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ADT Model 7100 Semi-Automatic Dicing System Operations Manual Tilted Spindle 9.2 Tilted Spindle This option enables the System to cut wafers at any angle that falls between 0 and 15 degrees by changing the orientation of the Spindle and the Microscope. Proximity sensors, controlled by the software, detect whether the Spindle and the Microscope are correctly positioned at the selected angle. Systems that include the Tilted Spindle option, are delivered pre-configured with all the settings necessary for cutting at both standard and tilted orientation. Figure 9-14: Tilted Spindle P/N 97100-9002-000-14 Ver 06/05 9.2-1
