Download BodyCom™ Development Kit User's Guide
Transcript
O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W BodyCom™ Development Kit C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C User’s Guide W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W WW QUALITY .TW SYSTEM W W.100Y OM.T 00YMANAGEMENT 1 W M . O W W C . W C W . CERTIFIED BY DNV W W .T 00Y WW .100Y .TW 1 M . M O W O16949 == W W== ISO/TS C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767085 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41649B-page 2 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 3 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . NOTES: Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 4 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W DEVELOPMENT TW BodyCom™ KIT . W 0 0 W T . 1 0 M . OGUIDE W USER’S W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T Table of Contents . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . .1 Preface ............................................................................................................................ O 7 W M OM W C . W C . Y W 7 .TW W 0 Y......................................................................................................... W W 0 0 W Introduction T . 1 0 T M . . O7 W M Document OM W.1 Layout................................................................................................ C . W C . Y W W 0 Y W TW . W 0 0 W Conventions T Used in this Guide ......................................................................... 8 . 1 0 T M . . W OM W.1 YReading .CO9 OM W Recommended ..................................................................................... C . Y W W 0 W TW . W 0 0 W The Microchip T . 1 0 T M . . 9O M .1 Web Site...................................................................................... W M O W C . O W C . Y W C W 0 11 M.TW Y W W 0 0 WCustomer .Support............................................................................................. T . 1 0 T . . 1 M W M Document Revision History .............................................................................. 11 O W .CO .T O W C . Y W C W 0 Y W W .T 10 13 OM 00 Chapter 1: Introduction ................................................................................................. . .TW 1 M . W M O W .C O W .C Y WDemonstration Chapter 2: BodyCom ApplicationT ......................................................... 21 W 0 Y W W 0 0 Y.C W . 1 29 OM. 0 Kit Hardware . .TChapter 3: BodyCom Development 1 M . W M ........................................................ O W .C O W .C Y W C W . 0 Y W W 0 0 Y W T Appendix A. Development Kit 0 0 M .1 35 M. .1Schematics................................................................ O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 5 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . NOTES: Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 6 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W DEVELOPMENT TW . W 0 0 W T BodyCom™ KIT . 1 0 M . O W W.1 Y.COM W C . W Y W USER’S GUIDE 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T Preface . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . NOTICE .TO CUSTOMERS W 0 0 W T 1 0 T M . . .1 O W M OM W C . W C . Y W W is no exception. All documentation becomes manual 0and Ydated, and this.T W Microchip.1tools TW . W 0 0 W 0 T M . documentation are constantly evolving M meet customer needs, so some actual dialogs Wto our O tothose W.1 may differ .CO .TW OM W C and/or tool descriptions from in this document. Please refer web site . Y W W 0 Y W W .T 10 00 the latest M to obtain documentation available. M . .TW (www.microchip.com) 1 . O W M O W C . O W W .Cnumber. This Y C are W identified with a Y “DS” number is locatedW on the bottom of 0 each W T . W Documents 0 0 W T . 1 0 T M . . page, in front of the page.number. The numbering is 1 M convention for the DS number O W M O W O W C “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the Y.C . W C W 0 Y W .T W document. W 0 0 T . 1 0 T M . . 1 M . W O W CO OM W C W IDE online help.0Y. For the most up-to-date information Y on.development tools, see the MPLAB C W . W . Y T 10 00 to open aM M . menu, and then Topics list. of available online help files. .TWSelect the Help W 1 . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 INTRODUCTION O W M.T O W C . O W using the00Y W W .C Y.C Wbefore ThisW chapter contains 0 general information that will be useful to know W 0 Y T . 0 T . 0 M in this chapter include: WW.1 .1 Kit. Items discussed BodyCom Development M O W .CO O C . Y W C W . 0 Y W • Document Y W Layout .100 .T 10 . .TW M 100 W M • Conventions Used in this Guide O W .CO O W C . Y W C W . 0 Y W WRegistration.100 .T 10 . .TW •• Warranty 00Y M 1 W M . Recommended Reading W O W W .CO .TW Y.C W C . 0 Y W • The Microchip Web Site W 0 0 Y W .1 .T 10 ChangeONotification 00 M . 1 W M . • Development Systems Customer Service W . O W W .C Y W C W . 0 Y W • Customer Support W 0 0 Y W T . .1 .T • Revision History W.10 00 M 1 W M . O WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M LAYOUT .1 DOCUMENT O W O W W C . W C W . Y W W W 00 0 BodyCom Development Y W how to use T Kit as a development . This document describes the 1 0 0 T . . 1 0 M . M tool to emulate and debugWfirmware .1 O The manual layout is as follows: WW board. W on a target O W C . C W . Y W 0 introducesM W – This.1chapter •W Chapter 1. “Introduction” the.T user to the BodyCom 10 0 WW .100Y T . . W M Demonstration Kit and provides ofC O W W . itsOfeatures. WWan overview C W . Y W W 0 Y W T • Chapter 2. “BodyCom Demonstration Application” – This chapter describes W . 0 0 W T .1 . how to work with the supplied BodyCom 1 Demonstration 0 M . 1 W M . firmware. O W O W W W provides a WW Y.C – This .chapter Development Kit 0 Hardware” W 3. “BodyComW T 0 WW .100Y.C M• .Chapter T .1 DevelopmentOKitMHardware and more detailed description of the BodyCom W W O W W C . W C configuration settings. W . W W Kit Schematics” .T 00Y– This chapter WW .100Y .TW A. “Development 1 • Appendix provides the M . W M O W O W W C Development Kit Schematics. . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M ® 2012 Microchip Technology Inc. DS41649B-page 7 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W BodyCom™ Development Kit OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O W O W. USED C . W C . Y W CONVENTIONS IN THIS GUIDE W 0 Y W TW . W 0 0 W T . 1 0 M . O W uses the following documentation conventions: OM W.1This manual C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 TW M . DOCUMENTATION CONVENTIONS O W Examples OM W.1 Description C . W C . Represents Y W W 0 Y W TW . 0 0 W T . 1 0 TW M . .1 font: O W OM Referenced books WArial C . W C W . Y W Italic characters MPLAB IDE User’s Guide W 0 Y W T . W 0 0 W T . 1 0 T M . . text ...is the only compiler... .1 W window Y.CO M OM AEmphasized W W C Initial caps window the Output . W W 0 Y W the Settings.1dialog TW . W 0 0 W T . 0 T A dialog M . O W M W.1 Y.COMA menu W C . selection select Enable Programmer W Y W 0build” W“Save project .before TW . W 0 W Quotes .100 T . A field name in a window or 1 T M . W dialog OM W .CO .TW OM W C . Y W W 0 Y W Underlined, italic text with A menu path File>Save W right angle bracket .T 10 00 M . .TW 1 M . O W M O W C . O W button Click C W 0Y WOK TW . W 0 WBoldWcharacters.100Y.C AA dialog T . 1 T M . . tabM Click the Power tab W M O W .CO .T O W C N‘Rnnnn A number in verilog format, 4‘b0010, 2‘hF1 . Y W C W 0 Y W W .Ttotal number of 10 00 where NMis the M . .TW 1 . O W M O digits, R is the radix and n is a W C . O W W Y.C WW .100Y digit. . W 0 Y.C W T . 0 T M . 1 M . Text in angle brackets <> A key O on the keyboard Press <Enter>, <F1>W O M W .C O W .C Y Wfont: C Courier New W . 0 Y W W 0 0 Y W T . 0 M .1 Plain Courier New #define START Mcode .10 Sample source O W M.T O W C . O W .C Filenames autoexec.bat Y W W .C 0 Y W W 0 0 Y W T . 1 0 0 T . . c:\mcc18\h 0 .1 File paths OM W M W .CO O Keywords _asm, _endasm, W static C . Y W C W . 0 Y W 0 Y W 10 0Command-line options.T -Opa+, -Opa. .TW 1 M . 100 W M O W Bit values 0, 1 .CO O W C . Y W C W . 0 Y W Constants .T 0xFF, ‘A’ 10 00 . .TW Italic Courier W 1 00Y M . 1 W M . New argument file.o, where file canW be O W .CO .TW Y.C WW A variable C . 0 Y any valid filename W W 0 0 Y W .T Square brackets [ ] 10 argumentsOM mcc18 [options] file W.1 00 . Optional 1 M . W . O W W .C Y [options] W C W . 0 Y W W 0 0 Y W T . errorlevel {0|1} .1 .T Curly brackets and pipe W Choice 10of mutually exclusive 00 M . 1 W M . O character: { | } arguments; an OR W [, Y.Cselection WW .100Y WW 00Y.CO .TW 0 WW Replaces T Ellipses... repeated text var_name . 0 Mvar_name...] .1 W M .1 O W O W W C . W C W . 0 Y W W code supplied by void main (void) W 0 0 Y W Represents T . 1 0 0 T . . 1 0 M . user W M .1 O {} ... W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M ® DS41649B-page 8 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O Preface W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. REGISTRATION C . W C . Y W WARRANTY W 0 Y W TW . W 0 0 W T . 1 0 M . O WCard and mail complete itC promptly. OM the enclosed Warranty Registration W.1 Please . W C . Y W W Sending Registration CardW entitles users to receive 0 new product Y in the Warranty TW . 0 0 W T . 1 0 TW M . InterimM Microchip web site.O O software releases are available atWtheW W.1 updates. C . Y.C W W 0 Y W TW . W 0 0 W T . 1 0 T M . RECOMMENDED O W OM W.1 READING C . W C . Y W W 0Kit. Other useful Y guide describes W Development TW This user’s how to use the BodyCom . W 0 0 W T . 1 0 T M . . 1 M are listed below. The following Microchip documents and O W are available M Osupplemental W.documents C . W C . Y W recommended as reference resources. W 0 Y W TW . W 0 0 W T . 1 0 T M . . M ® ICD 3 In-Circuit Debugger .1 O W M OMPLAB W C Release Notes for . W C . Y W W 0the Yinformation on .using W TW . W 0 0 W For the T 1 0 T M . . latest the BodyCom Development Kit, read W OMDevelopment Kit.htm” file (an HTML W.1 forYBodyCom .CO .TW OM “Readme file) in the Readmes W C . Y W W 0 W W subdirectory IDE.T installation directory. The release notes 10(Readme) OM 00of the MPLABM . .TW 1 . W M O contains update information and known issues that may not be included in this user’s W .C W C . Y W CO W 0 Y W TW guide. . W 0 0 W T . 1 0 T M . . M .1 W M O W .CO .T O W C . Y W C W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 9 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W BodyCom™ Development Kit OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. WEB C . W C . Y W THE MICROCHIP SITE W 0 Y W TW . W 0 0 W T . 1 0 M . O web W provides at www.microchip.com. This OMonline support via our web site W W.1Microchip C . C . Y W W files and information site is0used 0 to customers. Y as a means.toTmake W easily available TW . 0 W 1 0 TW M . 1 by usingM web O Wsite containsYthe.Cfollowing O your favorite Internet browser, theW W.Accessible C information: . W W 0 Y W TW . 0 0 W T . 1 0 TW M . 1 SupportO–M Data sheets and errata, application notes and sample O W W• .Product C . W C programs,Y design resources, user’s guides and hardware support documents, . Y W W software W 0 TW . W 0 0 W T . 1 0 T latest software releases and archived M . . M – Frequently Asked Questions .1 O W M OSupport C . W •W General Technical (FAQs), technical C . Y W Wgroups, Microchip 0 Y online discussion Wconsultant program TW . W 0 0 W support T . requests, 1 0 T M . . O W M member W.1 listingY.COM W C . W Y W 0 Wguides, latest.1Microchip TW . W 0 of0Microchip – Product selector and ordering W • Business T . 0 T M . M and events, listings of Microchip .1 listing ofOseminars Wsales offices, press releases, W .CO .TW OM W C . Y W W distributors and factory representatives 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O W W C DEVELOPMENT CUSTOMER WNOTIFICATION Y.C CHANGE WSERVICE.100Y TW . W 0 WSYSTEMS T . 0 T M . M .1 W M Microchip’s customer notification service helps keep customers current on Microchip .CO O W O W C . W C W 0Y Y W products. Subscribers will receive e-mail notification whenever there are changes, .T W 0 0 W T . 1 0 T M . . 1 M . updates, revisions or errata related to a specified product family or development tool of W O W .CO . OM W C . Y interest.W C W . 0 Y W Y W .T 10 00 M . .TW M To register, access.1 the Microchip web site at www.microchip.com, click on Customer O W M O W C . O C registrationTinstructions. W and0follow Change Notification W Y.the WW .100Y 0 W . 0Y.C M.TW M Mcategories are: .1 product group The Development Systems O W O W C . O W W .C Y.C on Microchip WWlinkers .100Y • Compilers – The latest information C compilers, assemblers, W 0 Y W T . 0 0 T . 0 M .1 These include and other language tools. all MPLAB C compilers; all MPLAB W M O W .CO O W C . Y assemblers (including MPASM™ assembler); all MPLAB linkers (including W C W . 0 Y W Y Wobject linker);.1and .T (including MPLIB™ object W.10 00all MPLAB librarians MPLINK™ .TW M 100 M O W .CO librarian). O W C . Y W C W . 0 Y W W T emulators.This .in-circuit – The latest information 10 00 on Microchip . .TW • Emulators 1 00Y M . 1 W M . O ICE 2000 in-circuit emulators. W ICE™ andC includes the MPLAB W .C O W . MPLAB Y W REAL C W . 0 Y W W 0 0 Y W T • In-Circuit Debuggers – The latest information on the Microchip in-circuit . .1 .T debuggers. This includesWMPLAB 10 ICD 3 in-circuit 00 M . 1 W M . debuggers and PICkit™ 3 O . O W W .C Y C W . 0 Y W debug express.WW W 0 0 Y T . .1 .T • MPLAB IDE – The latestW 10 on Microchip 00 M . 1 information MPLAB IDE, the Windows W M . O .C WEnvironment00forYdevelopment Integrated Development systems Wtools. This list isWW .100Y WW 00Y.CO .TW W T . on the MPLAB IDE, MPLAB Manager, M MPLAB Editor and .1 IDE ProjectO W M focused .1 W O W W C MPLAB SIM simulator, as well as general editing and debugging features. . W C W . Y W W W 00 0 Microchip programmers. Y W T These include . 1 0 0 T • Programmers – The latest information on . . 1 0 M . W M production programmers such .1 Oin-circuit emulator, MPLAB W as MPLAB REAL.C ICE O W W W C W . Y W Wand MPLAB.1PM3 3 in-circuit debugger programmers. .T Also included 10 00device WW .100Y TW . .ICD M W M Plus and are nonproduction development programmers such as PICSTART O PICkit 2 and 3. W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M ® ® ® ® DS41649B-page 10 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O Preface W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. SUPPORT C . W C . Y W CUSTOMER W 0 Y W TW . W 0 0 W T . 1 0 M . O W of Microchip through several.C channels: OM products can receive assistance W.1 Users W C . Y W W 0 Y W TW . 0 W •0Distributor or Representative T . 1 0 TW M . M O W OOffice Sales W.1 • Local C . W C . Y W W(FAE) 0 YApplication Engineer W TW . 0 0 W •0Field T . 1 TW M . O W OM Support W.1• Technical C . W C . Y W Wdistributor, representative 0 Y should contact.Ttheir W or field TW . W 0 0 W Customers application engineer 1 0 T M . . 1 for support.OLocal M sales offices are also availableWto W O of M help customers..AC listing W.(FAE) C . Y W W in the backW Y and locations.isTincluded TW sales offices of this document.00 . W 0 W 1 0 T M . . M .1 O M Technical support isO available through the web site at: WW W C . C . Y W W 0 Y W TW . W 0 0 W http://www.microchip.com/support. T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W HISTORY 100 .T 10 M . .TW REVISIONW M . O W M O W C . O W C Revision A (August 0Y Y.C 2012) .TW W TW . W 0 0 WW 1 0 T M . . M .1 W M InitialW release of this document. O .CO .T O W C . Y W C W 0 Y W WRevision B.1(November .T 10 00 M . .TW 2012) M O W M O W C . O C 2.4.2.4. TW W Sections02.1.1, Y.2.3, WW .100Y Revised . W 0 Y.C W . T M . 1 M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 11 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W BodyCom™ Development Kit OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . NOTES: Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 12 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W DEVELOPMENT TW BodyCom™ KIT . W 0 0 W T . 1 0 M . OGUIDE W USER’S W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T Chapter 1. Introduction . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . 1.1 INTRODUCTION O W M W.1 Y.COM W C . W Y W 0 Kit. This M.TW Thank0you for purchasing .Microchip Technology’sW BodyCom Development W 0 0 W T 1 T . . Mand simple solution for integrating .1 provides a low-cost O board the system into WBodyCom Y M O W C . W C . W a wide range of applications. The demonstration software programmed into the W 0 Y W TW . W 0 0 W supplied T . 1 0 T M . . displays informationO M Flash MCU with XLP technology W O20-pin W.1thePIC16LF1829 .C OM W C using on-board LCD and contains firmware to demonstrate the methods ofY working . W W 0 Y W TW . W 0 0 W T . with the 1 BodyCom source code framework. The application demonstrates basic 1 0 T M . . M . W units usingYthe M O W communication between a base station and single or multipleW Mobile CO . O C . W C W 0 Y W TW . method. Contained in the firmware are options1useful for W 0 0 W BodyCom.1communication T . 0 T M . . M application design, as wellW debugging or evaluating aO BodyCom as W a menu system, CO M W . O C . Y W C which allows the user to view mobile devices actively paired to the base station. 0 These W Y W .T W 0 0 W T . 1 0 T M . . applications.have been optimized for quick, efficient and simple adaptation; thus have 1 M W O W in a portable .CO . OM W been designed code method to reduce implementation time of the C . Y W C W . 0 Y W Y W .T BodyCom framework. 10 00 M . .TW 1 M . O W M O W C . O The BodyCom Development Mobile units, which are enclosed Y .CKit also includes W(2)been Y WW 00 0 WW T . within a generic key fob. These Mobile units have pre-programmed with firmware, 1 0 0Y.C M.TW M . 1 M . O W O which allowsW them to communicate with the base station; each unit possessing its own C . O W C Base unit. T Wnumber paired W .C 0Y Y.the unique ID with The Mobile units, onceW powered, will enter W 0 0 Y W . 1 0 0 T . . 0 Mfrom the Base unit. After receivingWa W .a1request is received a Sleep state until request, M O W .CO O C . W C the Mobile units will wake up,Y generate a response and then return to Sleep until any 0Y W . W Y W .T and firmware can easily be adapted 10 00 The mobileMcircuit . .TW other information is requested. 1 . 100 W M Odesigns. Wcustom Mobile .CO O W for quick andW easy unit C . Y C W . 0 Y W Wthe following.1web .Tlatest quick start guide, user’s guide, 10 00site to download . .TW Please visit the 00Y M 1 W M . .C O application firmware, source code and BodyCom GUI executable:W W .CO Y WWbootloader C W . 0 Y W W 0 0 Y W T . .1 .T http://www.microchip.com/Security 10 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 13 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W 1.2 HIGHLIGHTS W 0 Y W TW . W 0 0 W T . 1 0 M . M O W Kit includes these features: ODevelopment W.1The BodyCom C . W C . Y W W 0 Y W TW . 0 0 W Base Unit T . 1 0 TW M . M O W O W.•1PIC16LF1829 C 20-pin Flash MCU with XLP technology . W C . Y W W and controller W 0 Y LCD w/backlight TW . 0 0 W T . • 16x2 character 1 0 TW M . 1 oscillatorOoptions: M O W W• .Multiple C . W C . Y W W 0 Y canned oscillator W TW . W 0 0 W T . - 8.192 MHz 1 0 T M . . M .1 O W M Ooscillator W C - 8.192 MHz crystal . W C . Y W W 0 Y source options: W TW . W 0 0 W • Multiple T . power 1 0 T M . . .1 O W M OM C -W USB Mini-B to .USB-B 5V cable (included) . W C Y W W 0 Y W TW . W 0 0 W - 9V external T power supply (not included) . 1 0 T M . . M (vertical and diagonal) WW .1 pad boardsOdesigns Wcoupling • Two .CO .TW OM C . Y W W 0 Y W W• Full-bridge.1MOSFET .T example design 10 00 LC driverMcircuit M . .TW O W M O W C • Touch/Signal prototyping pins . O W W C Wboard components 0Y Y.Cjumpers to disable W TW . W 0 0 W T • Configuration selection . 1 0 T M . . M .1 W M O W • Four push buttons .CO .T O W C . Y W C W 0 Y W •W One Power LED 00 .T 10 M . .TW 1 M . O W M O W C • One Application LED . O .C Wstorage WW .100Y . W 0Y Y.C WWprogram.1Flash T • On-chip memory and EEPROM . 0 T M . M O W M O WBootloaderYsupport • MCP2200 with for easy firmware upgrades .C O W .C(+9V, Y Wprototyping C W . 0 W W 0 0 Y W T • Generous area with +5V, +3V and GND rails) 0 M .1 M. .10 O W M.T O C • Support for all W Microchip compatible programmers and emulators . O .C W W .C Ystand-alone WWfor .100Y W 0 Y W T • MCP2035 is a single-channel Analog Front-End (AFE) device . 0 0 T . 0 .1 detection OM W M low-frequency (LF) signal W .CO O W C . Y W C W . 0 Y W Y .T 10 . .TW Mobile UnitW W.100 M 100 W M O technology .CO • PIC16LF1827 18-pin Flash MCU with XLP O W C . Y W C W . 0 Y W .Texample design hex inverter full-bridge 10 00 LC driver circuit . .TW • Low-powerW 1 00Y M . 1 W M . W .C • Example key fob W design O W W .CO .TW Y C . 0 Y W W 0 0 Y W .1 .T • Plastic case 10 00 M . 1 W M . O W . • Two Application LEDs O W W .C Y W C W . 0 Y W W 0 0 Y W T . 0 EEPROM storage .1 .T • On-chip program Flash memory 1and 00 M . 1 W M . O W • ICSP™ programming pads C W Y.Analog WW .100Y WW 00Y.CO .T•W 0 WW stand-alone T . MCP2035 is a single-channel Front-End (AFE) device for 0 M .1 W M low-frequency (LF) signalWdetection .1 O W O W W C . C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M IN THE KIT .1 1.3 WHAT’S O W O W W C . W C W . Y W W Development W Kit includes.1the 10 00following: M.T WW .100Y The . .TBodyCom W M W unit) Y.CO O • BodyCom Development BoardW(Base W W C W . W W W 0 Y W T . 0 0 W T .1 . Mobile units with unique identification • (2) to Base unit) 1values (pre-programmed 0 M . 1 W M . O W O • (2) Plastic key fob containers W W W .C W Y W W 0 W T . 0 WW .100Y.C • M T USB. mini-B cable M .1 W O W O W W C • BodyCom Development Kit Quick Start Guide . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 14 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Introduction OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M . O W OBOARD W C . W C . Y W 1.4 DEVELOPMENT FEATURES W 0 Y W TW . W 0 0 W T . 1 0 M . M Unit Hardware O W OBase W.1 1.4.1 C . W C . Y W W 0 1-1. The board Y of the BodyCom W is shown in.1Figure TW . 0 0 W T . 0 TW M A picture Development Board M O W W.1 includes C . W theO below components, as indicated in the diagram: C . Y W 0 Y header .TW W TW . 0 0 W 1 0 TW M . A. Expansion O W OM W.1B. LCDY C . W C . Y W w/backlight W 0 W TW . W 0 0 W T . 1 0 T M . . crystal O W M OM W.C.18.192 MHz C . W C . Y W W 0 Y canned oscillator W TW D. 8.1920MHz . W 0 W T . 1 0 T M . . .1 O M OMFlash MCU with XLP technologyWW E. PIC16LF1829C 20-pin W C . . Y W 0 Ysignal mixer .TW W TW . W 0 0 W F. SA612AD 1 0 T M . . M .1 CMOS opOamp W WMCP602 .CO .TW OM G. W C . Y W W 0 Y W W H. Three.1application .T 10 00 push buttons M . .TW M O W M O W C . O W C I. MCP2035 Analog (AFE) W device C 0Y Y.Front-End W TW . W 0 0 WW T . 1 0 T M . . M J. 12 MHz.1 crystal W M O W .CO .T O W C . Y W C W 0 Y W K. MCP2200 W .T 10 00 M . .TW 1 M . O W M L. Mini-B USB connect O W C . O W W Y.C WW .100Y . W 0 Y.C W T M. Software MCLR button . 0 T M . 1 M . O W M O W .C O N. ICSP header W .C Y Wprogrammer C W . 0 Y W W 0 0 Y W T 0 0 M .1 O. (2) MCP 1703.1 LDO M. O W M.T O W C . O P. 9V power W supply connector W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 .1 area OM Q. Generous prototyping W M W .CO O W C . Y W C W . 0 Y W A more detailed discussion of each feature and its configuration is provided in Chapter Y W .T 10 00 Kit Hardware”. . .TW 1 M . 3. “BodyCom Development 100 W M O W .CO O W C . Y W C W . 0 Y W .T 1-1: BodyCom 10 00 BOARD LAYOUT . .TW FIGUREW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 15 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OMUnit Jumpers W. 1.4.2Y.CBase C . W Y W W 0 W TW . W 0 0 W T . 1 0 M . M O for Wof jumper configurations BodyComO Development Board has a versatile range W.1The C . W C . Y W future0application expansions Figure 1-2 shows0 the Wand prototyping. W 0 required default Y TW . W T . 1 0 TW M . 1 configuration for use of the BodyCom DevelopmentW Board application firmware. M O O W.jumper C . W C . Y W Figure 0 1-3 BodyCom Development 0 the jumperM.TW Yhas an image of.TtheW W Board highlighting 0 W 1 0 TW . the diagram: .1 as indicatedOin M O W Wlayout C . W C . Y W Clock 0 Y Select (J14).TW W TW . W 0 0 W 1.2. .Mixer 1 0 T M . . 1 oscillatorO M (J15 – OSCI, J16 – OSCO) WW Crystal enable O M W C . C . Y W Touch (Top) and Signal W(Bottom) expansion Y W pins (J9) .100 TW . W 0 W 3.4. Prototype T . 0 T M . M (J7), Signal coupler connector .1 sensor pad connector Touch (J11) O W M O W C . W C . Y W pad WLC signal to padW 0 Yenable (J10); connect TW . W 0 0 W 5.6. Coupling T . 1 0 T M . . M connects canned to OSCI (J17) .1 oscillator [D]O Canned enable; W W .CO .TW OM W C . Y W 7. Base Board Demo Functionality Jumpers: W 0 Y W W • [1-2]:.RC2, .T 10 00Touch SensorM M . .TW 1 (coupling pad) O W M O W C . O W C • [3-4]: RC3, MOD_OUT driver circuit) 0Y Y.C (used by.TLCW W TW . W 0 0 WW 1 0 T M . . M by LC driver circuit) .1 MOD_OUT_NO(used • [5-6]: RA2, W M W .CO .T O W C . Y W C • [7-8]: RA1, SW_DET (push button enable) W 0 Y W 0 _RX (enable W• [9-10]: RC7, .Treceive circuit) 10 0ENABLE M . .TW 1 M . O W M O W C . O WSelect: 00Y.C 8. Input W WW .100Y . W Y.C W T . T M . 1 • [1-2]: Input on RA4; push buttonM enabled . O W M O Won RA3; pinYselects O W .C OSCO.TW Y.C WInput C • [2-3]: . 0 W W 0 0 Y W 0 M .1 M 9. Bootloader MCP2200 .10 Functionality: O W M.T O W C . O W USART_TX • [1-2]: RC5, W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 • [3-4]: RC6, USART_RX M .1 W M O W .CO O W C . Y W C USART_RTS • [5-6]: RA3 (software MCLR), W . 0 Y W Y W .T 10 00 . .TW 1 • [7-8]: RC7, USART_CTS M . 100 W M O W .CO O W C . Y W 10. Power Supply Select: C W . 0 Y W 0 Wexternal power .T 10 0supply . .TW • [1-2]: +9V 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW • [3-4]: +5V USB C . 0 W W 0 Y W .1 .T 11. Touch indicator LED enable 1 00 M . 1 W M . O W . O W W C . Y W C W . 0 Y W W 0 0 Y W T BodyCom BOARD . .1 .T FIGURE 1-2: 10 JUMPEROCONFIGURATION 00 M . 1 W M . W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 16 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Introduction OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M WLAYOUT Y.CO O1-3: W. W C . FIGURE BodyCom BOARD JUMPER W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 17 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM Unit Hardware W. 1.4.3Y.CMobile C . W Y W W 0 W TW . W 0 0 W T . 1 0 M . M Development Board is shown O W picture of the BodyCom in Figure 1-4. The board O W.1Aincludes C . W C . Y W the diagram. W as indicated inW 0 Ythe below components, TW . 0 0 W T . 1 0 TW M . O W battery OMclip W.1.1 +3V 2032 C . W C . Y W 0 Y Indicators .TW W TW 2. (2) 0 LED . 0 W 1 0 TW M . O W OMpads W3..1ICSP programming C . W C . Y W W 0 Y W TW inverter . W 0 0 W 4. .Hex T . 1 0 T M . . 1 M (AFE) device O 5. Analog W M OFront-End WMCP2035 C . W C . Y W Wwith XLP technology 0 Y 18-pin Flash.T W TW MCU . W 0 0 W 6. PIC16LF1827 1 0 T M . . .1 module (a) and O 7. W Mobile coupling pad (b) W M OM C . W C . Y W W 0 Y W TW casing . W 0 0 W 8. Key fob T . 1 0 T M . . 1 OMMOBILE UNIT HARDWARE WW W.1-4: .CO .TW OM C FIGURE BodyCom . Y W W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W O DEVELOPMENTW KIT OUT OF THE Y.CBOX .TW WW .100Y WW 001.5 W 0 Y.C USING.THE W 0 T M Development Kit may WW .1platform, the BodyCom intended as a development M Although .1 O W O W C . also be used directly from the as a demonstration forW the pre-programmed W W W 00 0Y platform Y.C WWbox T . 1 0 0 T . PIC16LF1829 microcontroller. The (2) PIC16LF1827 devices on the Mobile units are . 1 0 M . W M also pre-programmed to workW .1 O Wthe demonstration with platform. In addition, the O W W C . C W . Y W BodyCom .T 10 0for0easy prototyping. WW .100Y . .TW Mobile Unit hasWbeen designed 1 M . W M W Application” on the O Refer to Chapter 2. “BodyComWDemonstration W W CO forTdetails . C W . Y W W W 0 Y W demonstration code operation. . 0 0 W T .1 . 1 0 M . 1 W M . O W Kit Hardware” on O Refer to Chapter 3. “BodyCom Development W W .C for details W W Y W W 0 W T and expansion using the Mobile unit design. . 0 WW .100Y.C prototyping T M .1 W M. O W O W W C . W C W . W PROGRAM W .T 00Y 0Y WW 1.6 .10DEMONSTRATION .TW 1 M . W M Oand PIC16LF1827 W O W W The pre-programmed example code on the PIC16LF1829 .(base) C W C W . W 0Y web siteM.T W from the 0Microchip WW .100Y (mobile)Mdevices TWis available for download . 1 . ). All required provided, so that the (http://www.microchip.com/Security O W W CO .are WW project00files C W . Y W W code may be used as an example orW a platform for further development. These may be W Y T . 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 18 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Introduction OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O W Othe W. C . W C W . used with included PIC16LF1829 (base) and PIC16LF1827 (mobile) device by Y W W 0Microchip programming Y W kit or any.other Tpro. W 0 0 W T . 1 0 gramming the device using a PICkit™ starter M O W W.1 tool.Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W OM W.1 Y C 1.7 W REFERENCE DOCUMENTS . W C . Y W 0 section, these W TW . 0 0 W T . 1 0 TW M . In addition to the documents listed in the “Recommended Reading“ M O W W.1documents C . W areO also available from Microchip to support the use of theY BodyCom C . W 0 Y Kit: .TW W TW . W 0 0 W Development 1 0 T M . . O M OM Data sheet” (DS41391) WW W.• 1“PIC16(L)F1826/1827 C . C . Y W W (DS41440) W 0 Y TW . W 0 0 W T . 1 0 T • “PIC16(L)F1825/1829 Data sheet” M . . M .1 O W M O W C . • “MCP2035 Data sheet” (DS22304) W C . Y W W Technology”W(DS01391) .100 Y TW . W 0 W • “AN1391 T . 0 T Introduction to the BodyCom M . M Bootloader for PIC16 and PIC18 .1 W OSerial .CO .TW OM •W “AN1310 High-Speed Devices (DS01310) W C . Y W W 0 Y W W • “PICkit™ .T User’s Guide” (DS51553) W.10 020Programmer/Debugger M .TW 1 M . O M O W C . O • “PICkit™ 3 Programmer/Debugger User’s Guide” (DS51795) W C C W 0Y Y‘n.Tricks W TW . W 0 0 WW T . 1 0 • “Compiled Tips Guide” (DS01146) T M . . M .1 W M O W .CO .T O W C . Y W C W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 19 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . NOTES: Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 20 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W DEVELOPMENT TW BodyCom™ KIT . W 0 0 W T . 1 0 M . OGUIDE W USER’S W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W Application TW . 0 0 W Chapter T 2. BodyCom Demonstration . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . 1 chapter describes application that isW pre-programmed onO the M OMthe demonstration(Mobile) W.This C . W C PIC16LF1829 (Base) and PIC16LF1827 microcontrollers, which demonstrates . Y W W 0 Y technology in.T W TW . W 0 0 W the 1 BodyCom a working application. In the process,.the application 1 0 T M . . O W M OMof these two microcontroller families W highlights various features while utilizing peripherals C . W C . Y W Wsystem. 0 W TW . of the W 0 0Ythe complexity W to help.1reduce T . 1 0 T M . . W OM W .CO .TW OM W C . Y W W 0 Y W 2.1 INITIAL SETUP W .T 10 00 M . .TW 1 M . O W M O W C Although intended as a development platform, BodyCom Development Board is also . O W C C Was a demonstrationWplatform. The.demonstration 0Y Y.directly TW . W 0 0 WW T designed to be used from the box . 1 0 T M . .1 Wmicrocontroller M firmware pre-programmed intoM both the PIC16LF1829 and PIC16LF1827 O W .CO .T O W C . Y W C W 0 Y is ready for immediate use. W W .T 10Mobile OM 00 firmware on M . .TW 1 . W M The demonstration the Base unit uses the on-board LCD to display O .C O W C Y WW mode W 0 ID information, of .operation, navigate debug menu system or view valid paired Y W . W 0 0 Y.C W T . on the Mobile unit runs through W 1 setup 0 M . .T 1 M Mobile IDs. The demonstration firmware a short . O M O .C O Wrequest, thus .C waking only state then quickly entersY Sleep to respond to base W station Y WW C W . 0 W 0 0 Y W T . 0 entering the maximum mode. M .1 M .10 power-saving O W M.T O W C . O WConfiguring WHardware WW .100Y .C Y.CConnecting.Tthe 2.1.1 and W 0 Y W 0 0 T . 1 board, verifyO 0 M .the W M W To get started with that it is properly configured: .CO O W C . Y W C W . 0 Y W Y Wthat a power.1source .T power supply select (J2; Pins 10 00 is selected.MPopulate 1. Verify . .TW 100 W M W pins: Y.CO [2:3], Mid-Bottom .CO O W Y W C W . 0 W 0 power supply. W[1:2] – External .T included) 10 0+9V a. Pins (Not . .TW 1 00Y M . 1 W M . W O W W b. Pins [2:3]W – +5V USB cable. (supplied .CO in kit).TW Y.C C . 0 Y W W 0 0 Y W .1 .T 10the touch LEDOindicator. 00 2. Populate (J11) to enable M . 1 W M . W O W W .Cby populating.T(J14; Y. W oscillator0source 3. Select an external Pins [2:3], Mid-Bottom C W . 0 Y W W 0 0 Y W .1 .T pins). 1 00 M . 1 W M . O W .C for use..T W oscillator00isY – Crystal selected * W WW .100Y WW 00Y.CO .TW a. Pins [1:2]W .1 is selectedOforM b. Pins [2:3] – Canned oscillator use. W M .1 W O W W C . W C W . Y W W 4. Populate the canned W 00 0 (J17). M.T Y W oscillator.1enable 1 0 0 T . . 0 W Enable (J15, J16) unpopulated. * M 5. Leave Crystal Oscillator .1 O W O W W C . W C W . Y W Populate Coupling WPad Enable.(J10). 10 00 (J8). M.T WW .100Y . .T6.7.WPopulate 1 W all base board demo functionality M W O W W .CO .TW W C . Y W W 8. W Populate Push Button Enable (J19; Pins [1:2], Left-Mid pins) 0 Y W 0 0 W T .1 . a. Pins [1:2] – Enable OSCO*W.1 0 M 1 W M . O O W .C W W WW T Pins [2:3] – EnableW push buttons 00Y . WW .100Y.C M.Tb.W .1 (J5). OM W W 9. Populate Bootloader MCP2200 Functionality O W W C . W C W . W 0is0Y WW .100Y via ICSP while.(J5) populated. M.T .a.TDOWNOT reprogram W 1 W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 21 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W application OM W. C . W C . b. For GUI functionality (J5) must be populated; Demo will work Y W W 0 Yregardless of (J5) W TW . W 0 0 W T . 1 0 configuration. M . O W W.1 Y.COM W C . W Y W 0 W jumper.1alterations. TW Note: Selecting crystal oscillator requires multiple . 0 0 W T . 0 TW M 1 O W OM table is shown in Figure W W.Default C . jumper configuration 2-1. C . Y W W 0 Y W TW . 0 0 W T . 1 0 TW M . M TABLE .1 2-1: OJUMPER O W WFIGURE C . W C . Y W W 0 Y W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 2.2.T DEMONSTRATION PROGRAM M. .1 OPERATION O W M O W C . O C on-board LCD W program00uses W .C Y.the WW The demonstration for basic menu system navigation 00Y W Y W T . 0 T .1 . 0 M .1 information. The and to display all relevant demonstration firmware has been develW M O W .CO O W C . Y W oped to present a real world application using the BodyCom protocol source code to C W . 0 Y W Y W of the BodyCom .T applications quick and easy;W.10 00 system intoM .TW make adaptation existing 1 . 100 M O or to show proof of concept. W Wfrom concept .CO O making it easy toW move toC prototype The . Y C W . 0 Y W 0 to demonstrate W allows .the10user T BodyCom system in two oper- .10 program .the .TW application 00Y M 1 W M . ation modes, supplies multiple Odebug states within an easy menu strucW helpfulYsystem .C O W W C . Y W C W . 0 W ture and a list of valid paired Mobile0IDs. The BodyCom Development Board permits W 0 Y W T . circuit along with functional W.1 0 working reference .T the user to experiment withWan.1existing 00 M 1 M . O . O W W C designsTusing .circuit Y firmware or can easilyW be adapted into new the prototyping W space C W . 0 Y W 0 0 Y W . is show below in Figure 2-2. W.1 .T provided on the board. The application 10 firmware flowchart 00 M . 1 M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 22 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Application OM BodyCom Demonstration W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O WFIRMWARE O2-2: W. C . W C . FIGURE BodyCom DEMONSTRATION FLOWCHART Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O 2.3 DEMONSTRATION INITIALIZATION PROCESS WW .C Y WWPROGRAM C W . 0 Y W 0 0 Y W T 1 0 device will firstMrun. through its initialization process.W 0 M .1PIC On power-up, the The. demo O M.T O W C . O W it as an00Y .C fuse setting by W configuring specific W modifications include disabling the MCLR W .C Y W 0 Y W T . 0 0 T . will be done via firmware by enabling the Inter- .1 input. The MCLR functionality 1 0 M . W M O W .CO O rupt-On-Change (IOC) feature on the RA3 pin; inside the Interrupt Service Routine W C . Y W C W . 0 Y W 0 The FOSCMbits.Tare configured to External Clock, .10 Y (ISR) aW software Reset is 0used. .TW 1 . 100 WNo M High-power modeW (ECH) and run fromO the on-board 8.192 kHz canned oscillator. CO . O W C . Y W C W . 0 Y W Configuration Words (fuse) W .T by the demonstration program. 10 00 settings areMrequired . .TW other 1 00Y . 1 W M . The following descriptions O for demo specific functions. These W highlightYinitialization O W are 00Y.C W .CTechnology C W . W not required forW use with the BodyCom system: W 0 Y W T . 0 .1 .T 1configured 00 M . 1 W M . • Timer0 – This module is to generate an interrupt-on-overflow and a O W O W W .Cusing the ISR.Tused Y. W system is0created C W . 0 Y small TICKW counter for state refreshW rates. W 0 0 Y 1 .T 00 M This allows different states.1 to update the LCD display at a rate which is applicable W. 1 M . O W W .byCthe software The LCDW display is controlled created TICK flag, while W Y W WW 00Y.CO .TW tothethem. 00Y 0 W T . 1 0 . flags set rate (refresh speed) is controlled byM the variable TickTmr. 1 . W M .1 O Wconfigures Y O W • BTN_Init() – This function the.C push buttons S2W (UP), S3 (DOWN), S4 W W C . W W W(SELECT) for basic 00 0 BodyCom demonstration Y W operation with T firmware. . the 1 0 0 T . . 1 0 M . W M • BTN_Update() – OnceW .1 O W the buttons configured, can be managed by calling the O W W C . C W . Y W 0 0 the current W Within this.1function, function BTN_Update(). states .T of each button will 1 0 WW .100Y . .TW M W M be stored and a de-bouncingW will be handled O W W .COtheautomatically. W process C W . Y W W • BTN_Get() – After BTN_Update() has been called, function BTN_Get() will W 0 Y W T . 0 0 W T .1 . return any press states for use W 1 0 M 1 with.navigation. ThisO code is very portable, allowW M . O W it to be easily adapted toW any type of application been W written in a WW Y.Cand has also W 0 W T . 0 WW .100Y.C M.ing T very expandable method. M .1 W O W O W W C . the • RESET() – Because the S1 is to be used as a software controlled MCLR, W C W . Y feature on the.TRA3 pin. This W W along with 0the0IOC WW .100Y on-chip .TWweak pull-up is enabled 1 M . W M O is pressed, regardallows the PIC device to jump to theW ISR whenever this button O W W C . W C W . W Wdemo applicationsWcurrent state..1From 0Y T will be less of the the ISR, the PIC.device 0 WW .100Y T . M M the RESET() command, allowingW a software MCLR. The O on-board Ogiven W W C . W C W . debug/application LED connected to RA0 is then configured as an output and Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M ® 2012 Microchip Technology Inc. DS41649B-page 23 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O W O W. ready C . W C . for use. Y W W 0 Y – The LCD.Tdisplay W for use by.1calling TW . W 0 0 W 0 M • lcd_init() is then configured the function Ofor W OM W.1 lcd_init(), C . W which contains the function i2c_init() and configure the PIC device C . Y W W 0 Ycommunication.with W (COG).1controller. TW . 0 0 W T C™ the LCD’s Chip-On-Glass I 0 TW M M O Wand headerYfile.Clcd.h O W.•1lcd_st7032.c and lcd.h – The source file Icd_st7032.c W C W . W W for working withWthe LCD display. 0 Ymultiple functions.Tuseful 0 0 W contain However, it is M.T 1 0 TW . 1 Mthe BodyCom demonstration software O Wuses customY.functo noteO that W.important C W C . W Wcan be refreshedW tions to0 load to update the LCD. 0 Y a LCD buffer,.which TW . W 0 W T 1 0 T M . . 1 descriptions .following O W functions. M The specific These OMhighlight initialization for BodyCom W C . W C . Y W W for Technology system: 0 Yuse with BodyCom W TW . W 0 0 W are required T . 1 0 T M . . .1 – This function O WCVD mTouch™ M • TD_Init() configures the pin RC2 for use with the OM W C . W C . Y W W of scanning. 0 Y W TW . W 0 0 W • method T . 1 0 T M . . M detection feature is easily implemented TD_CvdHandle() TheO touch W by callingY.CO W.1 Y–.C OM W W the function whenever a touch scan is required. This makes the use of the CVD W 0any W to integrate TW . W 0 0 W mTouch scanning T . 1 0 T M . . easy to use, very versatile, making it easy into M .1 W M O W .CO .TW O future application. W C . Y W C W 0 Y W W T is called to fully initialize the PIC .function 10 00 • BC_HardwareInitSystem() – This M . .TW 1 M . O W M O W C device being used for BodyCom Technology applications. This function is stored . O .C W C W which is accompanied Y WW by .the100Y .T W within the source0 file bc_hardware_timer2.c, 0 W T . T M . 1 M . W header fileW bc_hardware_timer2.h. O .CO . OM W C . Y W C W . 0 Y W • bc_hardware_timer2.h – The bc_hardware_timer2.h file contains a large Y W .T 10 00 M . .TW 1 M . number of defines allowing for a O wider range of customizable configurations, for O W M W C . O C BodyCom T example, Technology TMR2 W to use TMR1, Y.the WW 00Y 0depending WWthe ability.1to0select 1 0Y.C M.TW M . (demo), TMR4 or TMR6, onM the.available peripherals in an application; O W O W C . O source files for these variations can be found in the BodyCom Application folder. W – After 0the0BodyCom Wsystem is configured, .C 0Y Y.C Technology WW W 0 Y W T . • BC_TimerON() the 1 0 T . . 0 Mthe system. This macro is modified .1is called for useOwith W M W macro BC_TimerON() .CO O W C . Y W C W . 0 Y W on the TMR defined0within 0 bc_config.h. Y W .T 10 . .TW • based 1 M . 100 W M board_GuiEnable – To enable use of the BodyCom Application GUI with the O W .CO O W C . Y W C W . 0 Y W BodyCom Development Kit, the function PC_comInit() is called to configure the .toTUART Serial communication W.10 00 .TW system forW 1 00Y M . communication with a PC via USB 2.0 1 M . O W W using the MCP2200. Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T • CheckPairedList() – TheWfinal 1 step before finishing 00 the initialization process is to M . 1 W M . O . O W call the function BC_ProtocolCheckPairedList(), willW read from the on-chip W .C which.T Y W C . 0 Y W W 0 0 Y W to decide which Mobile paired to the Base unit and will .1 .T EEPROM 10IDs have been 00 M . 1 W M . O W be considered valid during communication. Mobile IDs can be added, viewed or Y.CGUI. .TW WW .100Y WW 00Y.CO .TW deleted from within BodyCom Application 0 WtheW 0 M .1 W M After completing the initialization .1 O W process, the LCD will display the BodyCom O W W C . W C W . Y W W Development Kit welcome W 00 0indicating the current Y W splash screen, Tfirmware version in . 1 0 0 T . . 1 0 M . will change and theO user can begin menu navigation W M use. After a short time, the display .1 W O W W C . W C or BodyCom demonstrations. W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O MENU SYSTEM W W 2.4 YBodyCom WW 00Y.CO .TW C . W W W W 0 W T .1 . the main menu location, the userWhas.1four selections:OBodyCom 0 M 1 W M . From Eval Touch, O W W .CID. This simple W W Eval Proximity, Debug Menu and View 0 Mobile menu system Y W W W T . 0 WW .100Y.C BodyCom T 1 S3 (DOWN)Oand can navigated using the push buttons; S2.(UP), MS4 (SELECT). The W Mbe.does W O W W C menu have a rollover feature implemented, meaning that if the user presses . W C W . Y will move.Tto “BodyCom W 00navigation WW .100Y DOWN while in the “View MobileW ID” menu state, the .TW 1 M . W M O will rollover to Eval Touch”; vice versa pressing UP, whileW in “BodyCom Eval Touch” O W W C . W C W . W WThe SELECT button Mobile based on the current W is multi-purposed .T state. 00YHowever, WW .100Y “View .TID”. 1 M . M SELECT has no actions, while in “BodyCom Eval Touch”. when in “BodyCom O W O W W .C C W . Eval Proximity”, the SELECT buttonW will W Start/Stop the TX/RX function of theT coupling Y W W W 0 Y . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2 DS41649B-page 24 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Application OM BodyCom Demonstration W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W“Debug Menu” OMthe SELECT button while in either W. C . W C W . pad. Pressing the or Mobile Y W W options, allowing 0 debug“View Y will Enter/Exit.Tthose Wthe user to view TID” . W 0 0 W 1 0 state the menu states M . M .1 paired Mobile O by againor W O W C IDs by pressing SELECT and then exit back to the main menu . W C W 0Y W TW . 0 0Y. SELECT. WW .10pressing T . 1 TW M . O W OM Touch Mode W 2.4.1Y.CBodyCom C . W Y W W 0 W TW . 0 0 W T . 1 0 TW M . M Touch mode allows the user O WdemonstrateYthe.CBodyCom BodyComO Evaluation to W.1The W C . W W Technology system through useW of a dual-purpose coupling 0 pad. M.TW Y communication W 0 0 W T . 1 0 T . . 1 2-3 describes the dual-purpose coupling pad; the vertical diagonal coupling O_” on W and M OasM W.Figure C . W C pads are the same described. The LCD screen should display “BodyCom Eval . Y W W when the.system W 00 is ready. TheM.TW 0Ythe bottomM W TWread “Wait for Touch” 1 0 T the.1 top line, line.should . Oto W M O corner of the first line is used as aW W C symbol in the top right CVD state indicator..Refer C . Y W W 0 W TW . W 0 0forYa description. W Figure.12-4 T . 1 0 T M . . M O O W the coupling Touching pad, the indicator green LED (D4) willW turnW on and the bottom .Cline OM C . Y W W 0 Y W TW . W will change to “Searching…..” as the Base unit issues out a1command indi0 0 W of the LCD T . 0 T M . . 1 M Mobile ID. If the user has a valid W unit in possescating it. is searching forO a valid Mobile M W .CO .TW O W C . Y W C sion, the LCD will display the Mobile’s ID on the bottom line of the LCD. Also, the W 0 Y W 0 begin to blink W indicator .LED .T 10 unit will OM 0will . .TW 1 indicating valid communications. The Mobile M W M O W a red LEDY(D1) .C W As long0as0the also as the Mobile unit transmits. .C begin to blink Y Whave CO W W .T W 0 W T 0 user stays in.1 possession or within a.range of the Mobile unit, the Base and.1 Mobile will T M . M WIf the user Y.CO Oinstance indicated by the blinking W continueW to communicate each LEDs. OM C . W C W . Y W . W breaks contact with or is.out 0will0 0the Base unit M Y W T of range of the Mobile, the firmware 1 0 T M . . 1 . O W return to “Wait for Touch” state. M O .C O W .Cin contact with Y WW C W . 0 Y W W If the user continues to stay the coupling pad and no valid Mobile ID is 0 0 Y W T . 0 M .1 M“Searching…..” .1will0continue to O O W found, the display show until the CVD indicator changes M.T W C . O .C has a time.Tout, Wtime out. If0the0Y to “#” upon system Wthe CVD will re-initialize .C WWand wait.1for00Y W Y W 0 T . 1 require the user 0 another touch.This.will to remove the touch and then return W it before M M O W .CO O W C another scan can occur. . Y W C W . 0 Y W Y W 10 00 PAD M.T . .TW 1 . 100 W M FIGURE 2-3: COUPLING O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 25 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O OM CVD TOUCH INDICATORSWW W. FIGURE C . C . 2-4: Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W2.4.1.1 BodyCom MODE .T 10 00 PROXIMITY M . .TW 1 M . O W M O W C . O W TheW BodyCom Evaluation allows the user to demonstrate the .CProximity mode C W 0Y Ycommunication W TW . W 0 0 W T . BodyCom Technology system through use of a single coupling pad. 1 0 T M . . Mthe user to trigger the BodyComWTechnology .1 W M O This mode of communication allows W CO . O C . Y W C W 0 Y W scanning .T W 0not 0 non-touchMbased W process.1through T methods. Because this method does . 1 0 T M . . use the CVDW mTouch method, no W Oindicators are used. CO . OM W C . Y W C W . 0 Y W TheW LCDs first line will display -.Prox” Y T while the second line will show “S4 10to M. .Scan .TW 100the S4“BodyCom M . O Start/Stop”. ByW pressing (SELECT) button, the user put the Base unit into W M O O W .Cstop. .TW Y.C C mode; by W pressing it again, Y it will . 0 W W 0 0 Y W 0 the LCDs bottom 0 M .1 M line will display “Searching……”. .1(S4), O By pressing SELECT IfW a valid M.T O W C . O Wthe valid 00Y .Ccoupling pad, W within range Mobile ID comes of the the Wbottom line will display .C Y W W 0 Y W T . 0 0 T . ID. If the Mobile ID is moved theM coupling pad, the display will return to .1 1 away fromO 0 . W M W .CO O W “Searching…..”W until the user presses the SELECT (S4) button once more. Menu C . Y C W . 0 Y W Y .T SCANNING. can only occur 1 when is NOT 10 00the Base unitM . .TW navigationW . 100 W M O W .CO O W C . Y W C W . Note: This mode of communication is considered an “Intentional Radiator”. 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . W MenuY.CO .C O W W Y WDebug 2.4.2 BodyCom C W . 0 W W 0 0 Y W T . .1 .T The BodyCom EvaluationW 10menu is madeOtoM 00 . 1 Debug help in the development or debug- W M . . O W W .CBodyCom Technology Y W are adapting C ging of applications, which the into their system. W . 0 Y W W 0 0 Y W T . .1 .T These debugging methods are 10into the BodyCom 00 built framework code and should be M . 1 W M . O W as an example on W how to implement them application. W Y.Cinto a user’s WW .100Y WW 00Y.CO .Tused W 0 W T . 0 1 the LCD display the main menu, the user will.see “Debug Menu” on the top line M W M From .1 O W O W C and “S4 to Enter/Exit” on the bottom line. By pressing the SELECTW (S4) button, the user W . W C . Y W W Wthe Debug menu. 00 0 menu, pressing Y WOnce inside.the Tthe SELECT (S4) but. 1 0 0 enters debug T . . 1 0 M W M ton in any state will exit the user .1 O state of the main menu. W back to the “Debug Menu” O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW RECEIVE STRENGTH 1 2.4.2.1 M . W M O The Receive Strength debug menu W W .CO .Tvalue WW C W . Y W W state is used to see a functional for the W 0 Y W 0 0 W T .1 . Signal Strength Indicator (RSSI) 1 on the MCP2035 0 M . 1 Receive pin AFE device, which is W M . O W O to the BodyCom Technology. W W W .C The LCD bottom line will display “RSSI: XXXX”, this W Y W W 0 W T . 0 WW .100Y.C key T value .represents the 10-Bit ADC conversion.1 value used as a RSSI Mto represent the W M of the signal. O W O W strength W C . W C W . Y to 0003 when.Tno signal is W Wfor the most part,W 0of00001 WW .100Y ThisM .Twill, value display a range 1 M . W Othus, the signal pad O W present, when the user makes contactW withW the coupling pad and W C . C W . W W put on the.1line00byYthe user. M.T increase, WW .100Y value will .TW representing noise M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 26 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Application OM BodyCom Demonstration W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O Wuser can useY.this OM W. C W C . By putting a Mobile unit into Continuous Wave, the state W W 0 circuitdebug Y strength based W or for.receive TtoW . W 0 0 W T . 1 0 signal on body location, proximity design debugM O W W.1 ging.Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W OM PACKET W.1 2.4.2.2Y.CRECEIVE C . W Y W W 0Mobile units orM TW . The Receive Packet debug menu state is usedW for debugging with again 0 0 W T . 1 0 TW . M O receives circuit design. In this mode, the Base unit isW put in Continuous Receive O W.1for C . W C . Y W mode0 allowing transmit packets continuously to test 0 circuit 0 reception and Y the mobile.TtoW W TW . W W 1 0 T M . . 1 O W M OM W.design. C . W C . Y W W WAVE W 0 YTRANSMIT CONTINUOUS TW . W 0 2.4.2.3 0 W T . 1 0 T M . . .1 O W M OMWave debug menu state is used W C . The Transmit Continuous to confirm goodY operation W C . W W 0 Y transmit circuit. W TW W 0unit W of the.1Base T This mode allows the user to attach.1 a0 probe to the sig- M. . 0 T . M W station isYoutputnal seeO what strength of the 125 kHz signal W the Base WTX/RX pinsYto.C CO .circuit OM W W 0 W TW ting. The BodyCom Technology system does not require fine LC tuning, the LC . W 0 0 W in this design T . 1 0 T M . . M .1 is being used as a voltage multiplier but by using theW Transmit CW debugO M O W .C O W C . Y W mode the user can make modifications which can increase/decrease Q values based C W 0 Y W TW . W 0 0 W T . 1 0 T M . . on application and design requirements. M .1 W M O W CO . O W C . Y W C W 0 Y W .T W 0 0 LOOPBACK W2.4.2.4 TRANSMIT T . 1 0 T M . . 1 M . W Omenu state allows the user to passW W Loopback TheW Transmit debug a string of data with .CO . OM C . Y C W . 0 Y W 0to 0 LCD will display Y W a valid Mobile ID.0 The “Trans Loopback” on the 1st line and.1 “S4 .T M .TW 1 M . W M Start/Stop” on the bottom. To complete a loopback action, the Base unit must first know .CO O W O W the coupling W Wthe user must either which mobile to communicate this, 0Y Y.Cwith. To do.T Wtouch 0 0 W 1 0 0Y.C M.TW M . pad while in possession or of the coupling Mhave the mobile within proximityW .1 of a mobile O W O W C . O .C a mobile to.Tcommunicate pad before ByW pressing SELECT 0Y Wattempting0to0acquire Wwhen the with. .C Yout W Y W 10 0 T (S4), the Base unit will ping for a Mobile unit, mobile responds the Base . . 1 0 M . W M Owill then transmit a string message W W ID to address. unit will know which It to the Mobile .CO O C . Y W C W . 0 Y W 0 is “Loopback Y unit. For Pass”; on Wthis demo, that .T this message will be displayed 10 0string . .TW 1successful M . 100 W M the LCD 2nd line W when communication is established. O .CO O W C . Y W C W . 0 Y W .T 10 00 . .TW 2.4.2.5 WTOUCH OPERATION 1 00Y M . 1 W M . O Wof the 00Y.C W .CO WWdebug 0menu C The Touch Operation state allows the user to test the functionality W . Y W W 0 Y W T . .1 .T 00 CVD mTouch scanning in.a1system. The bottom line of the LCD displays a [R]aw and M 1 W M . O W . O Woff W an [A]verage value from the CVD conversion. mTouch method is based .C The CVD Y W C W . 0 Y W W 0 0 Y W T average value recorded, when increase in the.raw value is detected, depending .1 .T the 10asana valid 00 M . 1 W M . O W on the shift level, it is registered touch or as noise. This debug menu should .C the touch W W Yintegrate WW .100Y WW 00Y.CO .TWbe very helpful inWunderstanding how to feature into a BodyCom 0 T . 0 M Technology application. W.1 W M .1 O O W W C . W C W . Y W W W 00 Y W IDs .100 T . 1 0 T 2.4.3 View Mobile . . 0 M M .1 Wthe top lineYof.CtheOLCD will readW“Valid Mobile IDs”, WW O W W C Selectable from the main menu, . W W 0Pressing the M W T (S4) button, the LCD . 10 0 WW .100Y T . . while the bottom reads “S4 to Enter/Exit”. SELECT 1 . W M O to the specific Base unit. The W Wvalid MobileYIDs.Crelated O W will reflect that the user is viewing W C W . W W W 0 Y W top line of the LCD will display how many Valid IDs are stored.T into the unit and which 0 0 W T .1 . 1 0 M . 1 W M . O ID value the user is looking at. By using the UP [S2] and DOWN [S3] button, the user W O can browse the paired MobileW W W C [S4] button .SELECT W Y IDs. By pressing0the again, the user W W W T . 0 WW .100Y.C Mwill T . exit back to the main menu. W.1 M W O O W W C . W C W . .Tcan be deleted W W 00orY WW .100Y Note: IDs can be added existing Mobile IDs .TWAdditional MobileW 1 M . M using the BodyCom Application O W W WW GUI.00Y.CO .TW C . W W W Y W 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 27 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . NOTES: Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 28 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W DEVELOPMENT TW BodyCom™ KIT . W 0 0 W T . 1 0 M . OGUIDE W USER’S W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W Kit Hardware TW . 0 0 W Chapter T 3. BodyCom Development . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . 1 chapter provides detailed description of the hardware of the O W features M OMa more W.This C . W C BodyCom Development Kit. W . Y W 0 Y W TW . W 0 0 W T . 1 0 T M . . 1 M O W M OFEATURES W.HARDWARE C . W 3.1 BASEW UNIT C . Y W 0 Y W TW . W 0 0 W The key T . 1 0 T M . . M Development Kit are listed the below. are O W They OBodyCom W.1 featuresthe.ofCorder .C OM W represented inY given in Section 1.4 “Development Board Features” and Y W W 0 W TW . W 0 0 W Figure .1-1. T . 1 0 T M . . 1 M W M O W CO . O W C . Y W C W 0 Y W TW Expansion Header . W 0 0 Receptacle W 3.1.1 .128-Pin T . 1 0 T M . . M W M O W The BodyCom Development Board implements a 28-pin modular expansion interface .CO .T O W C . Y W C W 0 Y W 0expansion isM W(J6). This modular in place .T to allow future interface expansion 1for0 future 0expansion M . .TW 1 . W M Microchip demo boards or for use with custom prototype applications. The .CO O W O W W pin assignments W below in FigureW connector shown 3-1, also, refer to00Y Y.Cfor (J6) are.T . W 0 Y.C W 1refer0 T M . . 1 M Appendix A. .“Development Kit Schematics”. It is recommended that W users O M O W before .C O W modular C the expansion .using ence the on the board. This additional Y Wschematic C W . 0 Y W W 0 0 Y W T 0user to incorporate 0 expansion allows.1 the expansion .1 M.other Microchip demo boards orWallW OM M.T O C of peripheralW features through.C use of the expansion interface. . O W W .C 0Y Y W W 0 0 Y W T . 1 0 0 T . . 0 M CALLOUT FIGURE 3-1: W.1 EXPANSION HEADER W M O .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 29 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OMCharacter LCD with Controller W. 3.1.2Y.C16x2 C . W Y and Backlight W W 0 W TW . W 0 0 W T . 1 0 M . Mthe NHD-C0216CiZ-FSW-FBW-3V3 O W board includes from NewhavenC Display O W.1The . W C . Y W International. write two lines x 16 W the ability toW 0characters, runsMat.TW Y The screen.Tfeatures 0 0 W 1 0 TW . backlight White M display supported by two sideW O WLEDs usedYfor.Cbacklight. O W.31V withYa.3V C W W Oscillator Source 0 W TW . 0 W T 3.1.300 Selectable External . 1 TW M . O W which can OM Board contains two externalWcrystals, WThe.1BodyCom C . C Development be used . Y W W applications. 0 Y of BodyCom.T W TW . W 0 0 W in development Technology 1 0 T M . . M .1 O W M O C . W C •W The external 8.192 MHz (Y2) crystal oscillator is supplied on the board, but is not . Y W WHowever, by altering 0 con- M.TW Y W the default.1jumper W 0 W used.1in 0the0demonstration T . program. T . O Wwith the develM OaM W and Y figuration applying few firmware changes, use of theW crystal C . C . Y W W 0 W TW . W 0 0 easily be achieved. W opment.1kit0can T . 1 T M . . Mcanned oscillator is supplied onW • The external 8.192 MHzO (Y3) theW board and is .CO W OM C . W W Y W used by the demonstration program. The crystal is used by the PIC16LF1829 .TW W 0the0Y 0 source. Also,Mit .isTused by the Signal Mixer [3.2.5] to mix W MCU as its.1clock 1 0 T M . . W M O Wresponse signal CO W C . mobile of 8 MHz into aW 192 kHz signal, which can be received0Y. W CO Y W TW . W 0 0 Wand processed T . 1 0 T by the MCP 2035 AFE. M . . M .1 W M O W CO . O W C . Y W C W 0 Y W 3.1.4 .T W 0 20-Pin Flash W PIC16LF1829 TMCU with XLP Technology .10 . 0 T M . 1 M . O W O W 20-pinY The PIC16LF1829 SSOP MCU with XLP technology was selected for use with Y.C OM W C . W C W . 0 W . 0 0 Base Board. Y the W BodyCom Development This Oscil.Tdevice contains a 32 MHz Internal 1This 0selectable M . .TW 1 M . O W M lator Block with three power ranges or can run from an external crystal. O W low active O W .Ccurrents of.48TW Y.C Wextremely C . deviceW uses A/MHz @ 1.8V and up to 20 nA 0 Y W W 0 0 Y 0 0 M .1 @1.8V during Sleep,.1 while supporting a M large list of internal peripheral featuresW such O M.T O W C . O as 10-bit ADC, DSM, EUSART W5-bit DAC,0(2)0comparators, W and more.WW .100Y .C Y.C W Y W T . 0 T . 0 M .1 Mixer and W M O 3.1.5 Double-balanced Oscillator W .CO O W C . Y W C W . 0 Y W Y .T VHF monolithic double-bal10 00 mixer isM SA612A double-balanced a low-power . .TW The PhillipsW 1 . 100 W M O regulator. This device suppliesW W oscillatorYand anced mixer with on-board voltage a low .CO O C . Y W C W . 0 W 0 low-power systems. Wsolution for.communication .TThe mixer can operate up to 500W.10 0external .TW cost, 1 00Y M 1 M . MHz, requires a low amount of parts, supplies excellent sensitivity, gain and O W .C O W W C . Y W C W . noise protection, while maintaining a low-radiated energy level. 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W . O 3.1.6 MCP602 CMOS W W .C Y W Op Amp C W . 0 Y W W 0 0 Y W T . .1 .T The MCP602 is a low-powerW 10 00 dual-operation amplifierM which utilizes Microchip’s . 1 W M . O C current, high-speed technology high W W to provide00low-bias Won asoperation, Y.The W WW 00Y.CO .Tadvanced W CMOS 00Y T . 1 open-loop gain, andW rail-to-rail output swing. CMOS can run low as 2.7V . 1 M . W M while drawing around 230 W .1 O amplifier. Wquiescent current A of per O W W C . C W . 0 Y W W W 0 0 Y W T . 1 0 0 T . . 1 0 M . W M 3.1.7 User-Defined Switches .1 O W O W W C . W C W . Y W Three push buttons switches provided 0 SW3) areM W (SW1/MCLR, T for user-defined .RB1 10 0SW2, WW .100Y . .TW 1 . W and RB0. When digital inputs. They are connected to the I/O pins, MCLR/RG5, M O pressed, they pull the respectiveWportWpin to ground. W W COthese switches .Using C requires the W W . Y W W 0 Y W T . 0 0 W T .1 . 0 corresponding pin’s internal weak pull-ups.1 be enabled. WhenM the switches are not 1 W M . O W O required, the pull-ups can be disabled. W the ability W consump- WW Y.C to reduce.Tpower 0 WW This .adds 0 WW .100Y.C tionMin.software. TW 1 M W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DD DS41649B-page 30 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Kit Hardware OM BodyCom Development W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y 3.1.8 MCP2035 Analog Front End (AFE) Device W W 0 Y W TW . W 0 0 W T . 1 0 M . Mis an Analog Front-End (AFE) optimized O Wfor BodyCom MCP2035 applications. It is O W.1 The C . W C . Y W a single-channel stand-alone device for low-frequency (LF) signal detection and W 0 Y W TW . 0 0 W T . 1 0 TW M . shortM applications, suchW as BodyCom communications. O O range transponder W.1 low-power C . W C and can The device can detect anW input signal with amplitude as low as ~1 mV . Y W Y an amplitude-modulated W with as low.1as08%0 modulation depth. TW . 0 W T . demodulate input signal 0 TW M O W InterfaceY OM through a simple Serial Peripheral W.1The device C communicates (SPI), operating . W C . W W10 A and standbyWcurrents of 2.A. 0 Y typically around TW . with0currents W 0 0 W T . 1 T M . 1 O W withY M OMUSB 2.0 to UART Protocol W W.3.1.9 C . C . MCP2200 Converter External W W 0 YCrystal W TW . W 0 0 W T . 1 0 T M . . .1 O W M OM W C . W C . Y W W MCP2200 serial converter, which connectivity in 0 Yis a USB-to-UART W enables USB TW . W 0 0 W The T . 1 0 T M . . application have an UART device reduces external components by W256-bytes OM interface. The W.1 thatUSB CO OM W C integrating theY termination resistors. The MCP2200 also has of.inte. Y W W 0 W TW . W 0 0 W grated .user T . 1 0 T EEPROM. The MCP2200 has eight general purpose input/output pins. M . . 1 M functions to indicate USB andW W M O W Four of the pins have alternate communication status. .CO .TW O C . Y W C W 0 Y W W An external.11200MHz canned oscillator .T is used as a frequency source.W.10 M .TW M O M O W C . O W Selectable C W Y.CPower Sources WW .100Y .T W 0 W3.1.10 T . 0 T M . 1 M . Wlisted below:Y.CO The BodyCom Board uses two selectable power sources O W Development OM W C . W C W . Y W W • +9V external power 00 0 supply connected Y W Tto [J3] with [J2] configured on pins<1:2>. . 1 0 T M. . . 1 M . O W An LDOW [3.1.12] is used to create a +5V power rail. Another LDO is used to create M O .C O W .Cwith the PIC.T W power rail0for0Y C a +3.3V use device and other on-board components 00Y W . W W Y W 0 M .1 while using the.1 +5V for the transmit/receive M circuit. O W M.T O W C . O W C[J1] with [J2]Tconfigured • +5V USB on pins<2:3>. An LDO Wcable connected W .C 0Y Ya.to+3.3V W W 0 0 Y W . 1 0 0 T . [3.1.12] is used to create power rail for use with the PIC device while . 0 Mcircuit. .1the transmit/receive W M O W .CO O using the +5V for W C . Y W C W . 0 Y W Y WLED [D3] will.1turn00on when the board .T 10 . The red is powered from either source. .TW M 100 W M O W .CO O W C . Y W C W . 0 Y W 10 00 Header M.T . .TW 3.1.11 WICSP Programmer 1 00Y . 1 W M . Oused by the PICkit™, PICkit™ 3, and The 6-pin programmer header (J4) can be O WICD3 00Y.C W .ofCthe WWThrough C W . Y W W 0 Y W T programming devices. use PICkit 3, the user is capable of debugging 0 or creatingMand. debugging custom software in useW.1 .T 1software 00 . 1 M . the included demonstration W O W W .CO .TW Y. W C . 0 Y W with the BodyCom Development Kit. W 0 0 Y W .1 .T 10 00 M . 1 W M . O W WLDO 00Y.C W WW .100Y WW 00Y.CO .TW3.1.12 MCP1703 W T . 1 voltage regulator M with 250 mA maximum output.WW The MCP1703 is a CMOS, low .dropout M .1 O W O W C . MCP1703 works with input voltage of up to 16V and in combination with its low-current W W .C Y W W W 00 0 Y W T . 1 0 0 T consumption of 2 A is an ideal solution for applications using multi-cell, 9V alkaline or . . 1 0 M . W M one-cell, two-cell and three-cell .1 O Wlithium-ionY batteries. O W W C . W C W . W W W .T 10 00 WW .100Y . .T3.1.13 1 M . Generous Prototyping Area W M O W W .CO hardware, WandWtesting0of0application C W . Y W W W Y W T To assist in the development the XLP board . 0 W T .1 .includes a 24 x 11 prototype areaW 1 installation ofOtheM 0 . 1 W M . for the user’s custom circuitry. O W W C above T .located W theW area. Supplied W for the board power V and ground0are Y W W . 0 WW .100Y.C MSources T . 19 different I/O signals, the prototyping from M range of possible fea.1 area suppliesOa wide W W O W W C tures which can be tested and experimented with from the prototyping area. . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M PP DD 2012 Microchip Technology Inc. DS41649B-page 31 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. CONFIGURATION C . W C . Y W 3.2 JUMPER W 0 Y W TW . W 0 0 W T . 1 0 M . Oare repjumper features Kit W are listed below..They OMof the BodyCom DevelopmentW W.1The C C . Y W W resented in 1.4 “Development 0and Figure 1-3. Yin the order given WBoard Features” TW . 0 0 W T . 1 0 TW M . 1 M Select O W OClock W.3.2.1 C . W Mixer C . Y W W 0 Y W TW . 0 0 W T . 1 0 TW M . of this jumper, the user is able toW select between two exter.1altering the configuration O OM WBy C . W C nal oscillator sources for use with the BodyCom Development Kit. . Y W W 0 Y W TW . W 0 0 W • [1:2] T . 1 0 T M . . 8.192 MHz M crystal oscillator for use. WW O M OMHz W.1– Selects C . C . Y W • [2:3] – Selects 8.192 canned oscillator for use. <Default> W 0 Y W TW . W 0 0 W T . 1 0 T M . . .1 O W M OM Note: J15, J16,C J17, J19 are effected by this jumper configuration. W C . W . Y W W 0 Y W TW . W 0 0 W T . 1 0 T M . . W 3.2.2W.1External Oscillator OM Enables .CO .TW OM W C . Y W W 0 Y W 0 WDepending.on10the0configurationM of [J14] be .T the enable jumpers which must 1populated M . .TW O W M O change. W C . O W .C enable.Tjumpers. W C W J14 must beW 0Y YOscillator TW . W 0 W • [J15, J16] – Crystal in [pin 1:2] .10 0 T M . .1J17 must be inO[pinM2:3] configuration. W M configuration, W .CO .T O W C . Y W C W 0 Y W •W [J17] – Canned Oscillator jumper. .T J14 must be in [pin 2:3] configuration. 00 enable M M .10 .TW O W <Default>W.1 M O C . O .C W YPrototyping WW .100Y . W 0 Y.C WWCoupling T . 0 T M 3.2.3 Pad Pins . 1 M . O W M O Wmeant to beYused .C O W .C for prototyping Y Ware C The [J9] pins custom user coupling pads. W . 0 W W 0 0 Y W T . 0 M .1 Prototypes can be added while a coupling pad populates [J7, J11] M .10 to the [J9] pins O W M.T O W C . O allowing for dual while W functionality .C Y.Ctesting. .TW WW .100Y W 0 Y W 0 0 T . 0 M .1 W M FIGURE 3-2: PROTOTYPING PINS O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WConnectors W Y.C WW .100Y WW 00Y.CO .T3.2.4 W CouplingWPad 0 T . 0 M .1 (2) demonstration W M The BodyCom DevelopmentWKitW .1 O O W includes coupling pads for use with W C . C W . Y W W 00 0pad top traceM Y W the coupling Ttouch sensing pin on . theW Base board. [J7] connects to the 1 0 0 T . . 1 0 . M the device. [J11] connects theWcoupling .1 O to the signal pin [TX/RX] of WW trace W pad bottom O W C . C W [J12, J13] DO W . Y the board. be0 connected at these points. W Custom coupling Wpads can also T . 10 0 WW .100Y T . . 1 M . NOT connect to anything on the coupling pad. They are used for stability only; they DO W M O NOT connect to GND rail. WW W W .CO .TW C . Y W W W 0 Y W 0 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 32 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W Kit Hardware OM BodyCom Development W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y 3.2.5 Base Board Demo Functionality Jumpers W W 0 Y W TW . W 0 0 W T . 1 0 M . M O Wboard functionality jumpers on [J8] are used to enable/disable demo or to be used O W.1 The C . W C . Y W to breakout connections to prototype designs. All jumpers must be populated for use W 0 Y W TofW . 0 0 W T . 1 0 TW M . demo application. M O W O W.1 the C . W C . Y W • [1:2] -0 Top], [J7]. Wis used for TouchWdetection on.[J9 Y– Touch Enable:.TRC2 TW . 0 0 W 1 0 TW M – MOD_OUT: LC W circuit for LF Driver circuit O OMRC3 pin is used to control halfW W.1• [3:4] C . C . Y via on-chip DSM. W W 0 Y W TW . W 0 0 W T . 1 0 T M . . half W of LC circuit for LF Driver [5:6] – MOD_OUT:M O M O RA2 pin is used to control other W W.• 1via C . C inverted DSM signal. . Y W W to SW_DETW 0push buttons. M.TW Y RA1 is .connected W 0 0 W T 1 0 T . • [7:8] – SW_DET: signal and used for . .1 to [J9 <2:3>]. O W M OM WRefer C . W C . Y W Wthe receive circuit. 0 Y WRequired for.1receiving TW . W 0 0 W • [9:10] T . – Enable_RX: RC7 controls 0 T M . M .1 W W communication. CO .CO .TW OM W . Y W W 0 Y W 0 Select M.T W 3.2.6 .10Input 10 M . .TW O W M O W C . O W .C C W button detectionWpin. 0Y Y TW . By altering [J19] configuration of the push W 0 0 WW T . 1 0 T M . . M .1 W M O • [1:2]W – Configures push button detection on Pin RA1. <Default> .CO .T O W C . Y W C W 0 Y W W• [2:3] – Configures button detection OSCO, .T on Pin RA4. RA4 is used forW 10 thus OM 00forpush . .TW 1 M . M cannot be used push button detection when using the crystal oscillator O .C O W Y WW 00Y.C W 0 configuration. W . W 0 Y.C W T . 1 M . .T 1 M . O W M O .C O W 3.2.7 WW Bootloader MCP2200 .C Functionality Y C W . 0 Y W W 0 0 Y W T 0 M .1All 10are used to enable/disable The jumpers on .[J5] M. bootloader functionalityWsupport. O W M.T O W C . O jumpersW must be populated W .C 0Y Yfor.Cuse of GUI .orTbootloader. W W 0 0 Y W 1 0 0 T . . 0 • [1:2] – USART_TX: MCP2200 TX pin; RC5 is the alternative .1 Connects RC5OtoM WRX M W .CO O W C pin for on-chip USART. . Y W C W . 0 Y W 0 Y W .T RX pin; RC6 is the alternativeW 00 RC6 to MCP2200 .TW • [3:4] – USART_RX:.1 Connects TX.1 M 100 M O W .CO O W pin for on-chip USART. C . Y W C W . 0 Y W .TMCP2200 RTS (Request to Send)W.10 00 RA3[MCLR] to USART_RTS: .Connects .TW • [5:6] – W 1 00Y M 1 M . W pinO on demo. pin; RA3 is used a software MCLR.C .C O W W Y W C W . 0 Y W W 0 0 Y W T • [7:8] – USART_CTS: Connects . CTS (Clear to Send) pin; RC7 isW.1 .T 10 RC7 to MCP2200 00 M . 1 M . O a GPIO. W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 3.2.8 Power Supply 10 00 Select M . 1 W M . O W CBodyCom Development W Board willWuse.W .100Y Y.the WW 00Y.CO .TWThis jumper selects which power supply 0 WW T . 0 1 supply asO M .power W M .1 • [1:2] – Selects +9V external power source. W O W W C . W C W . Y W W W • [2:3] – Selects +5V 00 0 source. <Default> Y WUSB cable.as10power T . 1 0 T . . 0 M W M 3.2.9 Touch indicator .1 O W O W W C . LED enable W C W . Y W W 0 W .T pin RA0. This LED is 10 0green WW .100Y . .TPopulating 1 M . W [J18] enables the use of the LED (D4) through M O W W .CO LED. .TW WW or as00a Y C meant to assist in system debugging functional . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 33 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM FEATURES W. UNITYHARDWARE C . W C . Y W 3.3 MOBILE W 0 W TW . W 0 0 W T . 1 0 M . O key features of the BodyCom Mobile Unit are listedW below. They are.C represented OM W.1The W C . Y W W1.4 “DevelopmentWBoard Features” in the0order 0and Figure 1-4.M.TW Y given in Section 0 W T . 1 0 TW . 1 O W OM W.3.3.1 C . W Battery Clip C . Y W W 0 Y W TW . 0 0 W T . 1 0 TW M . battery The battery M surface mount 2032 coin cell W .1BK-912 is a lowOheight Oclip Wholder. WThe C . C supplies a reliable connection while fitting to most key fob size standards. . Y W W 0 Y W TW . W 0 0 W T . 1 0 T M . . O W M OM 3.3.2 W.1 LEDYIndicators C . W C . Y W W on the Mobile W 0(D2) is con- M.TW W 0 0 W There .are T . 1 0 T (2) LED indicators populated unit. The green LED . . M O W LEDs areYused M O W 1to pin RB7. C nected The red LED (D1) is connected to pin RB6. These . W C . W W useful when debugging 0unit com- M.TW Y and are extremely W the Mobile W 0 application 0 W in the demo T . 1 0 T . . W munication W.1system.Y.COM W .CO .TW OM W Y W 0 W W3.3.3 ICSP .T 10 00Programming M . Pads .TW 1 M . O W M O W C . O W .CMobile unit.T Y W C Programming Pads0on make Wupdating the firmware 0with Ythe W or prototyping TW . W 0 W 1 0 T M . . custom firmware the W pads for quick M pins can easily be soldered toW .1 relatively easy.OHead M W .CO .T O C programming during prototyping. Header pins can also be pressed against these pads . Y W C W 0 Y W .T re-programming. 10 00allowing for non-intrusive toW create a connection M . .TW 1 M . O W M O W C . O W Y.C WW .100Y 3.3.4 . W 0 Y.C WWHex Inverter T . 0 T M . 1 M . O W M O The Texas Instruments SN74LVC04APWR inverter is used for the LCW Driver circuit .C O .ofCoperatingHex Y WW C W . 0 Y W W on the Mobile device. Capable from 1.65 to 3.6V, the circuit is controlled 0 0 Y W T 0 M .1 M. counts and circuit complexity. .1This0 minimizes O O W using a single GPIO. component M.T W C . O .C W W .C YFront-End WW .100Y W 0 Y W T . 0 0 T 3.3.5 MCP2035 Analog (AFE) Device . 0 M .1 W M O W .CO O W C . Y W C Refer to 3.1.8. W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W 18-Pin Y 3.3.6 PIC16LF1827 Flash MCU with XLP Technology .CO O W C . Y W C W . 0 W 0 W 18-pin SSOP .T 00MCU with XLPM .TW The PIC16LF1827 1 00Y technology was selected for use withW.1 . 1 M . WThis deviceYcontains .C O W the BodyCom Mobile Unit. Internal Oscillator Block W with .COa 32 MHz Y W C W . 0 W W 0 0 Y W T . crystal. This device uses W.1 selectable power ranges 1 or0 can run from an external .T three 00 M . 1 M . O W extremely low active currents of 75 A/MHz @ 1.8V and up to 30 nA @1.8V during W O W .Cperipheral .features Y. Wa large list of0internal C W . 0 Y W Sleep, while supporting such as, 10-bit ADC, W 0 0 Y W T .1 .T 5-bit DAC, (2) comparators, W 1EUSART and O 00 M . 1 DSM, more. W M . C W Y.Pad WW .100Y WW 00Y.CO .T3.3.7 W Mobile Module 0 WW and Coupling T . 0 M .1 W M .1 O W O W W C . W C The BodyCom Mobile Unit has been designed so that a Mobile module, which contains W . Y W W W 00 0form of a coupling Y W T In the BodyCom Kit . 1 0 0 T . . all circuitry, can be “sandwiched” with any pad. 1 0 M . W M design, the coupling pad hasW .1 O O W W the W battery clip attached to a supply power [TP2 – +3.3V, C . C W . Y W .T for expanding TP3 GND] along with aW single signal connector 10 00 [TP1]. ThisMallows WW .100Y T–W . .Mobile 1 . W M unit designs. O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . Key Fob Casing 1 0 3.3.8 M . 1 W M . O W O Mobile unit is contained insideWthe key fob FB-20Yseries W W .C from PolyCase W W with a sinW 0 W T . 0 WW .100Y.C The T . option. The case has had veryW Mto it in order to bet.1 modificationsO gle small made W Mbutton O W W C . W C ter accommodate the battery clip and over all stability of the Coupling Pad inside the W . W .T of case 00Y a largeMnumber WW .100Y case.MBodyCom .TW Technology canW be made to accommodate 1 . W O W and design. O W solutions depending on the applicationW approach W C . C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 34 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W DEVELOPMENT TW BodyCom™ KIT . W 0 0 W T . 1 0 M . OGUIDE W USER’S W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W Schematics TW . 0 0 W T Appendix A. Development Kit . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . 1 following schematic appendix: M diagrams are included in thisW O W M O W.The C . C . Y W • Figure0A-1: W Development Y Schematic for.TBodyCom WBoard .100 TW . W W 0 T M . Mfor BodyCom Module .1 A-2: Schematic • Figure O W M O W C . W C . Y W A-3: W Capacitive Pad 0 YSchematic for BodyCom W TW . W 0 0 W • Figure T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 35 J9 J11 2 1 4 2 J7 TOUCH J10 Cap_OUT GND GND Y3 R13 D6 BAS40-05 7W-8.192MMB-T OUT VCC 3.3V 8.192MHz C13 18PF NC/OE GND Cap_PAD 2 1 8.192MHz D5 GND BAS40-04 GND 3.3V C12 18PF 1 3 4 1 2 1 3 4 3 2 DNP J16 3.3V C41 RB7 2 3 OSCO 1 OSCI 3.3V OSCI 10 RB7 GND 9 8 RC7 RC6 7 6 RC4 RC3 5 RC5 MCLR_VPP 4 J17 0.1uF 1K5 MCLR_VPP 3 4 1K5 R7 R4 OSCO S2 Y2 R11 OSCI 2PHDR-100MIL J15 S1 3.3V 3.3V RB7/TX/CK RC7/AN9/SDO RC6/AN8/SS 2 GND 1K5 R12 RC7 J8 J19 3PHDR 9 7 5 RA2 RA1_PGC 3 7 RC7 RC3 5 MCLR_VPP 1 3 RC6 RC2 1 RC5 J5 U4 3 1 10 8 6 4 2 VSS 8 6 4 2 4.7K R39 SW_DET OSCO Enable_RX SW_DET MOD_OUT_N MOD_OUT TOUCH USART_CTS USART_RTS USART_RX USART_TX RB6/SCK/SCL RB5/AN11/RX/DT RB4/AN10/SDI/SDA RC2/AN6/C12IN2-/P1D RC1/AN5/C12IN1- RC0/AN4/C2IN+ RA2/AN2/T0CKI/C1OUT RA1/AN1/C12IN0-/PGC RA0/AN0/C1IN+/PGD PIC16F1829-I/SS RC3/AN7/C12IN3-/P1C RC4/C2OUT/P1B RC5/CCP1/P1A RA3/MCLR RA4/AN3/T1G RA5/OSC1 Vdd 3K OSCI SW-B3F1000 0.1uF R10 4.7K 3 3K SW-B3F1000 HDR2X5 R38 S3 HDR2X4 SW-B3F1000 OSCO RC0 RC0 RC1 RC2 SDA_LCD 15 14 13 11 SCL_LCD RB5 RB7 RA2 17 16 RB5 RA1_PGC 18 12 RA0_PGD 19 20 13 11 9 7 5 3 1 17 3 1 4 2 J12 27 25 23 21 SDA_LCD 19 RB5 SCL_LCD 15 RB7 RC6 RC7 3.3V 1K5 R3 GND 27 25 23 21 19 17 15 13 11 9 7 5 3 1 J6 RB5 MCLR_VPP RC5 RC4 RC3 6 8 10 12 28 26 24 22 20 18 16 3 1 GND RC2 RC1 RC0 RA2 4 2 J13 +5V RC0 RA1_PGC RA0_PGD OSCO 4 14 OSCI 2 GND 28 26 24 22 20 18 16 14 12 10 8 6 4 2 R5 3K 3.3V R6 3K T1G ICSPCLK ICSPDAT GND Vdd Vpp J4 RA1_PGC RA0_PGD MCLR_VPP 3.3V 1uF 2PHDR GND R8 470 Ohm 1uF C15 C14 3.3V J18 RA0_PGD 6 5 4 3 2 1 PICkit™ 3 Green 1 S4 2 SW-B3F1000 MIXER_CLK HDR2X14O/E J14 D4 DS41649B-page 36 3.3V 3 SDA_LCD GND 2 SCL_LCD 10 9 8 7 6 5 4 1 K A C1- C1+ VOUT VDD VSS SDA SCL RST LCD1 LCD_NHD-C0216CIZ R9 RST_LCD GND 4.7K C39 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O W O W. BodyCom C . W C . FIGURE A-1: DEVELOPMENT BOARD (1 OF 3) Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. 3 4 3 4 J13_4 2 1 2 J11_4 1 4 3 4 3 J12_4 2 1 2 J7_4 1 4 J13_3 2 4 3 3 2 J11_3 2 OSC2 C1 18PF GND 1 D1 BAS40-05 USART_RTS GND 3 Y1 4 12MHz 1 1 4 3 4 3 C2 18PF OSC1 1 J7_3 2 1 2 J12_3 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W KitY.Schematics Development OM W. C W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 . O W OM WA-2: C . W C . FIGURE BodyCom DEVELOPMENT BOARD (2 OF 3) Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M R2 470 Ohm 3.3V C8 1uF 2 Vout GND C7 1uF 0.1uF +5V C6 Vout 2 U2 D2 +9V 3 Vin MCP1703T-5002E/MB GND GND 3 CONN_USB_MINI_B 1 GND PWR_CON_PJ-002B-SMT Shield J3 2 GND BAS40-05 4 3 Vin 3 VBUS +5V USART_TX nRST OSC2 nRST GND D- D+ 6 D- U3 MCP1703T-3302E/MB MCP22XX-I_SS TX 10 GP3 GP4 8 9 GP5 GP7/TxLED GP6/RxLED 7 6 5 OSC2 RST 4 3 GND RTS 11 RTS USART_CTS USART_RX 12 13 CTS GP2 RX 14 15 GP1/ULOAD GP0/SSPND 16 D- 17 D- Vusb D+ 18 20 19 D+ OSC1 2 1 OSC1 C4 0.1uF R1 10K C3 1uF 4.7uF D+ 5 C10 2 0.33uF 1 VSS C9 GND J2 3.3V 1 VBUS 2 1 Vdd U1 3PHDR-1 3 VBUS 4.7uF 3.3V C11 3.3V VSS 1 Vss RED C5 J1 D3 3.3V GND 0.33uF 2012 Microchip Technology Inc. DS41649B-page 37 GND C18 0.1uF 0.1uF +5V GND Enable_RX O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O W O W. BodyCom C . W C . FIGURE A-3: DEVELOPMENT BOARD (3 OF 3) Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M C28 GND RF AMPLIFIER & MIXER Q1 PUMD13 +5V 1nF C27 GND 10nF C33 100pF 1nF 10K C32 R23 RF_IN 4.7uH L1 3K 1nF 470pF Enable_RX 68K R33 SA612AD GND GND C36 R35 Q6 U7 GND 3 INB 1 INA 2 8 C34 GND 100R C22 0.1uF 4K7 BC850BLT1 4 OUTA 8 VCC OUTB MIXER_CLK 2 39K R19 39K 10K Cap_PAD GND 39pF 10K R27 C38 C23 NA GND R21 R34 L2 2 MOD_OUT 4 1 LC FILTER PMGD280UN,115 1R 4K7 R28 5 2 R30 3 6 R24 100k C26 39pF U5B R16 7 GND Q5A MCP602-I_ST 6 1.5K R17 B 6 1.5K GND 5 C37 GND 1 +5V 620pF C20 0.1uF 2.2mH B82442T1225K050 R14 3 4 GND 1nF 6 1 C35 7 GND OSC1 A OSC2 MCP602-I_ST 0.1uF 5 C31 1.2K R32 220pF 10K R22 C24 U5A GND Q4 BC850BLT1 R25 C25 1uF LF (125KHz) DRIVER GND GND BSS8402DW MOD_OUT_N GND Q5B PMGD280UN,115 4K7 4 1 R31 5 2 MOD_OUT RC0 GND 5 1R 3 6 R29 GND GND Q3 GND GND MOD_OUT_N +5V C30 0.1uF C29 0.1uF +5V U6 CS VSS 1 2 +5V 14 VSS LCCOM 13 GND 192Khz Filter & Demoudulator LCCOM LCX 11 12 NC LCX RSSI SCLK/ALERT 3 4 RB7 GND Q2 LCX GND NC 5 BSS8402DW 1.5K TSP-P60R38 0R R20 TP1 LCCOM 9 8 10 LCY LCZ VDD 6 7 VDD R15 RB5 GND RB5 10K 0.1uF 10K R36 LFDATA/CCLK/SDIO 10R MCP2035-I/ST R37 C21 10K 3 3.3V 4 R18 C19 R26 DS41649B-page 38 2012 Microchip Technology Inc. J1 2012 Microchip Technology Inc. 6 5 4 3 2 1 Do Not Populate HDR-PICKIT2_SMT_PADS C5 GND 0.1uF +3.3V RSSI RA4_RB1 MCLR_VPP 15 16 19 20 1 2 3 4 17 18 GND RED_LED_PGC GND 8 RED GND D2 GREEN D1 GREEN_LED_PGD SN74LVC04PWLE GND 7 12 R4 1K GND VCC AY U1F 10 SN74LVC04PWLE U1E U1D SN74LVC04PWLE 6 SN74LVC04PWLE U1C 4 SN74LVC04PWLE U1B VDD_2 VDD C1 1nF R3 1K VCC 14 13 11 9 5 3 2 RA0/AN0/CPS0/C12IN0-/SDO2 RA1/AN1/CPS1/C12IN1-/*SS2 RA2/AN2/CPS2/C12IN2-/C12IN+/VREF-/DACOUT RA3/AN3/CPS3/C12IN3-/C1IN+/VREF+/C1OUT/CCP3/SRQ RA4/AN4/CPS4/C2OUT/T0CKI/CCP4/SRNQ RA5/*MCLR/VPP/*SS1 RA6/OSC2/CLKOUT/CLKR/P1D/P2B/SDO1 RA7/OSC1/CLKIN/P1C/CCP2/P2A RED_LED_PGC GREEN_LED_PGD MCLR_VPP LF_DATA +3.3V MOD_OUT 1 U1A LCX Q_ENABLE 4.7uH L1 R5 47K +3.3V C2 C4 56pF 0.1uF U3 R6 47K IRLML6302 Q1 PIC16F1827-I/SS TP1 GND vcc C6 0.1uF GND C3 0.1uF R2 10K nCS SCLK RSSI LF_DATA GND VSS CS U2 MCP2035-I/ST SCLK/ALERT RSSI NC LFDATA/CCLK/SDIO VDD VSS LCCOM NC LCX LCY LCZ VDD 14 13 12 11 10 9 8 VSS_2 VSS RB0/SRI/T1G/CCP1/P1A/INT/SRI/FLT0 RB1/AN11/CPS11/RX/DT/SDA1/SDI1 RB2/AN10/CPS10/MDMIN/TX/CK/RX/DT/SDA2/SDI2/SDO1 RB3/AN9/CPS9/MDOUT/CCP1/P1A/VCAP RB4/AN8/CPS8/SCL1/SCK1/MDCIN2 RB5/AN7/CPS7/P1B/TX/CK/SCL2/SCK2/*SS1 RB6/AN5/CPS5/T1CKI/T1OSI/P1C/CCP2/P2A/ICSPCLK RB7/AN6/CPS6/T1OSO/P1D/P2B/MDCIN1/ICSPDAT GND 1 2 3 4 5 6 7 R1 68 Ohm +3.3V 5 6 7 8 9 10 11 12 13 14 GND GND GND SCLK RA4_RB1 Q_ENABLE MOD_OUT LF_DATA nCS RED_LED_PGC GREEN_LED_PGD LCX GND +3.3V TP3 TP2 O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W KitY.Schematics Development OM W. C W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 . O W OM WA-4: C . W C . FIGURE BodyCom MODULE Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 39 GND TP3 BT1 BTH-BK-912 CU_GND R1 0R VCC TP2 TP1 Cap_PAD O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 W BodyCom™ Development Kit User’s Guide Y.CO OM W. W C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 M O W O W. BodyCom C . W C . FIGURE A-5: CAPACITIVE PAD Y W W 0 Y W TW . W 0 0 W T . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M DS41649B-page 40 2012 Microchip Technology Inc. O W W C . Y.C W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O Guide W Kit Y OM W. C . W BodyCom™ Development User’s C . W W 0 Y W TW . 0 0 W T . 1 0 M . 1 O W OM W. C . W C . Y W W 0 Y W TW . W 0 0 W T NOTES: . 1 0 M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . 0 0 W T . 1 0 TW M . O W W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . O W M W.1 Y.COM W C . W Y W 0 W TW . W 0 0 W T . 1 0 T M . . W W.1 Y.COM W .CO .TW OM W Y W 0 W W .T 10 00 M . .TW 1 M . O W M O W C . O W C W .TW W 00Y WW .100Y.C M.TW 1 T M . . W M O W .CO .T W C . Y W CO W 0 Y W W .T 10 00 M . .TW 1 M . O W M O W C . O WW .100Y . W Y.C WW .100Y.C M.TW T M . O W M O .C O W Y WW 00Y.C C W . 0 W W 0 Y W T 0 M .1 M. .1 O W M.T O W C . O W W .C Y.C WW .100Y W 0 Y W T . 0 0 T . 0 M .1 W M O W .CO O W C . Y W C W . 0 Y W Y W .T 10 00 . .TW 1 M . 100 W M O W .CO O W C . Y W C W . 0 Y W W .T 10 00 . .TW 1 00Y M . 1 W M . O W W Y.C WW 00Y.CO .TW C . 0 W W 0 Y W .1 .T 1 00 M . 1 W M . O W . O W W .C Y W C W . 0 Y W W 0 0 Y W T . .1 .T 10 00 M . 1 W M . O W WW .100Y WW 00Y.CO .TW WW .100Y.C M.TW W M .1 O W O W W C . W C W . Y W W W 00 0 Y W T . 1 0 0 T . . 1 0 M . W M .1 O W O W W C . W C W . Y W W .T 10 00 WW .100Y . .TW 1 M . W M O W W WW 00Y.CO .TW C . W W W Y W 0 W T .1 . 1 0 M . 1 W M . O W O W WW WW .100Y.C M.TW WW .100Y.C M.TW W O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . W M O W O W W C . W C W . W W .T 00Y WW .100Y .TW 1 M . M O W O W W C . W C W . Y W W W 0 Y W T . 0 0 W T .1 M. .10 OM W O W W C . W C W . Y W W 0 W T . 0 WW .100Y T .1 M. OM W O W C . W C W . Y W W 0 Y W T . 0 0 WW T . 1 0 M . 1 M 2012 Microchip Technology Inc. DS41649B-page 41