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G3P-HAMP
User Manual
Release 1.02
12. ASSEMBLY
The modules allow a connector or smd assembly.
For a proper use some rules must respected:
1. If the module is assembled planar with the board, under the module any CS connection,
component, power or ground plane can be placed.
Under the module the board CS must be wide.
2. Over the module do not place LCDs or other modules that can act as a Faraday shield.
3. Place the module near the card border to allow the RF signal to exit outside with the
shortest distance possible.
4. If a wire antenna is used, weld the antenna (17cm @433MHz, 8cm @868MHz) directly
on the central point of the SMA holes.
The wire antenna can be turned if there is not enough space, will only be reduced the
maximum distance.
5. If the module is assembled in SMD mode, provide two holes under the module
corresponding to the antenna welding point and to the 32kHz oscillator.
This will guarantee a proper planar contact between the module and the customer PCB.
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