 0.1u B7 C6 C4 B4 B3 C3 EBI2_WE_N NAND_READY J9 K10 L10 M9 N10 C10 D9 E10 F9 G10 C334 NAND_CS_N B 14 +VPWR VSSQ0 VSSQ1 VSSQ2 VSSQ3 VSSQ4 VSSQ5 VSSQ6 VSSQ7 VSSQ8 VSSQ9 0.1uF G8 CK E3 CKE B6 _CE X16 SDRAM --> X32 SDRAM C317 SDRAM_CLK SDRAM_CLK_EN C5 VSSN0 P6 VSSN1 C318 J2 _CS K1 _WED G2 _RAS H2 _CAS C335 R300 51K VREG_MSMP_2.7V R301 100K REV_B SDRAM_CS_N(0) SDRAM_WE_N SDRAM_RAS_N SDRAM_CAS_N 24 U301 13 VREG_BT_2.85V 5 VREG_SYNTH_2.6V GSM_PA_PWR_CTL_REF 4 3 2 RUIM_IO(MPP12) VSW_PA 1 C C CAMERA LDO U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND ICHARGEOUT +VPWR C349 1u USB_VBUS 0.1 6 QST4 MMC_CLK VSS DAT0_DO L302 56nH USB_CTL_N D C447 1u +5V_PWR BATT_FET_N 6 C350 1u 5 Q302 QST4 C1 GND3 GND4 1 2 ICHARGE Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT U305 5 +VPWR 8 WLED_PWR 11 REV_B 100K R380 REV_C IN C357 1u 4 9 C17 C2+ CP C2EN_SET GND E AAT3157ITP-T1 10 C1+ 6 1 D1 2 D2 3 D3 12 NC C354 1u Section Date Sign & Name C356 1u Designer MAR.07.2007 Jaykay Sheet/ MODEL OJ302 3/4 WLED_1 WLED_2 WLED_3 Checked OJ303 MEM & POWER NAME Approved LG Electronics Inc. 1 2 3 4 5 6 7 8 Sheets KU250 U250/KU250 DRAWING OJ301 3 B CHG_CTL_N LCD_BL_CTRL OJ300 C2 LCD BACKLIGHT REV_B C355 1u F 4 REV_D 33p VA306 EVLC18S02003 VA305 EVLC18S02003 VA303 EVLC18S02003 R318 E MMC_DATA C351 0.1u VA304 EVLC18S02003 470K DAT1_RSV GND VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK EVLC18S02003 VA302 USIM_P_DATA C353 CLK_SCLK 2 VREG_CAM_DVDD_1.5V VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV CAM_LDO_EN smd_1005h_5_r MMC_CD MMC_CMD VDD EVLC18S02003 VA300 CD_DAT3_CS CMD_DI J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12 EVL14K02200 VA301 DAT2_RSV +VPWR smd_1005h_5_r 5 6 7 8 9 10 3 B C2 C1 1 G D1 D2 R317 0.1u 100K USIM 4 15K C352 R315 S300 SCHA1A0100 GND VREG_MMC_3.0V 0 R316 100K R314 D 5 Q300 S VBATT R313 D3 D4 C348 1u 9 C347 1u SI3493DV-E3 Q301 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V PGND +VPWR CAM_LDO_EN T-FLASH CHARGER DRAWING REV_1.0 NO. 9 LG(42)-A-5505-10:01 LG Electronics Inc. LGMC - 145 - 7. CIRCUIT DIAGRAM 1 2 3 4 5 7 6 9 8 10 11 LCD CONNECTOR 12 14 13 16 I/O CONNECTOR 2.2K VREG_MSMP_2.7V 15 MICBIAS R400 3 4 C400 0.1u FL400 L400 56nH TP401 5 MOTOR_PWR- 5 3 2 8 7 6 R410 VREG_MSMP_2.7V FL405 80.6K 1 LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR 0.1u C409 PLW0501H-LF D402 D VBAT 20 22 C REV_1.0 VBAT_GND INSTPAR VA409 VA410 EVL14K02200 EVL14K02200 1 2 3 4 VBAT_TEMP EVL14K02200 INOUT_B4 EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15) 9 EVL14K02200 INOUT_A4 G1 4 INOUT_B3 10 C 4 INOUT_B2 INOUT_A3 VA408 3 5 INOUT_B1 INOUT_A2 3 B CN402 REV_B : Change Pin Description INOUT_A1 IN G1 NTS104B EVL14K02200 2 G2 1 G2 1 VA407 ICVE21184E150R500FR 6 OUT 4 USB_VBUS UART_TXD UART_RXD C404 0.1uF 10 9 8 REV_B VA490 FL403 2 47p 6 REMOTE_PWR_ON +5V_PWR 47p 7 470K 10 5 8 11 7 FL404 R407 100ohm C408 INOUT_B4 12 33u C1005X7R1H471KT INOUT_B3 G1 INOUT_A3 INOUT_A4 13 VBAT_SENSE EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11) 9 680K 4 INOUT_B2 R409 3 14 INOUT_B1 INOUT_A2 47n C403 16 15 INOUT_A1 G2 2 C402 R406 100ohm EAR_SENSE_N VBATT R408 1 HPH_L HPH_R 33u USB_D+ USB_D- 19 18 C401 FL402 ICVE21184E150R500FR 17 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 MIC2N MIC2P C407 G2 10 20 U400 NCS2200SQ2T2G RB521S-30 C432 470p INOUT_A4 22 21 3 4 10K R404 SD12T1G INOUT_B4 23 2 VIN- VIN+ 1u INOUT_A3 4 3 VCC GND C406 INOUT_A2 INOUT_B3 1 OUT D401 24 INOUT_B2 HOOK_KEY 2 D400 EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) EVL14K02200 6 1 EVL14K02200 7 INOUT_A1 VA405 8 26 25 INOUT_B1 CN401 HSEJ-18S04-25R 51K VA404 9 R403 VREG_MSMP_2.7V +VPWR TP400 ICVE21184E150R500FR FL401 A 5.1K EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) 2 0.01u INOUT_A4 EVL14K02200 INOUT_A3 INOUT_B4 C405 INOUT_A2 INOUT_B3 VA403 INOUT_A1 INOUT_B2 EVLC18S02003 INOUT_B1 EVLC18S02003 6 6 R402 7 EVL14K02200 7 VA401 5 10 28 27 8 VA400 G1 INOUT_A4 INOUT_B4 29 8 LCD_CS_N LCD_ADS EBI2_WE_N EBI2_OE_N 9 1M INOUT_A3 INOUT_B3 100K 4 30 INOUT_A2 INOUT_B2 R405 31 INOUT_A1 INOUT_B1 G2 2 3 10 1 G1 32 G2 LCD_RESET_N LCD_IF_MODE_0 LCD_IF_MODE_1 LCD_VSYNC 34 33 G1 ICVE21184E150R500FR 35 5 A 1 5 9 B R401 ICVE21184E150R500FR VA402 CN400 KEY_BACK_LIGHT LED(8EA) D +VPWR LD400 LEBB-S14H LD403 LEBB-S14H LD406 LEBB-S14H R411 100ohm R414 100ohm R417 LD404 LEBB-S14H LD407 LEBB-S14H 100ohm R418 100ohm LD402 LEBB-S14H LD405 LEBB-S14H R413 100ohm LD408 LEBB-S14H R416 100ohm R419 100ohm 100ohm REV_B : EDLH0013501 --> EDLH0006001 CAMERA AUDIO 10 R422 10 10 7 IN1 NC2 NC1 GND 5 END PM_ON_SW_N KEY MAP F 1 3 5 7 CLR MENU LEFT UP OK RIGHT SND SEARCH DN BACK REV_B C449 KEY_ROW(0) MIC NA 10p C413 C448 C415 10p 0.1u NA C414 C411 C412 0.1uF 1u RCV+ EVL14K02200 VA414 6 EVL14K02200 8 15 21 6 17 13 14 16 VREG_MSMP_2.7V R421 R437 20 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V END RCV_EN_N IN2 COM1 4 RCV- SPK_RCV+ 8 2 4 6 8 SPK_RCV- I2C_SCL I2C_SDA MEGA_CAM_RESET_N CAM_MCLK SPK+ 9 100K COM2 100K NO2 NO1 3 RA400 VCC 2 SPK- R423 C410 0.01u CAM_PCLK CAM_VSYNC_OUT CAM_HSYNC_OUT MEGA_CAM_PWR_DOWN DGND1 DGND2 DGND3 AGND1 AGND2 DVDD VDDIO AVDD CN403 1 +VPWR REV_1.0 R436 0 20 19 18 12 11 10 9 7 PCLK VSYNC HSYNC STANDBY SCK SDA RESETB MCLK VA412 32 31 30 29 28 27 26 25 D0 D1 D2 D3 D4 D5 D6 D7 E U401 NLAS5223BMNR2G PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 22 23 24 1 2 3 4 5 CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7) KYBD_BACKLIGHT SELECT_SPK&RCV MEGA CAMERA CONNECTOR E F R415 400 401 402 1 2 3 403 404 405 4 5 6 406 407 408 KEY_ROW(1) MICBIAS COMMON_CAM_MCLK FL406 6 FL407 D ICVE21184E150R500FR INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 CAM_DATA_OUT(6) CAM_DATA_OUT(7) CAM_VSYNC_OUT CAM_HSYNC_OUT 8 7 6 1 SPK_AMP_EN REV_C : 20K --> 3K 20 19 18 17 16 P20 P19 P18 P17 P16 GND7 GND8 GND3 0.1u 0.1u R428 5.6K R426 2 20K _SD 9 HOT401 HOT4 0 HOT3 KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) D KEYS OUTB 8 SPK- 7 BYPASSU402 VM 6 VP 3 INP 4 INM R430 5.6K OUTA +VPWR E 5 SPK+ C428 1u R431 20K C425 10u C431 NA Section Date Sign & Name Designer MAR.07.2007 Jaykay Sheet/ MODEL Checked KEY / MMI LCD/CAMERA DRAWING CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) Sheets KU250 U250/KU250 4/4 CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_DATA_OUT(7) CAM_DATA_OUT(6) VA430 6 P6 7 P7 8 P8 9 P9 10 P10 GND2 EVL14K02200 15 P15 14 P14 13 P13 12 P12 11 P11 GND1 F GND6 C422 C423 GND5 CN404 GND4 NA CAM_PCLK CAM_DATA_OUT(0) 1K 1K C4275600p LINE_N LINE_P R427 R429 C4265600p C424 VGA_CAM_RESET_N I2C_SCL I2C_SDA 1 P1 2 P2 3 P3 4 P4 5 P5 VREG_CAM_DVDD_1.5V COMMON_CAM_MCLK REV_1.0 8 409 MIC1N NCP2890DMR2 VT_CAMERA_CONNECTOR VREG_CAM_AVDD_2.8V 7 HOT400 KEY_ROW(3) MIC1P Audio AMP FL408 E 0.1u REV_B : EDTY0008606 --> EDTY0008601 10 G1 4 INOUT_A2 9 0.1u C419 C429 C430 3 INOUT_B1 C418 1000p 1000p 2 INOUT_A1 G2 CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC 1 39p 7 39p INOUT_B3 INOUT_B4 2.2K INOUT_B2 INOUT_A3 INOUT_A4 C421 INOUT_A2 C420 4 R425 1 2 CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) 8 INSTPAR 3 9 D404 6 INOUT_B1 10 5 7 INOUT_A1 D403 PSD05-LF INOUT_B4 1 2 INSTPAR INOUT_B3 CAM_DATA(3) CAM_DATA(4) CAM_DATA(5) PSD05-LF INOUT_B2 INOUT_A3 INOUT_A4 CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) G2 INOUT_A2 9 8 10 4 INOUT_B1 G1 3 INOUT_A1 5 2 G2 1 G1 CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) MIC400 OB4-15L42-C33L ICVE21184E150R500FR C KEY_ROW(2) R424 2.2K REV_1.0 ICVE21184E150R500FR C417 47p C416 10u REV_B : SUMY0010301 --> SUMY0003802 L401 100nH RCVN L402 100nH RCVP NAME Approved SPK_RCVSPK_RCV+ CAM_DATA_OUT(5) REV_E : For Antenna Radiation LG Electronics Inc. 1 2 3 4 5 6 7 8 DRAWING REV_1.2 NO. 9 LG(42)-A-5505-10:01 LG Electronics Inc. LGMC - 146 - LGMC - 147 - U250/KU250 8. PCB LAYOUT LGMC - 148 - U250/KU250 8. PCB LAYOUT 9. Calibration & RF Auto Test Program (Hot Kimchi) 9. Calibration & RF Auto Test Program (Hot Kimchi) 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory C: Cm_Grut Common dll_serialat LG_CL_009.dll Log At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV.dll DLL_E5515CD.DLL DLL_PwrControlD.dll Dll_SerialATD.dll LG_CL_011.dll PwrSupply_Cmd.xml Debug : Directory : File - 149 - Auto KU250 Cal KU250 CalAuto KU250 9. Calibration & RF Auto Test Program (Hot Kimchi) Hot_Kimchi Debug image Log ComLMPLib_11.dll Dll_EzLooksMQ_004.dll GuiTk115d.dll HK_25.exe ijl11.dll SBCmd.xml ShieldBox_DllD.dll Model KU250 Log LG_RfTest_E5515C_211.dll AutoSetup_110.xml QMSL_MSVC6R.dll Cal_Setup_Test.xml Ezlooks.xml LG_RfCal_Q3G6280N_Polar_006.dll Procedure_KU250_103.xml script_auto_001.xml : Directory script_cal_003.xml : File Spec_3GPP_030.xml - 150 - 9. Calibration & RF Auto Test Program (Hot Kimchi) dll,ocx (Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat Result UI Auto KU250 Cal KU250 CalAuto KU250 image result.bmp LG_UI_Ad6500_002.dll LG_UI_EmKU250_001.dll : Directory LG_UI_Qu6250_003.dll : File LG_UI_Qu6275_004.dll 1. _New_HK_0808.reg - 151 - 9. Calibration & RF Auto Test Program (Hot Kimchi) 9.2 How to use HOT KIMCHI ➀ ➁ ➂ * Procedure 1. Click “Logic Operation” of “SETTING” menu bar 2. Select “UART Port” that PC can communicate with the phone 3. Select “LOGIC MODE” that you want - Logic Mode -> 1: Calibration Only - 152 - 9. Calibration & RF Auto Test Program (Hot Kimchi) KU250 ➄ Click "Start" ➃ Select "U250/KU250" * Procedure 4. Select the model name “U250/KU250” 5. Click “Start” button - 153 - 10. Factory Test Mode 10. Factory Test Mode 10.1. Test Program Setting 1) Open “LG FTM GUI” 2) Click “Options >> Port Settings” 3) Select Com Port and click “OK” - 154 - 10. Factory Test Mode 10.2. WCDMA Test Mode 1) Click “Tools >> FTM GUI WCDMA” 2) Select “FTM” Mode 3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is written at Rx UHF automatically. 4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is decided. 5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power mode. 6) Depending on a situation, Click “Tx On” or “Tx Off”. Channel Select Tx Control 7) Set Rx mode. Click LNA Range, 0~4. 8) Click “Get IM2” and “Get Rx AGC”. Confirm the value. - 155 - Rx Control 10. Factory Test Mode 10.3. GSM Test Mode 1) To switch GSM Mode, Select Mode -> GSM mode at menu commands 2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900” 3) Write wanted channel. We usually set “1” 4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value 5) Click “Tx On” or “Tx Off”. 6) SET RX mode. Click LNA Range, 0~4. 7) Click “RX ON” Channel Control Tx Power Control - 156 - Rx Gain Control 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW 32 35 31 28 29 30 22 20 19 17 18 15 16 36 13 12 34 8 5 6 7 4 3 33 2 1 24 25 23 37 14 10 11 9 - 157 - 26 27 - 158 - 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts <Mechanic component> Level Location No. 1 Description Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Part Number Spec Color IMT,BAR/FLIP TIMT0000614 Black Black Remark 2 AAAY00 ADDITION AAAY0219401 3 MCJA00 COVER,BATTERY MCJA0040601 MOLD, PC LUPOY SC-1004A, , , , , Without Color 2 APAY00 PACKAGE APAY0095904 U250 HIT Packing(P/Label66-Angle-9501) Without Color 3 BSEA00 SUPPLEMENTARY PART BSEA0003901 PACKING-LIST ENVELOPE 2 APEY00 PHONE APEY0394202 Black 3 ACGK00 COVER ASSY,FRONT ACGK0085601 Without Color 4 MCCC00 CAP,EARPHONE JACK MCCC0043601 COMPLEX, (empty), , , , , Without Color 10 4 MCCG00 CAP,MULTIMEDIA CARD MCCG0007601 COMPLEX, (empty), , , , , Without Color 4 4 MCJK00 COVER,FRONT MCJK0069301 MOLD, PC LUPOY SC-1004A, , , , , Without Color 5 5 MICE00 INSERT,NUT MICE0000601 COMPLEX, (empty), , , , , Without Color 5 MICE01 INSERT,NUT MICE0000701 COMPLEX, (empty), , , , , Without Color 4 MFBC00 FILTER,SPEAKER MFBC0029401 COMPLEX, (empty), , , , , Without Color 6 4 MFBZ00 FILTER MFBZ0002801 COMPLEX, (empty), , , , , Without Color 9 4 MHGJ00 HOLDER,SPEAKER MHGJ0001701 COMPLEX, (empty), , , , , Black 7 4 MKAZ00 KEYPAD MKAZ0035901 COMPLEX, (empty), , , , , Without Color 11 4 MPBG00 PAD,LCD MPBG0058301 COMPLEX, (empty), 1.2, , , , Without Color 12 4 MPBT00 PAD,CAMERA MPBT0039101 COMPLEX, (empty), 1.2, , , , Without Color 8 4 MTAB00 TAPE,PROTECTION MTAB0160501 COMPLEX, (empty), , , , , Without Color 1 4 MTAB01 TAPE,PROTECTION MTAB0160601 COMPLEX, (empty), , , , , Without Color 13 4 MTAD00 TAPE,WINDOW MTAD0065801 COMPLEX, (empty), 0.2, , , , Without Color 3 4 MWAC00 WINDOW,LCD MWAC0077201 COMPLEX, (empty), 1.0, , , , Without Color 2 3 ACGM00 COVER ASSY,REAR ACGM0087501 4 ENZY00 CONNECTOR,ETC ENZY0019701 4 PIN,3.0 mm,ETC , ,H=5.8 4 MCCF00 CAP,MOBILE SWITCH MCCF0042501 COMPLEX, (empty), , , , , 4 MCJN00 COVER,REAR MCJN0065501 MOLD, PC LUPOY SC-1004A, , , , , 4 MHGZ00 HOLDER MHGZ0028701 4 MLAB00 LABEL,A/S 4 MLAN00 4 36 Without Color 24 Black 29 Without Color 28 COMPLEX, (empty), , , , , Black 22 MLAB0001102 C2000 USASV DIA 4.0 White 27 LABEL,QUALCOMM MLAN0000603 White,95C MPBH00 PAD,MIKE MPBH0029101 COMPLEX, (empty), , , , , Black 26 4 MPBN00 PAD,SPEAKER MPBN0039001 CUTTING, NS, , , , , Black 18 4 MPBZ00 PAD MPBZ0186001 COMPLEX, (empty), , , , , Without Color 19 4 MPBZ01 PAD MPBZ0186801 COMPLEX, (empty), , , , , Without Color 25 - 159 - Transparent 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number 4 MTAB01 TAPE,PROTECTION MTAB0178301 4 MTAD00 TAPE,WINDOW 4 Spec Color Remark COMPLEX, (empty), , , , , Without Color 32 MTAD0065901 COMPLEX, (empty), 0.2, , , , Without Color 30 MWAE00 WINDOW,CAMERA MWAE0024501 COMPLEX, (empty), 1.0, , , , Without Color 31 4 SJMY00 VIBRATOR,MOTOR SJMY0007903 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , , 23 4 SNGF00 ANTENNA,GSM,FIXED SNGF0023102 3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 20 3 MLAA00 LABEL,APPROVAL MLAA0042001 COMPLEX, (empty), , , , , Without Color 6 MCBA00 CAN,SHIELD MCBA0017101 COMPLEX, (empty), , , , , Without Color 6 MPBZ00 PAD MPBZ0179301 COMPLEX, (empty), 0.6t, , , , Without Color 16 5 ADCA00 DOME ASSY,METAL ADCA0064001 Without Color 14 5 MTAZ00 TAPE MTAZ0186301 COMPLEX, (empty), 0.1, , , , Without Color 5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color - 160 - 34 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Location No. 3 GMEY00 SCREW MACHINE,BIND GMEY0011201 3 SAFY00 PCB ASSY,MAIN SAFY0196602 4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0072901 5 ACKA00 CAN ASSY,SHIELD ACKA0002101 5 SUMY00 MICROPHONE SUMY0010301 FPCB ,-42 dB,4*1.5T ,Standard Holder 5 SUSY00 SPEAKER SUSY0026801 ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T ,WIRE 5 SVCY00 CAMERA SVCY0014401 CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket Type 5 SVCY01 CAMERA SVCY0014301 CMOS ,VGA ,Socket type 5 SVLM00 LCD MODULE SVLM0025001 MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM ,NT3916(Novatek) ,NTSC:60% 4 SAFF00 PCB ASSY,MAIN,SMT SAFF0117802 5 SAFC00 PCB ASSY,MAIN,SMT BOTTOM SAFC0088501 6 ANT103 ANTENNA,GSM,FIXED SNGF0026001 3.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,2.0 ,50 ,3.0 6 BAT300 BATTERY,CELL,LITHIUM SBCL0001701 2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 6 C101 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C103 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C104 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C106 CAP,CHIP,MAKER ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C107 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP 6 C108 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C109 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C110 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C112 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C113 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C114 CAP,CERAMIC,CHIP ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP 6 C115 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C117 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C118 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C119 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C121 CAP,TANTAL,CHIP,MAKER ECTZ0005603 33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 6 C122 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP Description Part Number Spec 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Color Remark Without Color 33 15 Without Color - 161 - 17 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C123 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C124 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C126 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C127 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C128 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C130 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C131 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C132 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C134 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C135 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C136 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C139 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C140 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C141 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C142 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C143 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C144 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 6 C147 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C149 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C150 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C151 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C152 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C153 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C154 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C155 CAP,TANTAL,CHIP ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP 6 C156 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C157 INDUCTOR,CHIP ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free 6 C158 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C159 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C161 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C162 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C164 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C165 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C170 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C171 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C172 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP Description Part Number Spec - 162 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C173 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 6 C174 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C176 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C177 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C178 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C179 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C180 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 6 C181 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C182 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C183 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C185 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C186 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C187 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C188 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C189 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C190 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C192 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C200 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C201 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C202 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C203 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C204 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C205 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 6 C206 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 6 C209 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C210 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 6 C211 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 6 C212 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C213 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C214 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C215 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C216 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C217 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C218 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C219 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C220 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C221 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP Description Part Number Spec - 163 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C222 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C223 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C225 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C226 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C227 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C228 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C229 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C230 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C231 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP 6 C232 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C233 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C234 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C235 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C236 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C237 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C238 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C239 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C240 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C242 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C243 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C244 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C246 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP 6 C247 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C301 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C302 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C303 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C304 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C305 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C306 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C307 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C308 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C310 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C311 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C316 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 6 C317 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C318 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP Description Part Number Spec - 164 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C319 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C320 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C321 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C322 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C323 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C324 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C325 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C326 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 6 C327 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C328 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C329 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C330 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C331 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C332 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C333 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 6 C334 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C335 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C336 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C337 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C338 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C339 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 6 C340 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 6 C341 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 6 C343 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C344 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C345 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C346 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C347 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C348 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C349 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C350 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C351 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C352 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C353 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C354 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C355 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C356 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP Description Part Number Spec - 165 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C357 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C358 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 6 C389 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 6 C400 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C401 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 6 C402 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 6 C403 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 6 C404 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C405 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C406 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C407 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C408 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C409 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C410 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C411 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C412 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C413 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C414 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C415 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C416 CAP,TANTAL,CHIP ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 6 C417 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C418 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C419 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C420 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C421 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C422 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C423 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C425 CAP,TANTAL,CHIP ECTH0001902 10 uF,10V ,M ,L_ESR ,1608 ,R/TP 6 C426 CAP,CERAMIC,CHIP ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP 6 C427 CAP,CERAMIC,CHIP ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP 6 C428 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C429 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C430 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C432 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C433 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C434 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C435 CAP,TANTAL,CHIP ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP Description Part Number Spec - 166 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 C436 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 6 C437 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C438 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C439 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C440 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C441 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C442 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C443 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C444 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C445 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C446 CAP,TANTAL,CHIP,MAKER ECTZ0005603 33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 6 C447 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C450 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 CN400 CONNECTOR,FFC/FPC ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2 6 CN401 CONNECTOR,I/O ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type 6 CN403 CONN,SOCKET ENSY0020101 24 PIN,ETC , ,0.9 mm, 6 D400 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 6 D401 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP , 6 D402 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE 6 D403 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE 6 D404 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE 6 FL101 FILTER,SAW SFSY0030201 897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx 6 FL102 FILTER,SAW SFSY0031101 1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA 2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR 6 FL103 FILTER,SAW SFSY0031201 2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0, 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140 ,1.4*1.1*0.62 ,SMD ,R/TP 6 FL104 DUPLEXER,IMT SDMY0001301 1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140 ,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP 6 FL400 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL401 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL402 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL403 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL404 FILTER,EMI/POWER SFEY0006001 SMD , Description Part Number Spec - 167 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 FL405 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL406 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL407 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 FL408 FILTER,EMI/POWER SFEY0007103 SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 6 J300 CONN,SOCKET ENSY0019201 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM 6 L102 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , 6 L108 INDUCTOR,CHIP ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE 6 L111 INDUCTOR,CHIP ELCH0004718 5.6 nH,S ,1005 ,R/TP , 6 L114 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE 6 L115 INDUCTOR,CHIP ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE 6 L116 INDUCTOR,CHIP ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE 6 L119 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE 6 L120 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE 6 L121 INDUCTOR,CHIP ELCH0005020 1 nH,S ,1005 ,R/TP , 6 L123 INDUCTOR,CHIP ELCH0005020 1 nH,S ,1005 ,R/TP , 6 L125 INDUCTOR,CHIP ELCH0001410 12 nH,J ,1005 ,R/TP ,Pb Free 6 L128 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP , 6 L300 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 6 L301 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 6 L302 INDUCTOR,CHIP ELCH0001550 56 nH,J ,1608 ,R/TP , 6 L305 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 6 L400 INDUCTOR,CHIP ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 6 L401 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , 6 L402 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , 6 L403 INDUCTOR,CHIP ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE 6 L404 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP , 6 L405 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , 6 L406 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , 6 L407 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , 6 L408 INDUCTOR,CHIP ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE 6 L409 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE 6 L410 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE 6 L411 INDUCTOR,CHIP ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE 6 M100 MODULE,ETC SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module 6 Q300 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 Description Part Number Spec - 168 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 Q301 TR,FET,P-CHANNEL EQFP0004701 TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S) MOSFET, Pb free 6 Q302 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 6 R100 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R101 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R103 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP 6 R104 RES,CHIP,MAKER ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP 6 R105 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP 6 R106 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP 6 R107 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R108 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R109 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R110 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP 6 R111 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP 6 R112 RES,CHIP,MAKER ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP 6 R113 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R114 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R115 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R116 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R117 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R118 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R119 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R120 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP 6 R121 RES,CHIP,MAKER ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP 6 R122 RES,CHIP,MAKER ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP 6 R123 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R124 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R128 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R201 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP 6 R202 RES,CHIP,MAKER ERHZ0000469 36 ohm,1/16W ,J ,1005 ,R/TP 6 R204 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R205 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R207 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R208 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R209 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R211 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R213 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP Description Part Number Spec - 169 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 R214 6 Description Part Number Spec RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R215 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R300 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R301 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R302 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R303 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP 6 R304 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP 6 R305 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R306 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R307 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R308 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R309 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R313 RES,CHIP ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP 6 R314 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R315 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R316 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R317 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP 6 R318 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP 6 R380 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R400 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R401 RES,CHIP,MAKER ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP 6 R402 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP 6 R403 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R404 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R405 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R406 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R407 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R408 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP 6 R409 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP 6 R410 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP 6 R421 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R422 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R424 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R425 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R426 RES,CHIP,MAKER ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP 6 R427 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R428 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP - 170 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 R429 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R430 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP 6 R431 RES,CHIP,MAKER ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP 6 R433 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP 6 R434 RES,CHIP ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP 6 R435 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP 6 R436 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R437 RES,CHIP,MAKER ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP 6 RA400 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 6 S300 CONN,SOCKET ENSY0013501 8 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1 mm,TRANS FLASH SOCKET / EXTERNAL MEMORY CARD SOCKET 6 SW100 CONN,RF SWITCH ENWY0003301 ,SMD ,0.4 dB, 6 TR100 TR,BJT,ARRAY EQBA0000601 UMT5 ,.2 W,R/TP , 6 U100 IC EUSY0300501 QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF Transceiver, 8X8X0.9 IC EUSY0300502 QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx Description Part Number Spec 6 U101 PAM SMPY0014001 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band 6 U102 COUPLER,RF DIRECTIONAL SCDY0003403 -18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~ 1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP 6 U103 PAM SMPY0014201 28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD , 6 U104 IC EUSY0073401 SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free 6 U201 IC EUSY0318401 CSP ,409 PIN,R/TP ,WEDGE Baseband Platform 6 U300 IC EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree 6 U301 IC EUSY0332001 FBGA ,137 PIN,ETC ,512M(64Mx8) NAND+512M(16Mx32) SDRAM , ,IC,MCP 6 U302 IC EUSY0232812 SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO 6 U303 IC EUSY0319001 WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO 6 U305 IC EUSY0238702 TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154 Low cost version) 6 U400 IC EUSY0250501 SC70 ,5 PIN,R/TP ,Comparator, pin compatible to EUSY0077701 6 U401 IC EUSY0300101 WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog Switch, PB-Free 6 U402 IC EUSY0176401 MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER 6 U500 FILTER,SEPERATOR SFAY0007402 900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006 6 U501 IC EUSY0223001 HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 1.5V 6 VA300 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA301 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 - 171 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 VA302 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA303 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA304 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA305 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA306 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA400 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA401 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA402 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA403 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA404 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA405 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA407 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA408 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA409 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA410 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA412 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA414 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA430 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 VA490 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005 6 X100 VCTCXO EXSK0005703 19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM ,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP 6 X300 X-TAL EXXY0004601 .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 , 5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0087801 6 CN404 CONN,SOCKET ENSY0020001 6 LD400 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD402 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD403 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD404 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD405 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD406 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD407 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 LD408 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED 6 R411 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R413 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R414 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R415 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R416 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP Description Part Number Spec - 172 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. 6 R417 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R418 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R419 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R423 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 SPFY00 PCB,MAIN SPFY0147601 FR-4 ,1.0 mm,BUILD-UP 8 , Description Part Number Spec - 173 - Color Remark 11. EXPLODED VIEW & REPLACEMENT PART LIST Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC 11.3 Accessory Level Location No. Description Part Number Spec 3 SBPL00 BATTERY PACK,LI-ION SBPL0090501 3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC ,50x34x55 , ,BLACK ,Innerpack ,Europe Label 3 SSAD00 ADAPTOR,AC-DC SSAD0024501 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , ADAPTOR,AC-DC SSAD0024502 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , ADAPTOR,AC-DC SSAD0024503 100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.2±0.3V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , ADAPTOR,AC-DC SSAD0024504 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , - 174 - Color Black Remark 35 Note Note