Download Intel SR1500

Intel® Server System SR1550AL
3.2.3
Cooling Subsystem
CPU / Memory / Low Profile PCI Zone
The CPU/memory/low profile PCI zone is the area between the low profile riser card of the riser
assembly and the right chassis wall. The air flow for this zone is generated by system fans FAN
#1 - #4 of the fan module. Air is drawn from the drive bay area, through the fans, directed
through the CPU air duct, and out through ventilation holes on both the back wall and rear side
wall of the chassis.
A CPU air duct is used to direct air flow through the processor heat sinks for both single and
dual processor configurations. For dual processor configurations, an air baffle attached to the
underside of the air duct is removed.
Note: The air baffle should ONLY be removed when a 2nd processor is installed. Operating a
single processor configuration with the air baffle removed may result in the processor over
heating and may cause the system to shutdown.
Figure 19. CPU Air Duct
Note: Once the air baffle is removed from the air duct, it cannot be re-attached.
Revision – 1.3
23
Intel order number D31982-006