Download MPC106 PCI Bridge/Memory Controller Hardware Specifications

Freescale Semiconductor, Inc.
General Parameters
1.3 General Parameters
Freescale Semiconductor, Inc...
The following list provides a summary of the general parameters of the 106:
Technology
0.5 µm CMOS, four-layer metal
Die size
5.8 mm x 7.2 mm (41.8 mm2)
Transistor count
250,000
Logic design
Fully-static
Packages
Surface mount 304-lead C4 ceramic ball grid array (CBGA)
Power supply
3.3 V ± 5% V DC
Maximum input rating
5.0 V ± 10% V DC
1.4 Electrical and Thermal Characteristics
This section provides both the AC and DC electrical specifications and thermal characteristics for the 106.
1.4.1 DC Electrical Characteristics
The tables in this section describe the 106 DC electrical characteristics. Table 1 provides the absolute
maximum ratings. Functional and tested operating conditions are given in Table 2. Absolute maximum
ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses
beyond those listed may affect device reliability or cause it permanent damage.
Table 1. Absolute Maximum Ratings
Characteristic
Symbol
Value
Unit
Notes
Supply voltage
Vdd
–0.3 to 3.6
V
—
PLL supply voltage
AVdd
–0.3 to 3.6
V
—
Vin
–0.3 to 5.5
V
1
Tj
0 to 105
°C
2
Tstg
–55 to 150
°C
—
Input voltage
Junction temperature
Storage temperature range
Notes:
1
2
Caution: Vin must not exceed Vdd by more than 2.5 V at all times including during power-on reset.
The extended temperature parts have die junction temperature of -40 to 105°C. See MPC106ARXTGPNS/D for
more information.
Table 2 provides the recommended operating conditions for the 106. Proper device operation outside of
these recommended and tested conditions is not guaranteed.
MPC106 PCI Bridge/Memory Controller Hardware Specifications
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