Download Safety Application Guide for Multilayer Ceramic Chip

2-4. Soldering conditions
2-4-1. Flux selection
P - 24
2-4-2. Flow soldering
P - 25, 26
2-4-3. Reflow soldering
P - 27 ~ 30
2-4-4. Soldering iron
P - 31
2-4-5. Soldering rework using a spot heater
P - 32, 33
2-5. Cleaning conditions
2-5-1. Cleaning of printed circuit board
P - 34
2-5-2. Cleaning solvent
P - 35
2-6. Caution for post mounting
2-6-1. Evaluation of strain in processes
P - 36, 37
2-6-2. Printed circuit board cropping
P - 38, 39
2-6-3. Mechanical shock
P - 40
2-6-4. Electrical test on printed circuit board
P - 41
Chapter 3 Caution during operation of equipment
P - 42
Chapter 4 Caution during transportation and storage
4-1. Caution during storage
P - 43
4-2. Caution during transportation
P - 44
P - 45, 46
Chapter 5 Safety standard
Chapter 6 Safety and environment
6-1. Abnormal overheating
P - 47
6-2. Disposal of capacitors
P - 47
Terms and definitions
1. Herein metric size code is expressed with letter “M” following the metric size code.
ex.) 1608M for 1608 metric
2. Herein capacitor types are expressed as follows:
class 1 : Temperature compensating capacitor (COG, NPO)
class 2 : High dielectric constant capacitor (X5R, X7R, Y5V)
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