MP 277 - Service, Support Download

Transcript
Installing and connecting the device
4.3 Connecting the HMI device
Configuration graphic
①
②
③
④
⑤
⑥
⑦
⑧
Chassis terminal on the HMI device, example
Equipotential bonding conductor cross-section: 4 mm2
Control cabinet
Equipotential bonding conductor cross-section: min. 16 mm2
Ground connection
Cable clip
Equipotential bonding rail
Parallel routing of the equipotential bonding conductor and data cable
NOTICE
Damage to the interface modules possible
Cable shielding is not suitable for equipotential bonding.
Use only the prescribed equipotential bonding conductors. The equipotential bonding
conductor ④ must have a minimum cross-section of 16 mm². The interface modules may
otherwise be damaged or destroyed.
MP 277
Operating Instructions, 07/2014, A5E02479740-02
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