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B. Chip Surface Treatment ............................................................................................................... 50
C. Fluorescent Assay Imaging ........................................................................................................... 51
D. Printing Methods ........................................................................................................................ 52
IX.
System Characterization ........................................................................................................... 55
A. Circuit Characterization Draft ..................................................................................................... 55
B. LEAC Chip Characterization ......................................................................................................... 57
X.
Conclusions and Recommendations for Future Work ............................................................. 63
Microfluidics ..................................................................................................................................... 63
Biomolecular Printing ....................................................................................................................... 64
Probe Station.................................................................................................................................... 65
LabVIEW Programming .................................................................................................................... 66
Multiplexing/Amplification Circuit ................................................................................................... 67
Probe Card........................................................................................................................................ 68
Team Management .......................................................................................................................... 69
XI.
Bibliography .............................................................................................................................. 71
XII.
Acknowledgements .................................................................................................................. 73
Appendix A - Project Management ...................................................................................................... 74
Appendix B - LEAC Chip Fabrication Flow ............................................................................................ 76
Appendix C - Microfluidics Fabrication Procedures ............................................................................. 77
A. Complete schematic with dimensions of the PDMS mask design .............................................. 77
B. Procedure for fabrication of an SU-8 mold ................................................................................. 77
Appendix D - Probe Station Usage Instructions ................................................................................... 78
LEAC chip layout and Probe Station Configurations to access waveguides..................................... 78
Configuration 1: Access WG 1,8,4,5 ............................................................................................. 79
Configuration 2: Access WG 3 and 7 ............................................................................................ 79
Configuration 3: Access WG 2 and 6 ............................................................................................ 80
Alignment Procedure ....................................................................................................................... 81
Appendix E - Probe Card Guide ............................................................................................................ 85
A. Probe card overview and considerations for specifications and ordering ................................. 85
B. Commonly used probe card parameters, terminology, and abbreviations ................................ 88
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